A system for a Rydberg atom based quantum communications transceiver is provided. The system may include a laser source for generating a photon. The system may also include one or more optical elements to create a pair of entangled photons from a generated photon, wherein the pair of entangled photons comprises a first entangled photon and a second entangled photon. The system may further include a radio-frequency (RF) based element to generate a quantum communication path from the pair of entangled photons by creating two Rydberg atom vapor cells (RAVC) that are entangled such that entangled photons may transfer or communicate their entangled state to Rydberg atoms within the Rydberg atom vapor cells (RAVCs) and form at least one entangled link with the other, the communication path comprising the least one entangled link. The system may also include one or more photon receivers, which may use at least one translation technique, to translate entangled state of each of the Rydberg atom vapor cells (RAVC).

A system for a Rydberg atom based quantum communications transceiver is provided. The system may include a laser source for generating a photon. The system may also include one or more optical elements to create a pair of entangled photons from a generated photon, wherein the pair of entangled photons comprises a first entangled photon and a second entangled photon. The system may further include a radio-frequency (RF) based element to generate a quantum communication path from the pair of entangled photons by creating two Rydberg atom vapor cells (RAVC) that are entangled such that entangled photons may transfer or communicate their entangled state to Rydberg atoms within the Rydberg atom vapor cells (RAVCs) and form at least one entangled link with the other, the communication path comprising the least one entangled link. The system may also include one or more photon receivers, which may use at least one translation technique, to translate entangled state of each of the Rydberg atom vapor cells (RAVC).

The invention relates to a wide-band omnidirectional antenna including at least a first conducting member and a second conducting member having a revolution symmetry about a common revolution axis and central openings, said members being arranged opposite each other, at least one member having a progressively flaring area, characterised in that it comprises a gap between the conducting members and a central coaxial excitation line so as to achieve a three-dimensional contactless transition between the coaxial excitation line and the conducting members and members for modifying the radiation pattern in the flaring area of the diode type for selectively radiating the gap depending on the on- or off-state of said diodes.

The present disclosure provides an antenna feeder assembly of a multi-band antenna, comprising a first feeder supporting propagation of waves in a first frequency band and a second feeder supporting propagation of waves in a second frequency band lower than the first frequency band. The second feeder coaxially surrounds the first feeder. The first feeder comprises a dielectric emitting section and a dielectric radiating section; wherein each of the dielectric emitting section and the radiating section includes an inner cavity, a wall, and sub-wavelength elements on an external surface of the wall. The present disclosure also provides a multi-band microwave antenna, comprising a dish reflector, a subreflector, and the above-mentioned antenna feeder assembly.

Generally discussed herein are systems, devices, and methods that include a communication cavity. According to an example a device can include substrate with a first cavity formed therein, first and second antennas exposed in and enclosed by the cavity, and an interconnect structure formed in the substrate, the interconnect structure including alternating conductive material layers and inter-layer dielectric layers.

Generally discussed herein are systems, devices, and methods that include a communication cavity. According to an example a device can include substrate with a first cavity formed therein, first and second antennas exposed in and enclosed by the cavity, and an interconnect structure formed in the substrate, the interconnect structure including alternating conductive material layers and inter-layer dielectric layers.

The present disclosure relates to a waveguide section having at least one air-filled waveguide conducting tube having an electrically conducting inner wall. Each waveguide conducting tube has a plug-in filter device with two or more electrically conducting elements arranged in series and spaced apart by a connecting arrangement. Each plug-in filter device is adapted to be retained in the corresponding waveguide conducting tube using a dielectric holding arrangement such that the electrically conducting elements are spaced apart from the waveguide conducting tube. The electrically conducting elements are arranged to be electromagnetically coupled such that passing a radio frequency is electromagnetically filtered.

An additively manufactured heat transfer device is disclosed, including an enclosure portion with outer walls. The outer walls contain an inner channel configured to direct a flow of coolant fluid. The heat transfer device further includes a fluid intake port and a fluid outtake port, each connected to the first inner channel. The fluid intake port is configured to direct a flow of coolant fluid through an outer wall of the enclosure portion into the inner channel, and the fluid outtake port is configured to direct a flow of coolant fluid through an outer wall of the enclosure portion out of the inner channel. The inner channel is defined by internal walls, and the enclosure portion and the internal walls form a single additively manufactured unit.

An illustrative example embodiment of an antenna device includes a substrate, a plurality of antenna elements supported on the substrate, an integrated circuit supported on one side of the substrate, and a metallic waveguide antenna situated against the substrate. The metallic waveguide antenna includes a heat dissipation portion in a thermally conductive relationship with the integrated circuit. The heat dissipation portion is configured to reduce a temperature of the integrated circuit.

An illustrative example embodiment of an antenna device includes a substrate, a plurality of antenna elements supported on the substrate, an integrated circuit supported on one side of the substrate, and a metallic waveguide antenna situated against the substrate. The metallic waveguide antenna includes a heat dissipation portion in a thermally conductive relationship with the integrated circuit. The heat dissipation portion is configured to reduce a temperature of the integrated circuit.