Patent classifications
H01Q17/00
Radiation Noise Reduction Component for Use With Information Handling Systems
A radiation noise reduction component which includes a substrate and a loop antenna mounted on the substrate, the loop antenna being positioned proximate to an energy radiating component of an information handling system, the loop antenna compensating for the radiated energy generated by the energy radiating component.
RADAR MODULE INCORPORATED WITH A PATTERN-SHAPING DEVICE
A radar module includes a printed circuit board (PCB) and a semiconductor package mounted on the PCB. The semiconductor package comprises an integrated circuit die and a substrate for electrically connecting the integrated circuit die to the PCB. The substrate comprises an antenna layer integrated into the semiconductor package and electrically connected to the integrated circuit die for at least one of transmitting and receiving radar signals. A discrete pattern-shaping device is mounted on the PCB and is configured to shape a radiation pattern of the radar signals.
Light absorber
A light absorber includes an insulating substrate; a reflective layer that is provided on the insulating substrate, that is composed of a metal, and that has conductivity; a conductive pattern that is disposed on the reflective layer and that has defined therein at least one first opening; a nano-antenna that is disposed on the reflective layer and that vertically overlaps the at least one first opening; and an insulating pattern having a first portion that is interposed between the reflective layer and the conductive pattern and having a second portion that is interposed between and completely fills a vertical space between the reflective layer and the nano-antenna so that the reflective layer, the conductive pattern, and the nano-antenna are electrically insulated from each other.
CIRCUIT SUBSTRATE, ANTENNA ELEMENT, BUILT-IN MILLIMETER WAVE ABSORBER FOR CIRCUIT SUBSTRATE, AND METHOD FOR REDUCING NOISE IN CIRCUIT SUBSTRATE
A circuit substrate includes a multi-layer substrate in which a plurality of dielectric layers are stacked, and a millimeter wave absorber provided inside the multi-layer substrate and having an electromagnetic wave absorption peak within a region of 30 to 300 GHz. An antenna element includes the circuit substrate described above, a power feeder provided inside the multi-layer substrate of the circuit substrate, and an antenna provided on a surface of the circuit substrate and connected to the power feeder. A method for reducing noise in a circuit substrate including a multi-layer substrate includes, by a millimeter wave absorber provided inside the multi-layer substrate and having an electromagnetic wave absorption peak within a region of 30 to 300 GHz, absorbing unnecessary electromagnetic waves diffused in the multi-layer substrate to reduce noise in the circuit substrate.
ELECTROMAGNETIC WAVE ABSORBING SHEET
An electromagnetic wave absorbing sheet includes a metallic base and an electromagnetic wave absorption film formed on the metallic base. The electromagnetic wave absorption film contains MTC-substituted ε—Fe.sub.2O.sub.3, black titanium oxide, a conductive filler, and a resin. The MTC-substituted ε—Fe.sub.2O.sub.3 is a crystal belonging to the same space group as an ε—Fe.sub.2O.sub.3 crystal and containing Ti, Co, Fe, and at least one element selected from the group consisting of Ga, In, Al, and Rh. The proportion of the conductive filler to the electromagnetic wave absorption film is equal to or greater than 0.1% by volume and equal to or less than 10% by volume.
ELECTROMAGNETIC WAVE ABSORBING SHEET
An electromagnetic wave absorbing sheet includes a metallic base and an electromagnetic wave absorption film formed on the metallic base. The electromagnetic wave absorption film contains MTC-substituted ε—Fe.sub.2O.sub.3, black titanium oxide, a conductive filler, and a resin. The MTC-substituted ε—Fe.sub.2O.sub.3 is a crystal belonging to the same space group as an ε—Fe.sub.2O.sub.3 crystal and containing Ti, Co, Fe, and at least one element selected from the group consisting of Ga, In, Al, and Rh. The proportion of the conductive filler to the electromagnetic wave absorption film is equal to or greater than 0.1% by volume and equal to or less than 10% by volume.
ELECTROMAGNETIC WAVE ABSORBER
For the purpose of providing an electromagnetic wave absorber usable for radar having a high resolution and sufficiently adaptable to a plurality of radars different in frequency, the bandwidth of a frequency band in which an electromagnetic wave absorption amount is not less than 20 dB is not less than 2 GHz, within a frequency band of 60 to 90 GHz.
Back cover for portable terminal and back cover-integrated antenna module including the same
Provided are a back cover for a portable terminal and a back cover-integrated antenna module including the same. A back cover for a portable terminal according to an embodiment of the present invention is disposed on the back surface of a portable terminal body, and includes a pattern portion, which is formed to pass through the back cover formed of a metal material at a region corresponding to at least one antenna and configured to reduce generation of an eddy current.
Back cover for portable terminal and back cover-integrated antenna module including the same
Provided are a back cover for a portable terminal and a back cover-integrated antenna module including the same. A back cover for a portable terminal according to an embodiment of the present invention is disposed on the back surface of a portable terminal body, and includes a pattern portion, which is formed to pass through the back cover formed of a metal material at a region corresponding to at least one antenna and configured to reduce generation of an eddy current.
Method and apparatus for heat sinking high frequency IC with absorbing material
A phased array has a laminar substrate, a plurality of elements on the laminar substrate forming a patch phased array, and integrated circuits on the laminar substrate. Each integrated circuit is a high frequency integrated circuit configured to control receipt and/or transmission of signals by the plurality of elements in the patch phased array. In addition, each integrated circuit has a substrate side coupled with the laminar substrate, and a back side. The phased array also has a plurality of heat sinks. Each integrated circuit is coupled with at least one of the heat sinks. At least one of the integrated circuits has a thermal interface material in conductive thermal contact with its back side. The thermal interface material thus is between the at least one integrated circuit and one of the heat sinks. Preferably, the thermal interface material has a magnetic loss tangent value of between 0.5 and 4.5.