In an example embodiment, an azimuth combiner comprises: a septum layer comprising a plurality of septum dividers; first and second housing layers attached to first and second sides of the septum layer; a linear array of ports on a first end of the combiner; wherein the first and second housing layers each comprise waveguide H-plane T-junctions; wherein the waveguide T-junctions can be configured to perform power dividing/combining; and wherein the septum layer evenly bisects each port of the linear array of ports. A stack of such azimuth combiners can form a two dimensional planar array of ports to which can be added a horn aperture layer, and a grid layer, to form a dual-polarized, dual-BFN, dual-band antenna array.

In an example embodiment, an azimuth combiner comprises: a septum layer comprising a plurality of septum dividers; first and second housing layers attached to first and second sides of the septum layer; a linear array of ports on a first end of the combiner; wherein the first and second housing layers each comprise waveguide H-plane T-junctions; wherein the waveguide T-junctions can be configured to perform power dividing/combining; and wherein the septum layer evenly bisects each port of the linear array of ports. A stack of such azimuth combiners can form a two dimensional planar array of ports to which can be added a horn aperture layer, and a grid layer, to form a dual-polarized, dual-BFN, dual-band antenna array.

Aspects of the subject disclosure may include, for example, a coupling device includes a circuit that receives a signal. At least one passive electrical circuit element generates an electromagnetic field in response to the signal. A portion of the electromagnetic field is guided by a surface of a transmission medium to propagate as a guided electromagnetic wave longitudinally along the transmission medium. Other embodiments are disclosed.

Systems and method are provided for implementing filters whose response automatically and continuously reconfigures between an all-pass response and a bandstop response as the power level of signals within their bandwidth changes. Embodiments of the present disclosure allow high power signals within a designable bandwidth to be strongly attenuated while minimally affecting signals in adjacent bandwidths and further allow low power signals in the designable bandwidth to pass with minimal attenuation.

A 2-bit high-power amplifying non-reciprocal reflective metasurface is provided. The metasurface comprises a plurality of metasurface units distributed in an array; each metasurface unit comprises a first metal layer, an intermediate layer, and a second metal layer which are sequentially stacked; the second metal layer comprises a receiving metal patch and a transmitting metal patch; two diodes are both positioned on a longitudinal central axis of the receiving metal patch; orientation of the slot on the transmitting metal patch is orthogonal to orientation of the slot on the receiving metal patch; the first metal layer comprises a phase shifter, which comprises first series diodes and second series diodes forming a reconfigurable 90-degree phase-shift circuit.

An on-chip dual-mode transmission line with an spoof surface plasmon based on a balun includes a dual-mode transmission line located in the intermediate, the balun structures symmetrically located at both terminals of the dual-mode transmission line, and pad structures and excitation portions located outside the balun structures. The dual-mode transmission line comprises two metal strip lines that are the same in structure and parallel to each other, and the branches located between the two metal strip lines. The dual-mode transmission line can simultaneously support the transmissions of the odd-mode spoof surface plasmon signal and the even-mode spoof surface plasmon signal, and is not only suitable for III-V chips such as gallium arsenide and silicon nitride, but also suitable for technologies such as other chips and printed circuit boards.

An on-chip dual-mode transmission line with an spoof surface plasmon based on a balun includes a dual-mode transmission line located in the intermediate, the balun structures symmetrically located at both terminals of the dual-mode transmission line, and pad structures and excitation portions located outside the balun structures. The dual-mode transmission line comprises two metal strip lines that are the same in structure and parallel to each other, and the branches located between the two metal strip lines. The dual-mode transmission line can simultaneously support the transmissions of the odd-mode spoof surface plasmon signal and the even-mode spoof surface plasmon signal, and is not only suitable for III-V chips such as gallium arsenide and silicon nitride, but also suitable for technologies such as other chips and printed circuit boards.

In an example embodiment, an azimuth combiner comprises: a septum layer comprising a plurality of septum dividers; first and second housing layers attached to first and second sides of the septum layer; a linear array of ports on a first end of the combiner; wherein the first and second housing layers each comprise waveguide H-plane T-junctions; wherein the waveguide T-junctions can be configured to perform power dividing/combining; and wherein the septum layer evenly bisects each port of the linear array of ports. A stack of such azimuth combiners can form a two dimensional planar array of ports to which can be added a horn aperture layer, and a grid layer, to form a dual-polarized, dual-BFN, dual-band antenna array.

In an example embodiment, an azimuth combiner comprises: a septum layer comprising a plurality of septum dividers; first and second housing layers attached to first and second sides of the septum layer; a linear array of ports on a first end of the combiner; wherein the first and second housing layers each comprise waveguide H-plane T-junctions; wherein the waveguide T-junctions can be configured to perform power dividing/combining; and wherein the septum layer evenly bisects each port of the linear array of ports. A stack of such azimuth combiners can form a two dimensional planar array of ports to which can be added a horn aperture layer, and a grid layer, to form a dual-polarized, dual-BFN, dual-band antenna array.

Aspects of the subject disclosure may include, for example, a coupling device includes a circuit that receives a signal. At least one passive electrical circuit element generates an electromagnetic field in response to the signal. A portion of the electromagnetic field is guided by a surface of a transmission medium to propagate as a guided electromagnetic wave longitudinally along the transmission medium. Other embodiments are disclosed.