H01P1/00

Passive electrical coupling device and methods for use therewith

Aspects of the subject disclosure may include, for example, a coupling device includes a circuit that receives a signal. At least one passive electrical circuit element generates an electromagnetic field in response to the signal. A portion of the electromagnetic field is guided by a surface of a transmission medium to propagate as a guided electromagnetic wave longitudinally along the transmission medium. Other embodiments are disclosed.

Minimize radio frequency co-existence in products with light emitting diode displays by diverting surface current
10804584 · 2020-10-13 · ·

Systems, methods, and devices for diverting surface current on a display panel support plate are provided. An electronic transceiver device including a display panel may include a display back plate and a support plate, such that the support plate is disposed beneath the display back plate. The support plate may include an array of slots etched into the support plate, such that the array of slots may be used and positioned to divert an electromagnetic field on the support plate to redirect propagation of the surface current towards ground pins located on the display panel housing.

Minimize radio frequency co-existence in products with light emitting diode displays by diverting surface current
10804584 · 2020-10-13 · ·

Systems, methods, and devices for diverting surface current on a display panel support plate are provided. An electronic transceiver device including a display panel may include a display back plate and a support plate, such that the support plate is disposed beneath the display back plate. The support plate may include an array of slots etched into the support plate, such that the array of slots may be used and positioned to divert an electromagnetic field on the support plate to redirect propagation of the surface current towards ground pins located on the display panel housing.

MINIMIZE RADIO FREQUENCY CO-EXISTENCE IN PRODUCTS WITH LIGHT EMITTING DIODE DISPLAYS BY DIVERTING SURFACE CURRENT
20200303801 · 2020-09-24 ·

Systems, methods, and devices for diverting surface current on a display panel support plate are provided. An electronic transceiver device including a display panel may include a display back plate and a support plate, such that the support plate is disposed beneath the display back plate. The support plate may include an array of slots etched into the support plate, such that the array of slots may be used and positioned to divert an electromagnetic field on the support plate to redirect propagation of the surface current towards ground pins located on the display panel housing.

MINIMIZE RADIO FREQUENCY CO-EXISTENCE IN PRODUCTS WITH LIGHT EMITTING DIODE DISPLAYS BY DIVERTING SURFACE CURRENT
20200303801 · 2020-09-24 ·

Systems, methods, and devices for diverting surface current on a display panel support plate are provided. An electronic transceiver device including a display panel may include a display back plate and a support plate, such that the support plate is disposed beneath the display back plate. The support plate may include an array of slots etched into the support plate, such that the array of slots may be used and positioned to divert an electromagnetic field on the support plate to redirect propagation of the surface current towards ground pins located on the display panel housing.

CHIP-TO-CHIP INTERFACE USING MICROSTRIP CIRCUIT AND DIELECTRIC WAVEGUIDE

Disclosed is a chip-to-chip interface using a microstrip circuit and a dielectric waveguide. A board-to-board interconnection device, according to one embodiment of the present invention, comprises: a waveguide which has a metal cladding and transmits a signal from a transmitter-side board to a receiver-side board; and a microstrip circuit which is connected to the waveguide and has a microstrip-to-waveguide transition (MWT), wherein the microstrip circuit matches a microstrip line and the waveguide, adjusts the bandwidth of a predetermined first frequency band among the frequency bands of the signal, and provides same to the receiver.

CHIP-TO-CHIP INTERFACE USING MICROSTRIP CIRCUIT AND DIELECTRIC WAVEGUIDE

Disclosed is a chip-to-chip interface using a microstrip circuit and a dielectric waveguide. A board-to-board interconnection device, according to one embodiment of the present invention, comprises: a waveguide which has a metal cladding and transmits a signal from a transmitter-side board to a receiver-side board; and a microstrip circuit which is connected to the waveguide and has a microstrip-to-waveguide transition (MWT), wherein the microstrip circuit matches a microstrip line and the waveguide, adjusts the bandwidth of a predetermined first frequency band among the frequency bands of the signal, and provides same to the receiver.

CABLE AND CONNECTION DEVICE

A transmission device is enabled to satisfactorily detecting whether or not a reception device is in the operating state even in a case where an element that adjusts signal quality is interposed in a data line. A cable is connected between the transmission device and the reception device. The element that adjusts signal quality is interposed in the data line. A detection unit detects that the reception device is in the operating state. An information supply unit supplies detection information to the transmission device through a predetermined line.

CABLE AND CONNECTION DEVICE

A transmission device is enabled to satisfactorily detecting whether or not a reception device is in the operating state even in a case where an element that adjusts signal quality is interposed in a data line. A cable is connected between the transmission device and the reception device. The element that adjusts signal quality is interposed in the data line. A detection unit detects that the reception device is in the operating state. An information supply unit supplies detection information to the transmission device through a predetermined line.

Sheet-type metamaterial and sheet-type lens

A sheet-type metamaterial of a film configuration to exhibit a figure of merit (FOM) exceeding 300 in a terahertz wave band. A film-shaped dielectric substrate has a front surface on which a first wire array is formed, and a back surface on which a second wire array is formed. The first wire array includes elongated metallic first cut wires of a predetermined length l aligned in a y-axis direction with a gap g therebetween and in an x-axis direction with space s therebetween. The second wire array includes second metallic cut wires having the same shape as the first cut wires and aligned to overlap the first cut wires. With a thickness d of the dielectric substrate set at about 50 m, the length l of the first cut wire and the second cut wire is a length approximate to a value to generate resonance at a design frequency.