A printed circuit board (PCB) module may include a PCB with at least one internal PCB element and at least one external PCB element, a shielding layer fabricated from a tunable metamaterial absorber, and a structure housing the PCB. The at least one internal PCB element may be embedded between adjacent layers of the PCB. The at least one external PCB element may be coupled to an exterior surface of the PCB. The shielding layer may be tuned in response to the at least one measurement of the EMI emission and a determination of a frequency of the EMI emission from the at least one measurement. The tuning of the shielding layer may include adjusting a plurality of fins within a plurality of elements of the metamaterial absorber to absorb at least a portion of the EMI emission.

A support frame is provided that includes an upper plate, a lower plate, side support members, an upper support structure, and a lower support structure. The upper plate defines a first inner surface and an opposed first outer surface. The lower plate defines a second inner surface and an opposed second outer surface. A TEM test space is defined between the first inner surface and the second inner surface. The side support members are disposed between the upper plate and the lower plate proximate a periphery of the test space. The upper support structure is coupled to and supports the upper plate. The upper support structure extends from the first outer surface of the upper plate. The lower support structure is coupled to and supports the lower plate. The lower support structure extends from the second outer surface of the lower plate.

A support frame is provided that includes an upper plate, a lower plate, side support members, an upper support structure, and a lower support structure. The upper plate defines a first inner surface and an opposed first outer surface. The lower plate defines a second inner surface and an opposed second outer surface. A TEM test space is defined between the first inner surface and the second inner surface. The side support members are disposed between the upper plate and the lower plate proximate a periphery of the test space. The upper support structure is coupled to and supports the upper plate. The upper support structure extends from the first outer surface of the upper plate. The lower support structure is coupled to and supports the lower plate. The lower support structure extends from the second outer surface of the lower plate.

An impedance matching film 10a has a plurality of openings 11. The plurality of openings 11 are formed at equal intervals in a specific direction along main surfaces 10f of the impedance matching film 10a. The impedance matching film 10a has a sheet resistance of 300 to 700Ω/□. A size G of each opening 11 in the specific direction is 50 μm or more and 1000 μm or less. In the impedance matching film 10a, a cross-sectional resistance value R.sub.s is 1MΩ/m or more. The cross-sectional resistance value R.sub.s is determined by dividing a specific resistance of a material forming the impedance matching film 10a by a product of a thickness of the impedance matching film 10a and a distance between the nearest openings 11.

An impedance matching film 10a has a plurality of openings 11. The plurality of openings 11 are formed at equal intervals in a specific direction along main surfaces 10f of the impedance matching film 10a. The impedance matching film 10a has a sheet resistance of 300 to 700Ω/□. A size G of each opening 11 in the specific direction is 50 μm or more and 1000 μm or less. In the impedance matching film 10a, a cross-sectional resistance value R.sub.s is 1MΩ/m or more. The cross-sectional resistance value R.sub.s is determined by dividing a specific resistance of a material forming the impedance matching film 10a by a product of a thickness of the impedance matching film 10a and a distance between the nearest openings 11.

A testing base includes a housing, a carrier, a wave absorber, and a filler. The housing has an inner surface. The carrier is disposed on the housing. The carrier includes an upper surface, a lower surface, and a groove recessed in the upper surface. The groove is adapted for accommodating a component to be tested. The lower surface and the inner surface of the housing define a cavity body together. The wave absorber is disposed on the inner surface of the housing. The filler is filled in the cavity body and contacts the wave absorber and the carrier. A relative permittivity of the filler is less than or equal to 2.

A radio wave absorber includes a resistive layer, an electroconductive layer, and a dielectric layer. The resistive layer has a first main surface with a plurality of first openings formed at equal intervals. The electroconductive layer has a second main surface with a plurality of second openings formed at equal intervals. The dielectric layer is disposed between the resistive layer and the electroconductive layer. In the radio wave absorber, a value obtained by dividing a larger value out of a first ratio and a second ratio by a smaller value out of the first ratio and the second ratio is 1.3 or more. The first ratio is a ratio (G.sub.R/W.sub.R) of a size G.sub.R of the first opening to a distance W.sub.R between the first openings. The second ratio is a ratio (G.sub.C/W.sub.C) of a size G.sub.C of the second opening to a distance W.sub.C between the second openings.

According to one embodiment, an electromagnetic wave attenuator includes a stacked member. The stacked member includes a base body including a first surface including unevenness, a first conductive member including Cu, and a first layer provided between the first surface and the first conductive member. The first layer includes Cr and Ti.

An array antenna (A) in a medium (M) comprises a plurality of radiating elements (ER.sub.T) ensuring the transition between the antenna and the medium, the reflectivity of each element depending on a parameter, the reflectivity of a first element being close to that of the medium, the reflectivity of a last element being close to that of the antenna, the reflectivity parameter of the elements varying from one element to the next. A method comprises calculation of a path equal to the sum of the variations of the reflectivity from one element to the next element, optimization of the variation of the reflectivity parameter so that equivalent radar cross-section of the antenna is the lowest possible or the antenna best observes the radiation objectives, determination of the different elements as a function of said parameter, and simulation of the overall reflectivity and/or of the radiation of the antenna.

An antenna system and method for fabricating an antenna are provided. The antenna system includes a substrate and an antenna. The antenna includes a conductive particle based material applied onto the substrate. The conductive particle based material includes conductive particles and a binder. When the conductive particle based material is applied to the substrate, the conductive particles are dispersed in the binder so that at least a majority of the conductive particles are adjacent to, but do not touch, one another.