A method of manufacturing a circuit board having waveguides including forming a waveguiding structure by injection molding. The waveguiding structure includes a plurality of waveguides arranged at intervals and at least one connecting portion connecting two adjacent waveguides. Each waveguide includes a waveguiding substrate and at least one protrusion on the waveguiding substrate. The connecting portion is removed to obtain at least two waveguides. A metal layer is formed to wrap the whole outer surface of each waveguide. A plurality of receiving grooves is formed to penetrate a wiring board. Each waveguide wrapped by the metal layer is embedded in one of the receiving grooves. The waveguides and the wiring board are fixed. A portion of the metal layer on a surface of each protrusion facing away from the waveguiding substrate is removed. A circuit board is also provided.

A waveguide, printed circuit board and a method of fabricating a waveguide that includes: providing a ceramic powder and polymer binder slurry, and forming the waveguide from the slurry. The waveguide and a printed circuit that includes the waveguide are also described.

An antenna arrangement comprising a SIW with at least one radiating arrangement. The SIW comprises a dielectric material, a first and second metal layer and a first and second electric wall element running essentially parallel and electrically connecting the metal layers. For each radiating arrangement, the antenna arrangement comprises at least one coupling aperture in the first metal layer, and for each coupling aperture there is a third wall element running between the first and second electric wall elements, across a SIW longitudinal extension (e.sub.s). For each radiating arrangement, the antenna arrangement further comprises an at least partly electrically conducting antenna component which comprises at least four radiating elements and is surface-mounted on the first metal layer, enclosing at least one coupling aperture. For each radiating arrangement, electromagnetic signals are arranged to be transmitted between said coupling aperture and said radiating elements.

An approximately planar antenna assembly can be formed or used, such as comprising a printed circuit board assembly. In an example, the approximately planar antenna assembly can include a dielectric material and a conductive loop comprising an outer loop portion having a first conic section an inner loop portion having a second conic section located within a footprint of the first conic section. The planar antenna assembly can be configured to support wireless transfer of information in at least two ranges of operating frequencies, such as two or more respective ranges used for cellular communications.

An approximately planar antenna assembly can be formed or used, such as comprising a printed circuit board assembly. In an example, the approximately planar antenna assembly can include a dielectric material and a conductive loop comprising an outer loop portion having a first conic section an inner loop portion having a second conic section located within a footprint of the first conic section. The planar antenna assembly can be configured to support wireless transfer of information in at least two ranges of operating frequencies, such as two or more respective ranges used for cellular communications.

Described is a method for forming a planar transmission line low-pass filter and a resulting filter. The method comprises several acts, including using lithographic processes and a castable polymer with absorptive matrix as a spin-on dielectric to form the planar transmission line low-pass filter.

The present invention relates to a manufacturing apparatus and a manufacturing method for microwave means. The manufacturing apparatus (1) for microwave means comprises: a fixture (10, 10′), the fixture (10, 10′) comprising a base (11) capable of rotating about a first axis (A1), and a carrier (12) capable of swinging about a second axis (A2), the carrier (12) being connected to the base (11) so as to hold an insulating substrate (40), wherein the first axis (A1) intersects the second axis (A2); a source (20) for releasing metal ions towards the insulating substrate (40); and a controller (30), the controller (30) coupled to the fixture (10, 10′) and the source (20) and configured to control a movement pattern of the fixture (10, 10′) and/or an angle of the source (20) such that the insulating substrate (40) receives the metal ions from a plurality of angles and a metal layer (50) is formed over all surfaces (41) of the insulating substrate (40).

An interposer (16) and a substrate (10) incorporating the interposer (16) are provided. The interposer (16) includes one or more layers (18) and a cavity (20) defined in the one or more layers (18), the cavity (20) being configured as a waveguide for propagation of electromagnetic waves.

Microelectronic assemblies that include a lithographically-defined substrate integrated waveguide (SIW) component, and related devices and methods, are disclosed herein. In some embodiments, a microelectronic assembly may include a package substrate portion having a first face and an opposing second face; and an SIW component that may include a first conductive layer on the first face of the package substrate portion, a dielectric layer on the first conductive layer, a second conductive layer on the dielectric layer, and a first conductive sidewall and an opposing second conductive sidewall in the dielectric layer, wherein the first and second conductive sidewalls are continuous structures.

A system and method for treating a cavity comprises arranging a niobium structure in a coating chamber, the coating chamber being arranged inside a furnace, coating the niobium structure with tin thereby forming an Nb.sub.3Sn layer on the niobium structure, and doping the Nb.sub.3Sn layer with nitrogen, thereby forming a nitrogen doped Nb.sub.3Sn layer on the niobium structure.