An electromagnetic wave radiator may include: a first metal layer; a plurality of metal side walls vertically protruding along an edge of the first metal layer; and a second metal layer suspended over the first metal layer. The second metal layer includes a plurality of ports radially extending from edges of the second metal layer and a plurality of slots penetrating the second metal layer in a radial direction.

An enhanced bandwidth interconnect circuit. In some embodiments the circuit includes a two-terminal device and a network for forming a connection to the two-terminal device. The network may include a first set of coupled transmission lines and a second set of coupled transmission lines. A second end of the first set of coupled transmission lines may be connected to a first end of the second set of coupled transmission lines, and a second end of the second set of coupled transmission lines may be connected to the two-terminal device.

An enhanced bandwidth interconnect circuit. In some embodiments the circuit includes a two-terminal device and a network for forming a connection to the two-terminal device. The network may include a first set of coupled transmission lines and a second set of coupled transmission lines. A second end of the first set of coupled transmission lines may be connected to a first end of the second set of coupled transmission lines, and a second end of the second set of coupled transmission lines may be connected to the two-terminal device.

An apparatus for detachably coupling with a printed circuit board to transfer electromagnetic waves. The apparatus includes a coupling element. The coupling element includes a first wave transmission structure configured to receive the electromagnetic waves from the printed circuit board and to transmit the electromagnetic waves along the first wave transmission structure. The apparatus further includes a vacuum channel structure including an inlet for coupling the apparatus to a vacuum generator to generate a vacuum between a first surface of the coupling element and a second surface of the printed circuit board such that a force between the coupling element and the printed circuit board is applied.

An apparatus for detachably coupling with a printed circuit board to transfer electromagnetic waves. The apparatus includes a coupling element. The coupling element includes a first wave transmission structure configured to receive the electromagnetic waves from the printed circuit board and to transmit the electromagnetic waves along the first wave transmission structure. The apparatus further includes a vacuum channel structure including an inlet for coupling the apparatus to a vacuum generator to generate a vacuum between a first surface of the coupling element and a second surface of the printed circuit board such that a force between the coupling element and the printed circuit board is applied.

A node of a radio frequency waveguide system can include a waveguide interface, a signal splitter, a power rectifier and conditioner, a communication filter, and a network processor. The waveguide interface is configured to communicate through a waveguide in the radio frequency waveguide system. The signal splitter is configured to split a radio frequency transmission received at the waveguide interface between a power path and a communications path within the node. The power rectifier and conditioner are configured to produce a conditioned power signal based on power received through the power path. The communication filter of the communications path is configured to produce a filtered communication signal. The network processor is powered by the conditioned power signal and configured to extract encoded information from the filtered communication signal.

A compact silicon waveguide mode converter, a dielectric meta-surface structure based on periodical oblique subwavelength perturbations, including a top silicon structure with oblique subwavelength perturbations etched in certain periods with period length of Λ, a duty cycle and an oblique angle θ on the SOI substrate. The invention adopts an all-dielectric meta-surface structure with oblique subwavelength perturbation, which can achieve a compact mode conversion from fundamental mode to arbitrary high-order mode of silicon waveguide, and can improve the optical communication capacity greatly.

An electromagnetic wave radiator may include: a first metal layer; a plurality of metal side walls vertically protruding along an edge of the first metal layer; and a second metal layer suspended over the first metal layer. The second metal layer includes a plurality of ports radially extending from edges of the second metal layer and a plurality of slots penetrating the second metal layer in a radial direction.

In a wireless communication apparatus including a communication coupler and a circuit, a first substrate and a second substrate face each other in a longitudinal direction of the communication coupler. The first substrate includes a first signal line, a second signal line, a third signal line, a distributor, and a terminating resistor. At the distributor, the first signal line branches into the second signal line and the third signal line. The second signal line is terminated at the terminating resistor at an end of the first substrate. The second substrate includes a fourth signal line. At least one of the third signal line or the connection signal line is configured such that a phase of a signal at the facing portion of the second signal line and a phase of a signal at the facing portion of the fourth signal line are continuous.

In a wireless communication apparatus including a communication coupler and a circuit, a first substrate and a second substrate face each other in a longitudinal direction of the communication coupler. The first substrate includes a first signal line, a second signal line, a third signal line, a distributor, and a terminating resistor. At the distributor, the first signal line branches into the second signal line and the third signal line. The second signal line is terminated at the terminating resistor at an end of the first substrate. The second substrate includes a fourth signal line. At least one of the third signal line or the connection signal line is configured such that a phase of a signal at the facing portion of the second signal line and a phase of a signal at the facing portion of the fourth signal line are continuous.