H01L2221/00

CONTACTLESS READABLE PROGRAMMABLE TRANSPONDER TO MONITOR CHIP JOIN

A contactless readable programmable transponder to monitor chip join and method of use are disclosed. The method includes reading a frequency of an oscillator associated with a chip module. The method further includes correlating the frequency with a bond quality of the chip module.

Position detection systems and methods

A system for detecting a position of a dual solenoid device includes device configured to move between first and second positions, and a controller. The controller has first and second monitoring circuits in operable communication with first and second channels, respectively. The first and second channels are in operable communication with first and second solenoids, respectively. Each solenoid is configured to selectively operate as an active solenoid to move the device when the solenoid and its respective channel are in an active mode, and as a passive solenoid when the solenoid and its respective channel are in a passive mode to passively move with the active solenoid. Each of the monitoring circuits is configured to determine a position of the device when the channel the monitoring circuit is associated with is operating in the passive mode by monitoring an electrical parameter of the passive solenoid associated with that channel.

Glass-based antenna array package

The disclosure relates to a glass-based antenna array package. In an aspect, such a glass-based antenna array package includes a single glass substrate layer, one or more antennas attached to a first side of the glass substrate layer, at least one semiconductor device attached to a second side of the glass substrate layer, and a first photoimageable dielectric layer adhered to the second side of the glass substrate layer and encapsulating the at least one semiconductor device. A method of manufacturing the same is also disclosed.

SENSING STRUCTURE OF ALIGNMENT OF A PROBE FOR TESTING INTEGRATED CIRCUITS
20190204381 · 2019-07-04 · ·

A sensing structure is presented for use in testing integrated circuits on a substrate. The sensing structure includes a probe region corresponding to a conductive region for connecting to the integrated circuit. A first sensing region at least partially surrounds the probe region. A plurality of sensing elements connects in series such that a first of the plurality of sensing elements has two terminals respectively connected to the first sensing region and the probe region. And a second of the plurality of sensing elements has two terminals respectively connected to the probe region and a first reference potential.

Method for foreign object detection for an induction charging device and induction charging device
10326317 · 2019-06-18 · ·

A method for foreign object detection for an induction charging device is described, including an oscillator circuit, in particular, for a hand-held power tool, a resonance frequency and an associated actual quality of the oscillator circuit being detected and the actual quality is subsequently compared to a setpoint quality as a function of the resonance frequency and a decision is made about the presence of a foreign object based on a defined setpoint quality range. The method provides that an upper limit and/or a lower limit of the setpoint quality range and the profile of the actual quality are adapted to one another. Also described is an induction charging device including an oscillator circuit and a control and regulating unit for carrying out the method.

PLUG-THROUGH ENERGY MONITOR
20190170792 · 2019-06-06 ·

A sensor for inductively measuring the current in a conductor flowing through a recess in a printed circuit board. Wire loops on the printed circuit board function as the inductive current sensor. Combined with a voltage measurement, the energy being dissipated in the conductor's load circuit can be determined and transmitted wirelessly. Control circuits can be integrated with the metering hardware to enable the remote modulation of the load's power. The inductive sensor(s) can be used to track differences between the load's supply and return currents. If a fault is detected, the circuit can be broken for safety, serving a ground fault circuit interruption (GFCI) purpose. The claimed invention can report measurements in real time, providing time series data for analyses sufficient to detect or identify an anomaly in the function and operation within a system's load or electrical power distribution network.

Fingerprint sensor device and operation method thereof
10311279 · 2019-06-04 · ·

A fingerprint sensor device and an operation method thereof are provided. The fingerprint sensor device includes a driving electrode, a driving circuit, a fingerprint sensing plate, a reading circuit and a determination circuit. The driving circuit applies a driving signal to an object through the driving electrode. The fingerprint sensing plate has sensing electrodes configured to sense the object. The reading circuit reads the driving signal through the fingerprint sensing plate. During a period between a rising edge time point and its adjacent falling edge time point of the driving signal, the reading circuit respectively samples the driving signal in at least two different phases to obtain at least two sampling results and outputs a difference value of the at least two sampling results. The determination circuit checks the difference value to determine whether the object to be sensed is a real finger or a fake finger.

Device and method to define and identify absolute mechanical position for a rotating element

The various embodiment of the present disclosure provides a system to define and identify an absolute mechanical reference position for a rotating element, The system comprises a radial ring magnet comprising plurality of pole pairs mounted to the rotating element, a first magnetic sensor in proximity of the radial ring magnet to detect angular position of said rotating element, at least one second magnetic sensor in proximity of the radial ring magnet to detect the passage of each of the pole pair and a control module adapted to define said absolute mechanical position by computing a unique first set of feature values for each of said plurality of pole pairs based on responses of said first magnetic sensor and said second magnetic sensor. The first set of feature values is stored in a memory unit.

Method and device for testing wafers

Circuits and methods for testing wafers are disclosed herein. An embodiment of a method includes electrically contacting a first probe and a second probe to a wafer. A gas is blown in the areas proximate the first probe and the second probe. An electric potential is then applied between the first probe and the second probe while the gas is being blown.

Probe card having replaceable probe module and assembling method and probe module replacing method of the same
10281488 · 2019-05-07 · ·

A probe card includes a substrate module having an installation hole and a first stair-shaped structure provided on two stairs thereof with a first connection surface and a first transmission surface having a first contact pad, a probe module having a probe and a second stair-shaped structure provided on two stairs thereof with a second connection surface and a second transmission surface having a second contact pad electrically connected with the probe, and a pressing member. The probe module is disposed in the installation hole so that the first and second connection surfaces are connected and the first and second transmission surfaces are opposite. The pressing member is detachably pressed on the probe module to press the second connection surface against the first connection surface and make the first and second contact pads electrically connected.