A twist for coupling radiation between orthogonal waveguides is provided. The twist includes at least three cavities opening from at least one of a first X1-Y1 surface and a second X2-Y2 surface of a metal block. A first cavity has a first opening in a first Y-Z plane and a second opening in a second Y-Z plane offset from the first Y-Z plane by a first length. A second cavity shares the second opening with the first cavity and has a third opening in a third Y-Z plane offset from the second Y-Z plane by a second length and has at least two heights and at least two widths. A last cavity shares a next-to-last opening in a next-to-last Y-Z plane with a next-to-last cavity. The last cavity has a last opening in a last Y-Z plane offset from the next-to-last Y-Z plane by a last length.

A twist for coupling radiation between orthogonal waveguides is provided. The twist includes at least three cavities opening from at least one of a first X1-Y1 surface and a second X2-Y2 surface of a metal block. A first cavity has a first opening in a first Y-Z plane and a second opening in a second Y-Z plane offset from the first Y-Z plane by a first length. A second cavity shares the second opening with the first cavity and has a third opening in a third Y-Z plane offset from the second Y-Z plane by a second length and has at least two heights and at least two widths. A last cavity shares a next-to-last opening in a next-to-last Y-Z plane with a next-to-last cavity. The last cavity has a last opening in a last Y-Z plane offset from the next-to-last Y-Z plane by a last length.

A method of an embodiment includes forming a capacitor pad for a nonlinear resonator. In an embodiment, the method includes comparing a resonance frequency of the nonlinear resonator to a target frequency to determine whether the resonance frequency falls within a range of the target frequency. A device of an embodiment includes a first capacitor pad comprising a superconducting material, the first capacitor pad configured to couple to a first end of a logic circuit element. In an embodiment, the device includes a second capacitor pad comprising a second superconducting material, the capacitor pad configured to couple to a second end of the logic circuit element. In an embodiment, the second capacitor pad includes a first portion; a second portion; and a bridge configured to electrically connect the first portion and the second portion.

A feed line to waveguide lateral transition is described consisting of: a proximity coupled antenna element on the top surface of a composite RF board, an embedded microstrip or stripline feed line, a ground plane on the bottom surface of the RF board, and a waveguide with an aperture enclosing the antenna element with a signal propagation through the waveguide being perpendicular to the antenna element.

A digital system has a dielectric core waveguide that has a longitudinal dielectric core member. The core member has a body portion and may have a cladding surrounding the dielectric core member. A radiated radio frequency (RF) signal may be received on a first portion of a radiating structure embedded in the end of a dielectric waveguide (DWG). Simultaneously, a derivative RF signal may be launched into the DWG from a second portion of the radiating structure embedded in the DWG.

A method, system, and device provides components of an antenna assembly. Digital information representative of one or more characteristics of an antenna element of antenna assembly may be received by a processor. The processor may further receive a specification for the antenna element. The processor may adjust digital information representative of the antenna element to adjust the physical parameters of the component to meet the specification. The antenna assembly may be fabricated with the adjusted physical parameters.

An image pickup apparatus includes, between a first unit including an image pickup device and a second unit including a video processing circuit, a waveguide path through which a millimeter wave or a submillimeter wave is transmitted, the second unit includes a millimeter-wave carrier-wave generation circuit and a demodulator configured to regenerate, from a millimeter-wave modulated wave generated by the first unit and received through the waveguide path, a video signal generated by the image pickup device, and the first unit includes a processing-transmission circuit configured to receive a millimeter-wave carrier wave through the waveguide path, generate a millimeter-wave modulated wave by superimposing the video signal generated by the image pickup device on the millimeter-wave carrier wave, and transmit the millimeter-wave modulated wave toward the waveguide path.

In a wired substrate, heat dissipation performance is improved while an increase in an amount of metal is inhibited.

The substrate includes a transmission line, an insulating material, and a heat storage material. In the substrate provided with the transmission line, the insulating material and the heat storage material, the transmission line transmits a predetermined electrical signal from a semiconductor chip. The transmission line for transmitting the predetermined electrical signal from the semiconductor chip is wired in the insulating material. The heat storage material has a higher thermal conductivity than the insulating material to which the transmission line is wired and accumulates latent heat accompanying phase transition that occurs within an operating temperature range of the semiconductor chip.

A liquid crystal phase shifter includes a first substrate and a second substrate which are disposed oppositely, and a liquid crystal layer located between the first substrate and the second substrate. A first metal film layer is disposed on a side of the first substrate facing the second substrate. A second metal film layer is disposed on a side of the second substrate facing the first substrate. The first metal film layer and the second metal film layer are both patterned metal film layers. The first substrate and the second substrate are both PCBs. The present disclosure further provides a liquid crystal antenna, including the abovementioned liquid crystal phase shifter. The present disclosure further provides a manufacturing method of the liquid crystal phase shifter.

A liquid crystal phase shifter includes a first substrate and a second substrate which are disposed oppositely, and a liquid crystal layer located between the first substrate and the second substrate. A first metal film layer is disposed on a side of the first substrate facing the second substrate. A second metal film layer is disposed on a side of the second substrate facing the first substrate. The first metal film layer and the second metal film layer are both patterned metal film layers. The first substrate and the second substrate are both PCBs. The present disclosure further provides a liquid crystal antenna, including the abovementioned liquid crystal phase shifter. The present disclosure further provides a manufacturing method of the liquid crystal phase shifter.