A surface wave generator is proposed. The generator may include a radiator configured to generate an electromagnetic field based on a signal externally applied. The generator may also include a first dielectric substrate on a top of the radiator and a second dielectric substrate on a bottom of the radiator. The generator may further include a first surface wave generation member on a bottom of the second dielectric substrate, a first geometric pattern being deposited on a top of the first surface wave generation member. The generator may further include a third dielectric substrate on a bottom of the first surface wave generation member. The generator may also include a second surface wave generation member between the third dielectric substrate and a metal surface, a second geometric pattern different from the first geometric pattern and being deposited on an upper surface of the second surface wave generation member.

A metal injection filter includes a resonator chamber body and a plurality of resonators. The resonator chamber body is an enclosure that forms a resonance chamber. The plurality of resonators are mounted in the resonance chamber. At least one resonator of the plurality of resonators is molded by a metal injection molding process.

Various examples are provided for global electrical power multiplication. In one example, a global power multiplier includes first and second guided surface waveguide probes separated by a distance equal to a quarter wavelength of a defined frequency and configured to launch synchronized guided surface waves along a surface of a lossy conducting medium at the defined frequency; and at least one excitation source configured to excite the first and second guided surface waveguide probes at the defined frequency, where the excitation of the second guided surface waveguide probe at the defined frequency is 90 degrees out of phase with respect to the excitation of the first guided surface waveguide probe. In another example, a method includes launching synchronized guided surface waves along a surface of a lossy conducting medium by exciting first and second guided surface waveguide probes to produce a traveling wave propagating along the surface.

Various examples are provided for global electrical power multiplication. In one example, a global power multiplier includes first and second guided surface waveguide probes separated by a distance equal to a quarter wavelength of a defined frequency and configured to launch synchronized guided surface waves along a surface of a lossy conducting medium at the defined frequency; and at least one excitation source configured to excite the first and second guided surface waveguide probes at the defined frequency, where the excitation of the second guided surface waveguide probe at the defined frequency is 90 degrees out of phase with respect to the excitation of the first guided surface waveguide probe. In another example, a method includes launching synchronized guided surface waves along a surface of a lossy conducting medium by exciting first and second guided surface waveguide probes to produce a traveling wave propagating along the surface.

A signal transmission device comprises: a first lead frame having a first major surface and a second major surface opposite to the first major surface; a second lead frame having a third major surface and a fourth major surface and isolated from the first lead frame, the fourth major surface located opposite to the third major surface; a transmission circuit that sends a transmission signal, the transmission circuit located on the first major surface of the first lead frame; a receiving circuit located on the third major surface of the second lead frame; and an electromagnetic resonance coupler located across between the second major surface of the first lead frame and the fourth major surface of the second lead frame to transmit the transmission signal, sent by the transmission circuit, to the receiving circuit in a contactless manner.

The invention is a compact three-port signal combiner suitable for use in a base station having two different wireless systems. The combiner is designed as a four-port network, but one of the ports is terminated with a predetermined load, thus leaving three ports for connection to user equipment. A first port (A) receives from an antenna a first input signal comprising first and second receive bands and transmits to the antenna a first output signal comprising a transmit band. A second port (R), connected to the first wireless system, outputs to the first wireless system a second output signal comprising the first and second receive bands. A third port (T\R) outputs, to the second wireless system, a third output signal comprising the first and second receive bands and receives from the second wireless system a second input signal that is to be transmitted from the first port.

A tunable metamaterial has a two dimensional array of resonant annular ring elements; and a plurality of voltage controllable electrical tuning elements disposed in or adjacent openings in each of said ring elements, each of said voltage controllable electrical tuning element ohmically contacting portions of only one of said ring elements. The voltage controllable electrical tuning elements may comprise highly doped semiconductor tunnel diodes, or the charge accumulation layer at the semiconductor/insulator interface of a metal-insulator-semiconductor structure, or nanoelectromechanical (NEMs) capacitors. The tunable metamaterial may be used, for example, in an optical beam steering device using the aforementioned tunable optical metamaterial in which a free-space optical beam is coupled into a receiving portion of a plane of the optical metamaterial and is steered out of a transmitter portion of the plane of the optical metamaterial in controllable azimuthal and elevational directions. The tunable metamaterial additionally has other applications.

Aspects comprise apparatus and methods for wirelessly powered lighting products. One aspect comprises an apparatus that generates light from a wirelessly coupled power source. The apparatus comprises a first conductive loop configured to enclose an area, the first conductive loop configured to resonate and generate an induced current when excited by a magnetic field generated by a transmitter. The apparatus further comprises a first set of one or more capacitive elements coupled to the first conductive loop, the coupled first conductive loop and first one or more capacitive elements configured to form a first resonant circuit. The apparatus also comprises a first set of one or more lighting devices integrated with the first conductive loop, the first set of one or more lighting devices each configured to generate a light based on the induced current that flows through the first set of one or more lighting devices.

A multiplexer includes a first circuit board, a second circuit board, and a third circuit board. The first circuit board includes a first metal layer, a first substrate layer, and a second metal layer sequentially stacked along a first direction. The second circuit board includes a third metal layer, a second substrate layer, and a fourth metal layer sequentially stacked along the first direction. The third circuit board includes a fifth metal layer, a third substrate layer, and a sixth metal layer sequentially stacked along the first direction. The second and third metal layer have same wiring structure, and the second metal layer connects to the third metal layer to form a first signal transmission path structure and a filter structure. The fourth and fifth metal layer have same wiring structure, and the fourth metal layer connects to the fifth metal layer to form a second signal transmission path structure.

A multiplexer includes a first circuit board, a second circuit board, and a third circuit board. The first circuit board includes a first metal layer, a first substrate layer, and a second metal layer sequentially stacked along a first direction. The second circuit board includes a third metal layer, a second substrate layer, and a fourth metal layer sequentially stacked along the first direction. The third circuit board includes a fifth metal layer, a third substrate layer, and a sixth metal layer sequentially stacked along the first direction. The second and third metal layer have same wiring structure, and the second metal layer connects to the third metal layer to form a first signal transmission path structure and a filter structure. The fourth and fifth metal layer have same wiring structure, and the fourth metal layer connects to the fifth metal layer to form a second signal transmission path structure.