H01Q23/00

Dual-polarization heat-dissipating antenna array element

An antenna element transfers a radiofrequency signal and dissipates heat. The antenna element includes a periphery and first and second pairs of fins. The periphery has a length and a width with the length approximately equaling the width. The first and second pairs of fins extend in height from inside the periphery. The first pair of fins are separated by a shared gap for transferring a first polarization of the radiofrequency signal, and the second pair of fins are separated by the shared gap for transferring a second polarization of the radiofrequency signal that is orthogonal to the first polarization. An antenna array includes multiple instances of the antenna element for transferring the radiofrequency signal and for dissipating the heat.

ANTENNA DEVICE
20230123962 · 2023-04-20 · ·

The present disclosure provides an antenna device. The antenna device includes a dielectric element including a first region and a second region, a first antenna disposed on the first region, and a second antenna disposed on the second region. The first antenna and the second antenna are configured to operate in different frequencies. The first antenna and the second antenna are misaligned in directions perpendicular and parallel to a surface of the dielectric element on which the first antenna or the second antenna is disposed.

ANTENNA MODULE AND COMMUNICATION DEVICE EQUIPPED WITH THE SAME
20220328971 · 2022-10-13 · ·

An antenna module includes radiating elements that radiate radio waves in a first polarization direction, and a feed conductor that supplies a common radio-frequency signal to the radiating elements. A first radiating element and a second radiating element are disposed adjacent to each other. The feed conductor includes a common conductor, and conductors branching off from the common conductor. The conductors are respectively coupled to the radiating elements. Frequency characteristics of an impedance of the radiating element are different from frequency characteristics of an impedance of the radiating element. Under another condition of a frequency band in which a return loss is less than or equal to a predetermined value is defined as an operable band width in each of the radiating elements, the operable band width of the radiating element partially overlaps the operable band width of the radiating element.

ANTENNA STRUCTURE AND ANTENNA-STRUCTURE COMBINATION METHOD
20230063342 · 2023-03-02 ·

An antenna-structure combination method includes following steps. Provide a circuit board. At least one joint hole penetrating the circuit board is formed in the circuit board. At least one electrode layer and one feeding line are formed on a periphery of the joint hole. The feeding line is electrically connected to the electrode layer. Provide a chip antenna. The chip antenna includes a base. The base has a wiring section. A fixed connection section is arranged at one end of the wiring section. The fixed connection section is formed with a conductive layer. The fixed connection section of the chip antenna penetrates the joint hole of the circuit board, so that the conductive layer is electrically fixed to the electrode layer, so that the chip antenna is fixedly connected onto the circuit board in an upright manner.

Communication device and a method in a communication device

A communication device comprising: a millimetre wave antenna arrangement comprising a distributed millimetre wave antenna radiating element and a corresponding fixed millimetre wave antenna radiating element; a Radio Frequency Integrated Circuit; wherein the fixed millimetre wave antenna radiating element is arranged together with the Radio Frequency Integrated Circuit on a first substrate; wherein the distributed millimetre wave antenna radiating element is arranged on at least one second substrate spaced apart from the first substrate; and a switching arrangement configured to selectively connect either the fixed millimetre wave antenna radiating element to the Radio Frequency Integrated Circuit or the distributed millimetre wave antenna radiating element to the Radio Frequency Integrated Circuit. An associated method in a communication device, and an associated computer program product.

Communication device and a method in a communication device

A communication device comprising: a millimetre wave antenna arrangement comprising a distributed millimetre wave antenna radiating element and a corresponding fixed millimetre wave antenna radiating element; a Radio Frequency Integrated Circuit; wherein the fixed millimetre wave antenna radiating element is arranged together with the Radio Frequency Integrated Circuit on a first substrate; wherein the distributed millimetre wave antenna radiating element is arranged on at least one second substrate spaced apart from the first substrate; and a switching arrangement configured to selectively connect either the fixed millimetre wave antenna radiating element to the Radio Frequency Integrated Circuit or the distributed millimetre wave antenna radiating element to the Radio Frequency Integrated Circuit. An associated method in a communication device, and an associated computer program product.

ANTENNA DEVICE
20230163472 · 2023-05-25 ·

An antenna device includes a ground plate made of a flat conductor member, and an opposing conductive plate, which is a flat conductor member placed at a predetermined distance from the ground plate and electrically connected to a power supply line, a short-circuit portion provided in a central region of the opposing conductive plate for electrically connecting the opposing conductive plate and the ground plate. An operating frequency is a frequency at which an inductance of the short-circuit portion and the capacitance formed by the ground plate and the opposing conductive plate resonate in parallel. The short-circuit portion has a perimeter part that is short-circuited with the opposing conductive plate. A circuit is arranged in an area surrounded by a part where a short-circuit portion is short-circuited on the opposing conductive plate.

Base station antennas having fully embedded radios and housings with integrated heat sink structures

Active antennas are provided that include a housing having a front surface, first and second side surfaces and a rear surface, where the front surface comprises a radome and the first and second side surfaces comprise respective first and second thermally-conducting frame members. These antennas further include at least one radio that is completely mounted within an interior of the housing. Each of the first and second thermally-conducting frame members includes a plurality of outwardly extending fins.

Base station antennas having fully embedded radios and housings with integrated heat sink structures

Active antennas are provided that include a housing having a front surface, first and second side surfaces and a rear surface, where the front surface comprises a radome and the first and second side surfaces comprise respective first and second thermally-conducting frame members. These antennas further include at least one radio that is completely mounted within an interior of the housing. Each of the first and second thermally-conducting frame members includes a plurality of outwardly extending fins.

Active biconical antenna and receive array

An active biconical antenna and a receive array comprising a combination of active biconical and Vivaldi antennas. In one configuration, the active biconical antenna includes upper and lower cones. Each cone has a respective truncated apex. First and second feed points are respectively connected to the truncated apexes of the upper and lower cones and to first and second conductors. The active biconical antenna further includes a buffer amplifier having respective input terminals connected to the first and second conductors. The buffer amplifier has an input impedance that is impedance matched to an antenna impedance at and above but not below a frequency f.sub.c and is higher than the antenna impedance at frequencies substantially less than f.sub.c. The buffer amplifier also has an output impedance that is impedance matched to a system impedance at frequencies both above and below f.sub.c. A length of the first and second conductors is less than a wavelength at the frequency f.sub.c.