A gate driver is described that includes a gate signal module configured to output a gate signal of the gate driver for driving a gate terminal of a semiconductor device. The gate driver further includes a test module configured to generate a simulated failure condition at a semiconductor device during a test of a monitoring and protection feature of the gate driver. The gate drier further includes a monitor module configured to output an indication of the simulated failure condition in response to detecting the simulated failure condition at the semiconductor device.

A wafer processing laminate including a support, a temporary adhesive material layer formed on the support, and a wafer, having a circuit-forming front surface and back surface to be processed, laminated on the temporary adhesive material layer, in which the temporary adhesive material layer is composed of a complex temporary adhesive material layer having a three-layered structure including a first temporary adhesive layer composed of a thermoplastic organopolysiloxane polymer layer releasably adhering to the front surface of the wafer, second temporary adhesive layer composed of thermosetting siloxane-modified polymer layer releasably laminated on the first temporary adhesive layer, and third temporary adhesive layer composed of thermosetting siloxane polymer layer releasably laminated on the second temporary adhesive layer and releasably adhering to the support. A temporary adhesive material for a wafer processing facilitates temporary adhesion and separation, and allows separation even when a thin wafer is cut before separation.

A system for detecting a position of a dual solenoid device includes device configured to move between first and second positions, and a controller. The controller has first and second monitoring circuits in operable communication with first and second channels, respectively. The first and second channels are in operable communication with first and second solenoids, respectively. Each solenoid is configured to selectively operate as an active solenoid to move the device when the solenoid and its respective channel are in an active mode, and as a passive solenoid when the solenoid and its respective channel are in a passive mode to passively move with the active solenoid. Each of the monitoring circuits is configured to determine a position of the device when the channel the monitoring circuit is associated with is operating in the passive mode by monitoring an electrical parameter of the passive solenoid associated with that channel.

A test assembly adapted to test a semiconductor device is provided. The test assembly includes a main circuit board, a space transformer, an intermediary supporting element, an adhesive element, a plurality of electrical connection elements and a plurality of test probes. The space transformer is disposed on the main circuit board and has a first surface and a second surface opposite to the first surface. The first surface faces the main circuit board. The intermediary supporting element is disposed between the main circuit board and the first surface. The adhesive element is disposed between the intermediary supporting element and the first surface. The space transformer is attached to the intermediary supporting element through the adhesive element. The electrical connection elements are disposed between the main circuit board and the first surface. Each of the electrical connection elements passes through the intermediary supporting element and the adhesive element such that the space transformer is electrically connected to the main circuit board through the electrical connection elements. The test probes are disposed on the second surface and electrically connected to the space transformer.

A probe unit according to the present invention is suitable for allowing a large current to flow. In the probe unit that accommodates a plurality of contact probes for electrically connecting an inspection target object and a signal processing device used to output an inspection signal, both ends of a large current probe (3) are electrically connected to electrodes of a contact target object, and a large current is made to flow via a metal block (50) that comes into contact with both end portions of the large current probe (3).

A test structure includes a dedicated addressing circuit that allows large numbers of test devices to be tested simultaneously and the measurement signals read out serially for different test devices. The test structure may be configured for wafer, die or package-level testing. The test structure may be integrated on a common die with the test devices in a single package, provided on separate die in a common package, separately packaged chips or in the form of a collection of standard die configured as the test structure. If on separate die, the test and addressing circuitry is fabricated from a more mature fabrication process than that being characterized for the devices under test. The processes being characterized may be unqualified whereas the test circuitry may be fabricated with different and more mature or qualified processes.

A position sensor connected to first and second electric signal sources to output a first electric signal with a first frequency and a second electric signal with a second frequency. The position sensor includes: a primary coil generating a magnetic alternating field with the first frequency; a first and a second secondary coil, the first and second secondary coils each magnetically coupled to the primary coil by the position transmitter, and third and fourth electric signals induced in the first and second secondary coils respectively by the generated magnetic alternating field; a frequency converter converts the third and fourth electric signals into respective first and second intermediate frequency signals, the frequency converter connectable to the second electric signal source. A Goertzel filter bank demodulates the first intermediate frequency signal to obtain a first demodulated signal and demodulates the second intermediate frequency signal to obtain a second demodulated signal.

A probe device of a vertical probe card is provided and includes a die assembly and at least one pin assembly. The die assembly includes a first die, a second die, and a middle die disposed between the first die and the second die. The at least one pin assembly has a first pin, a second pin, and at least one electrical connector. The at least one electrical connector is connected to the first pin and the second pin. The at least one pin assembly is electrically contacted with at least one contact pad of a device under test. The at least one contact pad leans against the at least one pin assembly, so that the at least one pin assembly generates a deformation in a longitudinal direction.

A testing method for a micro electro-mechanical system is described, comprising the steps of: i) feeding a system to be tested on a first tray; ii) collecting the system from the first tray; and iii) verifying correct operation of the system collected from the first tray; the method further comprises step iv) of acquiring at least one parameter associated with the presence or otherwise of the system on the first tray; and/or with the fact that the system matches or otherwise a correct identification code; and/or with correct or incorrect orientation and/or position of the system on the first tray; step iv) being performed prior to step ii).

Embodiments of the disclosure relate to deposition of a conformal organic material over a feature formed in a photoresist or a hardmask, to decrease the critical dimensions and line edge roughness. In various embodiments, an ultra-conformal carbon-based material is deposited over features formed in a high-resolution photoresist. The conformal organic layer formed over the photoresist thus reduces both the critical dimensions and the line edge roughness of the features.