The present disclosure provides a phase shifter and a manufacturing method thereof, and an antenna. The phase shifter includes a first substrate and a second substrate, and a medium layer arranged between them. The first substrate includes a reference electrode arranged on a side of a first base substrate close to the medium layer, and the second substrate includes a delay line arranged on a side of a second base substrate close to the medium layer. An orthographic projection on the first substrate of the delay line at least partially overlaps with that of the reference electrode. A line spacing and/or a line width of the delay line is enable to make a cell thickness between the first substrate and the second substrate be 20 μm-75 μm.

The present disclosure provides a phase shifter and a manufacturing method thereof, and an antenna. The phase shifter includes a first substrate and a second substrate, and a medium layer arranged between them. The first substrate includes a reference electrode arranged on a side of a first base substrate close to the medium layer, and the second substrate includes a delay line arranged on a side of a second base substrate close to the medium layer. An orthographic projection on the first substrate of the delay line at least partially overlaps with that of the reference electrode. A line spacing and/or a line width of the delay line is enable to make a cell thickness between the first substrate and the second substrate be 20 μm-75 μm.

The disclosed radio frequency (RF) bandpass filter may include an RF transmission medium that defines (1) a plurality of cavities aligned parallel to each other along a major axis, where (a) each cavity includes planar surfaces that define (i) a first dimension aligned with the major axis and (ii) second and third dimensions aligned perpendicular to the major axis and each other, where the first dimension is shorter than the second and third dimensions and (b) each adjacent pair of cavities is coupled by an inter-cavity slot, (2) an RF inlet that couples a received RF signal to a first cavity at a first end of the plurality of cavities, and (3) an RF outlet that couples a filtered RF signal from a second cavity at a second end of the plurality of cavities externally to the filter. Various other filters and manufacturing methods thereof are also disclosed.

An asymmetric, broadband, compact and low-PIM orthomode transducer comprised of two parts is presented. Mating of the two parts results in the formation of a choke flange as well as a critical impedance step which suppresses unwanted modes and enables broadband matching of the junction between the two parts. Furthermore, a cruciform-quatrefoil waveguide type is utilized that transitions to an aperture. This waveguide configuration can lead to a lower overall part length, an improved reflection, and reduced manufacturing costs.

Techniques relate to an on-chip Josephson parametric converter. A Josephson ring modulator includes four nodes. A lossless on-chip flux line is capacitively coupled to two adjacent nodes of the four nodes of the Josephson ring modulator. The lossless on-chip flux line has an input port configured to receive a pump drive signal that couples differentially to the two adjacent nodes of the of the Josephson ring modulator. The pump drive signal thereby excites a common mode of the on-chip Josephson parametric converter.

A stacked, multi-layer transmission line is provided. The stacked transmission line includes at least a pair of conductive traces, each conductive trace having a plurality of conductive stubs electrically coupled thereto. The stubs are disposed in one or more separate spatial layers from the conductive traces.

A wafer-scale die packaging device is fabricated by providing a high-k glass carrier substrate having a ceramic region which includes a defined waveguide area and extends to a defined die attach area, and then forming, on a first glass carrier substrate surface, a differential waveguide launcher having a pair of signal lines connected to a radiating element that is positioned adjacent to an air cavity and surrounded by a patterned array of conductors disposed over the ceramic region in a waveguide conductor ring. After attaching a die to the glass carrier substrate to make electrical connection to the differential waveguide launcher, a molding compound is formed to cover the die, differential waveguide launcher, and air cavity, and an array of conductors is formed in the molding compound to define a first waveguide interface perimeter surrounding a first waveguide interface interior.

A vehicle having a communication system is disclosed. The system includes two electrical couplings, coupled by way of a rotary joint having a bearing waveguide. Each electrical coupling includes an interface waveguide configured to couple to external signals. Each electrical coupling also includes a waveguide section configured to propagate electromagnetic signals between the interface waveguide and the bearing waveguide of the rotary joint. Additionally, the rotary joint is configured to allow one electrical coupling to rotate with respect to the other electrical coupling. An axis of rotation of the rotary joint is defined by a center of a portion of the waveguides. Yet further, the rotary joint allows electromagnetic energy to propagate between the waveguides of the electrical couplings.

An architecture for, and techniques for fabricating, a thermal decoupling device are provided. In some embodiments, thermal decoupling device can be included in a thermally decoupled cryogenic microwave filter. In some embodiments, the thermal decoupling device can comprise a dielectric material and a conductive line. The dielectric material can comprise a first channel that is separated from a second channel by a wall of the dielectric material. The conductive line can comprise a first segment and a second segment that are separated by the wall. The wall can facilitate propagation of a microwave signal between the first segment and the second segment and can reduce heat flow between the first segment and the second segment of the conductive line.

A filter is provided and includes potting material formed into a body defining a through-hole. The body includes first and second opposing faces and a sidewall extending between the first and second opposing faces. The sidewall is formed to define first and second openings at opposite ends of the through-hole, first angles at an interface between the sidewall and the first face and second angles, which complement the first angles, at an interface between the sidewall and the second face.