Patent classifications
H01P1/00
MINIMIZING ATMOSPHERIC DISCHARGE ON A GUIDED SURFACE WAVEGUIDE PROBE
Disclosed are various embodiments for eliminating or minimizing atmospheric discharge within the guided surface waveguide probe. Atmospheric discharge can be minimized to a nominal amount according to one or more factors, such as, for example, the use of a corona hood, the effective diameter of the internal coil, the effective diameter of the tube, and the shape of the charge terminal.
SHEET-TYPE METAMATERIAL AND SHEET-TYPE LENS
A sheet-type metamaterial of a film configuration to exhibit a figure of merit (FOM) exceeding 300 in a terahertz wave band. A film-shaped dielectric substrate has a front surface on which a first wire array is formed, and a back surface on which a second wire array is formed. The first wire array includes elongated metallic first cut wires of a predetermined length l aligned in a y-axis direction with a gap g therebetween and in an x-axis direction with space s therebetween. The second wire array includes second metallic cut wires having the same shape as the first cut wires and aligned to overlap the first cut wires. With a thickness d of the dielectric substrate set at about 50 m, the length l of the first cut wire and the second cut wire is a length approximate to a value to generate resonance at a design frequency.
SHEET-TYPE METAMATERIAL AND SHEET-TYPE LENS
A sheet-type metamaterial of a film configuration to exhibit a figure of merit (FOM) exceeding 300 in a terahertz wave band. A film-shaped dielectric substrate has a front surface on which a first wire array is formed, and a back surface on which a second wire array is formed. The first wire array includes elongated metallic first cut wires of a predetermined length l aligned in a y-axis direction with a gap g therebetween and in an x-axis direction with space s therebetween. The second wire array includes second metallic cut wires having the same shape as the first cut wires and aligned to overlap the first cut wires. With a thickness d of the dielectric substrate set at about 50 m, the length l of the first cut wire and the second cut wire is a length approximate to a value to generate resonance at a design frequency.
Apparatus and methods for measuring signals
Aspects of the subject disclosure may include, a system that obtains a group of signals that are each representative of a corresponding one of a group of electromagnetic waves, analyzes the group of signals to determine signal characteristics, and determines, according to the signal characteristics, predicted characteristics for a communication signal that is to be transmitted by a circuit. Other embodiments are disclosed.
Optical modulator module
Disclosed is an optical modulator module including an optical modulator configured to have a signal electrode and a ground electrode; a conductive package configured to accommodate the optical modulator and have electrical continuity with the ground electrode of the optical modulator; a substrate configured to have a ground electrode on a first surface thereof electrically connected to the package by solder or a conductive adhesive and have a signal electrode on another surface thereof; and a lead pin configured to electrically connect the signal electrode of the optical modulator to the signal electrode of the substrate.
High-frequency module
An inductor component is disposed outside a multilayer substrate, and thus a directional coupler defined by an internal wiring electrode and a coil electrode within the inductor component that is mounted on a pair of land electrodes, the multilayer substrate significantly reduces or prevents interference with other high-frequency circuit elements disposed in or on the multilayer substrate. Additionally, if a plurality of inductor components having different inductor characteristics are prepared, a high-frequency module including the multilayer substrate capable of defining the directional coupler whose characteristics are able to adjusted with ease is able to be provided simply by selecting the desired inductor component from the inductor components and replacing that inductor component.
APPARATUS AND METHODS FOR MEASURING SIGNALS
Aspects of the subject disclosure may include, a system that obtains a group of signals that are each representative of a corresponding one of a group of electromagnetic waves, analyzes the group of signals to determine signal characteristics, and determines, according to the signal characteristics, predicted characteristics for a communication signal that is to be transmitted by a circuit. Other embodiments are disclosed.
WINCH WITH INTEGRATED LIGHTING, AND ASSOCIATED SYSTEMS AND METHODS
Winches with integrated lighting, and associated systems and methods are disclosed. A representative winch with integrated lighting can include a frame, a cable drum rotatably supported by the frame, a drive motor operatively connected to the cable drum, and an electrical module. The electrical module can include a housing with first and second end caps coupled to the housing. An elongate light guide can be mounted to the housing between the housing and the cable drum with one or more drum light sources connected to the elongate light guide.
MICROWAVE FILTER SYSTEM INCLUDING FEEDBACK STRUCTURE
Provided is a microwave filter system having a feedback structure. The microwave filter system may include an input hybrid coupler configured to output first output signals having a phase difference with respect to an input signal; filters disposed to be in parallel with an output end of the input hybrid coupler, and configured to filter the first output signals; and an output hybrid coupler configured to output second output signals having a phase difference with respect to each of signals filtered through the filters. An output signal of the output hybrid coupler is applied to an input end of the input hybrid coupler along a feedback path.
METHODS AND APPARATUS FOR ADAPTIVE GROUNDING AND NOISE MITIGATION IN MIXED-SIGNAL DEVICES
Methods and apparatus for providing adaptive grounding in mixed-signal electronic dies, circuits, modules, or other devices. In one example a module in which adaptive grounding is implemented includes a substrate having disposed thereon a plurality of signal contacts and a ground connection, and a mixed-signal die disposed on the substrate and including a signal section and a control section, the signal section having a plurality of radio frequency components each connected to a respective one of the plurality of signal contacts on the substrate by a corresponding signal connector, and the control section having at least two ground paths that selectively connect the control section to the ground connection on the substrate and which are physically spaced apart from one another, the mixed-signal die further including at least two switches, each operable to selectively connect one of the ground paths to the ground connection.