Aspects of the subject disclosure may include, for example, an antenna structure having a feedline, and a dielectric antenna coupled to the feedline. A first structural feature of an aperture of the dielectric antenna and a second structural feature of a junction between the feedline and the dielectric antenna can be configured to increase a front-to-back ratio of wireless signals received by the aperture of the dielectric antenna and received outside a reception area of the aperture of the dielectric antenna. Other embodiments are disclosed.

The present invention relates to a multi-mode antenna and a wireless power reception device having the same mounted thereon. A multi-mode antenna module according to an embodiment of the present invention comprises: a printed circuit board; a first antenna, disposed by pattern printing in a central area of the printed circuit board, for wireless charging; a second antenna, disposed by pattern printing on the outer periphery of the first antenna, for first near-field wireless communication; a third antenna disposed by pattern printing on the outer periphery of the second antenna such that the third antenna does not overlap the second antenna for second near-field wireless communication; a first connection terminal for connecting both ends of a first connection pattern corresponding to the first antenna; and a second connection terminal for connecting both ends of each of a second and a third connection pattern corresponding to the second antenna and the third antenna, respectively, wherein the first connection terminal and the second connection terminal may be arranged to be separated from each other on the printed circuit board.

The present invention relates to a multi-mode antenna and a wireless power reception device having the same mounted thereon. A multi-mode antenna module according to an embodiment of the present invention comprises: a printed circuit board; a first antenna, disposed by pattern printing in a central area of the printed circuit board, for wireless charging; a second antenna, disposed by pattern printing on the outer periphery of the first antenna, for first near-field wireless communication; a third antenna disposed by pattern printing on the outer periphery of the second antenna such that the third antenna does not overlap the second antenna for second near-field wireless communication; a first connection terminal for connecting both ends of a first connection pattern corresponding to the first antenna; and a second connection terminal for connecting both ends of each of a second and a third connection pattern corresponding to the second antenna and the third antenna, respectively, wherein the first connection terminal and the second connection terminal may be arranged to be separated from each other on the printed circuit board.

A method and apparatus is presented. A structure having an interior channel is formed using additive manufacturing equipment. A viscous media containing abrasive particles is sent through the interior channel using abrasive flow machining equipment to form a desired surface roughness for the interior channel.

A method and apparatus is presented. A structure having an interior channel is formed using additive manufacturing equipment. A viscous media containing abrasive particles is sent through the interior channel using abrasive flow machining equipment to form a desired surface roughness for the interior channel.

A dual-reflector antenna comprises a main reflector traversed by a feed source and a sub-reflector. The sub-reflector comprises a dielectric body extending between a first end that is small in diameter and a second end that is greater in diameter, the small-diameter end being connected to the end of the feed source constituted by a metal tube filled with a dielectric material. The end of the feed source connected to the sub-reflector comprises a housing, having an inner depth and inner diameter, built into the dielectric material. The small-diameter end of the sub-reflector comprises an inner portion having a substantially cylindrical shape, able to fit into the housing, having an outer length and outer diameter. The outer length and outer diameter of the small-diameter end of the sub-reflector are respectively less than the inner depth and inner diameter of the feed source, so as to form a space between the inner portion of the sub-reflector and the dielectric wall of the housing.

The present invention is directed at a waveguide antenna for microwave enhanced combustion of a previously ignited fuel-air mixture. The waveguide antenna has a thermal conductivity of at least 150 W/m-k and can be formed from a metallic shell with a ceramic core.

The present invention is directed at a waveguide antenna for microwave enhanced combustion of a previously ignited fuel-air mixture. The waveguide antenna has a thermal conductivity of at least 150 W/m-k and can be formed from a metallic shell with a ceramic core.

An apparatus includes a printed circuit board (PCB), a solder pad, a signal via, a plurality of metalized vias, and a waveguide. The PCB has a first surface opposite a second surface and includes a first metal layer, a second metal layer having a waveguide opening, and a PCB channel region from the waveguide opening in the second metal layer to the second surface. The solder pad is positioned on the first surface of the PCB over the channel region, and the signal via is coupled to the solder pad and a via pad in the second metal layer within the waveguide opening. The plurality of metalized vias extend from the first surface to the second surface of the PCB and form a boundary around the channel region. The waveguide is affixed to the waveguide opening in the second metal layer.

An apparatus includes a printed circuit board (PCB), a solder pad, a signal via, a plurality of metalized vias, and a waveguide. The PCB has a first surface opposite a second surface and includes a first metal layer, a second metal layer having a waveguide opening, and a PCB channel region from the waveguide opening in the second metal layer to the second surface. The solder pad is positioned on the first surface of the PCB over the channel region, and the signal via is coupled to the solder pad and a via pad in the second metal layer within the waveguide opening. The plurality of metalized vias extend from the first surface to the second surface of the PCB and form a boundary around the channel region. The waveguide is affixed to the waveguide opening in the second metal layer.