One embodiment is a device, which comprises a cable attached at a first end to a radio module, the cable having a plurality of electro-magnetic interference (EMI) resistant elements connected at a plurality of positions, a radial board wherein the cable is attached thereto at a second end, and an antenna connected to the radial board, the antenna being configured to receive power from the radio module and to radiate.

A radar sensor. The radar sensor includes a high-frequency component situated on a circuit board and a waveguide structure, which is connected via a coupling structure to the high-frequency component. The waveguide structure is formed in a mold, which is injection molded to a part of the circuit board supporting the high-frequency component.

A structure for radiofrequency applications includes a high-resistivity support substrate having a front face defining a main plane, a charge-trapping layer disposed on the front face of the support substrate, a first dielectric layer disposed on the charge-trapping layer, an active layer disposed on the first dielectric layer, at least one buried electrode disposed above or in the charge-trapping layer. The buried electrode comprises a conductive layer and a second dielectric layer.

A structure for radiofrequency applications includes a high-resistivity support substrate having a front face defining a main plane, a charge-trapping layer disposed on the front face of the support substrate, a first dielectric layer disposed on the charge-trapping layer, an active layer disposed on the first dielectric layer, at least one buried electrode disposed above or in the charge-trapping layer. The buried electrode comprises a conductive layer and a second dielectric layer.

An antenna for a ground-penetration radar system is disclosed. The antenna has a housing that defines a cavity. A radiator is located on a surface of a planar substrate within the cavity. A wear-block is located between the radiator and the opening to the cavity for providing mechanical protection to the radiator. An absorber assembly is located on an opposite side of the radiator from the opening. The absorber assembly comprises a microwave absorber and a first dielectric layer. The first dielectric layer is located between the radiator and the microwave absorber.

A biocompatible electrical connection includes a substrate; a ferrule having a concentric flange at a first end of the ferrule; a first adhesive; and a second adhesive. The first adhesive adheres a first surface of the concentric flange of the ferrule to a surface of the substrate. The second adhesive fills an annular space between a hole in the substrate and the ferrule. The first adhesive or the second adhesive forms a conductive path on the surface of the substrate between the ferrule and a circuit pattern on the substrate.

A biocompatible electrical connection includes a substrate; a ferrule having a concentric flange at a first end of the ferrule; a first adhesive; and a second adhesive. The first adhesive adheres a first surface of the concentric flange of the ferrule to a surface of the substrate. The second adhesive fills an annular space between a hole in the substrate and the ferrule. The first adhesive or the second adhesive forms a conductive path on the surface of the substrate between the ferrule and a circuit pattern on the substrate.

In one embodiment of the present disclosure, an antenna assembly includes a patch antenna array including an upper patch antenna layer, a lower patch antenna layer, and a spacer therebetween, wherein the spacer includes a plurality of apertures defined by cell walls, wherein the each aperture aligns with an upper patch antenna element and a lower patent antenna element from the patch antenna array.

In one embodiment of the present disclosure, an antenna assembly includes a patch antenna array including an upper patch antenna layer, a lower patch antenna layer, and a spacer therebetween, wherein the spacer includes a plurality of apertures defined by cell walls, wherein the each aperture aligns with an upper patch antenna element and a lower patent antenna element from the patch antenna array.

An antenna device includes a dielectric substrate, an emitting electrode, a power feed circuit that feeds power to the emitting electrode, and a filter circuit formed on a path connecting the emitting electrode to the power feed circuit, the filter circuit is constituted by two or more circuits that are cascade connected, each of the two or more circuits is either a HPF or a LPF, and the antenna device does not have a resonant frequency of the emitting electrode and has two or more resonant frequencies different from the resonant frequency of the emitting electrode, each of which is formed by the emitting electrode and a corresponding one of the two or more circuits.