A filter-antenna and a method for making a filter-antenna. The filter antenna includes a microstrip antenna, such as a patch antenna, integrated with an absorptive (e.g., bandstop) filter for absorbing or dissipating energy.

An antenna device includes a dielectric substrate, a ground plate arranged on a first surface of the dielectric substrate, an antenna part arranged on a second surface of the dielectric substrate, and a reflecting part. The reflecting part is arranged around the antenna part and has a plurality of conductor patches each functioning as a reflecting plate. The plurality of conductor patches form a plurality of blocks aligned along a predetermined block arrangement direction. The plurality of blocks are configured such that phases of reflected waves at an operating frequency are different for each of the blocks and phase differences of reflected waves between adjacent blocks are non-uniformly different for each of the adjacent blocks.

A planar antenna formed on a front surface of a substrate whose back surface serves as a ground surface, the planar antenna includes: a radiating element; a feeding line connected with the radiating element; a first ground element and a second ground element which are respectively electrically connected to the ground surface and are arranged to be opposed to each other across the feeding line; a first parasitic element extending from the first ground element to surround at least a part of the radiating element; and a second parasitic element extending from the second ground element to surround at least a part of the radiating element from an opposite direction from the first parasitic element, wherein the first ground element and the second ground element serve as impedance matching devices for the feeding line.

A substrate integrated waveguide fed antenna includes an electric dipole arrangement, a parasitic patch arrangement operably coupled with the electric dipole arrangement, and a feed structure. The feed structure includes a substrate integrated waveguide operably coupled with the electric dipole arrangement for exciting the electric dipole arrangement. A slotted conductive surface with a slot is arranged between the electric dipole arrangement and the feed structure for operably coupling the feed structure with the electric dipole arrangement.

A patch antenna includes a dielectric substrate formed by a high dielectric coefficient material covered with a soft material. The dielectric substrate has a first surface, an opposite second surface, and surrounding side surfaces there between. The patch antenna further includes a radiating metal arm formed on at least the first surface with a thin metal layer in a specific shape, a grounding metal plate disposed on the second surface, and a parasitic metal arm extending from the grounding metal plate towards the first surface via at least one of the side surfaces. The parasitic metal arm is approximate but not connected to the radiating metal arm. The radiation metal arm further includes an enclosed slot, together with the parasitic metal arm, improve the working bandwidth and high directivity of the antenna.

An antenna includes feed pads; a radiating portion disposed on one side of the feed pads and spaced apart from the feed pads, the radiating portion being constituted by a single conductor plate; and a ground part disposed on an opposite side of the feed pads from the radiating portion; wherein each of the feed pads has a polygonal shape.

An electronic device may have an antenna module with a triplet of antennas on a substrate. The triplet may include a first antenna with a radiating element formed from a patch on the substrate and second and third antennas having radiating elements formed from patches on that extend across a smaller lateral area than the patch in the first antenna. The patches in the second and third antennas may have extended electrical lengths formed from parasitic patches embedded within the substrate that are coupled to opposing edges of the patches by fences of conductive vias. The antenna module may include phased antenna arrays for conveying centimeter/millimeter wave signals. Signal conductors for the antennas may be distributed across multiple metallization layers of the substrate.

A structure includes first to fourth conductors. The first conductor extends along a second plane including a second direction and a third direction intersecting with the second direction. The second conductor faces the first conductor along a first direction intersecting with the second plane and extends along the second plane. The third conductor capacitively connects the first conductor and the second conductor. The fourth conductor is electrically connected to the first conductor and the second conductor, and extends along a first plane including the first direction and the third direction. The third conductor includes a first conductive layer and a second conductive layer capacitively connected to the first conductive layer. The second conductive layer is positioned between the first conductive layer and the fourth conductor in the second direction. The first conductive layer has more thickness in the second direction as compared to thickness of the second conductive layer.

A semiconductor package includes a supporting wiring structure including a first redistribution dielectric layer and a first redistribution conductive structure; a frame on the supporting wiring structure, having a mounting space and a through hole, and including a conductive material; a semiconductor chip in the mounting space and electrically connected to the first redistribution conductive structure; a cover wiring structure on the frame and the semiconductor chip and including a second redistribution dielectric layer and a second redistribution conductive structure; an antenna structure on the cover wiring structure; a connection structure extending in the through hole and electrically connecting the first redistribution conductive structure to the second redistribution conductive structure; and a dielectric filling member between the connection structure in the through hole and the frame and surrounding the semiconductor chip, the frame, and the connection structure.

A technique is described where the switch and/or tunable control circuit for use with an active multi-mode antenna is positioned remote from the antenna structure itself for integration into host communication systems. Electrical delay and impedance characteristics are compensated for in the design and configuration of transmission lines or parasitic elements as the active multi-mode antenna structure is positioned in optimal locations such that significant electrical delay is introduced between the RF front-end circuit and multi-mode antenna. This technique can be implemented in designs where it is convenient to locate switches in a front-end module (FEM) and the FEM is located in vicinity to the transceiver.