Aspects of the subject disclosure may include, for example, a system having a first plurality of transmitters for launching according to a signal, first electromagnetic waves, and a second plurality of transmitters for launching, according to the signal, second electromagnetic waves. The first electromagnetic waves and the second electromagnetic waves combine at an interface of a transmission medium to induce a propagation of a third electromagnetic wave, the third electromagnetic wave having a non-fundamental wave mode and a non-optical operating frequency, and wherein the second plurality of transmitters are spaced apart from the first plurality of transmitters in a direction of propagation of the third electromagnetic wave. Other embodiments are disclosed.

Aspects of the subject disclosure may include, for example, a system having a first plurality of transmitters for launching according to a signal, first electromagnetic waves, and a second plurality of transmitters for launching, according to the signal, second electromagnetic waves. The first electromagnetic waves and the second electromagnetic waves combine at an interface of a transmission medium to induce a propagation of a third electromagnetic wave, the third electromagnetic wave having a non-fundamental wave mode and a non-optical operating frequency, and wherein the second plurality of transmitters are spaced apart from the first plurality of transmitters in a direction of propagation of the third electromagnetic wave. Other embodiments are disclosed.

A contactless radio frequency (RF) probe. The RF probe includes a dielectric substrate, at least one waveguide comprising an electric field configured to increase the coupling between the dielectric substrate and the at least one waveguide, and an air gap separating the dielectric substrate and the at least one waveguide to prevent thermal loading, thermal expansion, and material deformity.

An electromagnetic waveguide component includes multiple planar layers and one or more layers are shaped to accommodate incoming electromagnetic waves. Each layer includes two more alignment features, and corresponding pins, the two or more alignment features in each of the layers providing precise stacking registration among the plurality of layers, and the planar layers, when assembled into a stack, are configured to provide a desired radio frequency (RF) response.

Microwave photonic devices use light to carry and process microwave signals over a photonic link. Light can be used as a stimulus to microwave devices that directly control microwave signals. Previous optically controlled devices suffer from large footprint, high optical power level required for switching, lack of scalability and complex integration requirements, restricting their implementation in practical microwave systems. Disclosed are monolithic optically reconfigurable integrated microwave switches (MORIMSs) built on a CMOS compatible silicon photonic chip. The disclosed scalable micrometer-scale switches provide higher switching efficiency and operate using optical power that is orders of magnitude lower than previous devices. The disclosed devices and techniques provide examples of silicon photonic platforms integrating microwave circuitry.

Microwave photonic devices use light to carry and process microwave signals over a photonic link. Light can be used as a stimulus to microwave devices that directly control microwave signals. Previous optically controlled devices suffer from large footprint, high optical power level required for switching, lack of scalability and complex integration requirements, restricting their implementation in practical microwave systems. Disclosed are monolithic optically reconfigurable integrated microwave switches (MORIMSs) built on a CMOS compatible silicon photonic chip. The disclosed scalable micrometer-scale switches provide higher switching efficiency and operate using optical power that is orders of magnitude lower than previous devices. The disclosed devices and techniques provide examples of silicon photonic platforms integrating microwave circuitry.

The present disclosure relates to a three-dimensional dielectric structure comprising at least one input and at least one output configured to transmit electromagnetic waves of at least one predetermined wavelength, a metamaterial between the at least one input and the at least one output comprising a substrate and objects with a predetermined dielectric characteristic different to the dielectric characteristic of the substrate, the objects being distributed in the substrate according to a spatially varying distribution function that depends on the wavelength. The disclosure further relates to a method of forming a three-dimensional dielectric structure.

The present disclosure relates to a three-dimensional dielectric structure comprising at least one input and at least one output configured to transmit electromagnetic waves of at least one predetermined wavelength, a metamaterial between the at least one input and the at least one output comprising a substrate and objects with a predetermined dielectric characteristic different to the dielectric characteristic of the substrate, the objects being distributed in the substrate according to a spatially varying distribution function that depends on the wavelength. The disclosure further relates to a method of forming a three-dimensional dielectric structure.

An enhanced bandwidth interconnect circuit. In some embodiments the circuit includes a two-terminal device and a network for forming a connection to the two-terminal device. The network may include a first set of coupled transmission lines and a second set of coupled transmission lines. A second end of the first set of coupled transmission lines may be connected to a first end of the second set of coupled transmission lines, and a second end of the second set of coupled transmission lines may be connected to the two-terminal device.

An enhanced bandwidth interconnect circuit. In some embodiments the circuit includes a two-terminal device and a network for forming a connection to the two-terminal device. The network may include a first set of coupled transmission lines and a second set of coupled transmission lines. A second end of the first set of coupled transmission lines may be connected to a first end of the second set of coupled transmission lines, and a second end of the second set of coupled transmission lines may be connected to the two-terminal device.