A reflector includes a substrate, a plurality of reflector structures arranged on or in the substrate and configured to reflect an incident electromagnetic wave. The reflector further includes an electronic circuit that is arranged at, on or in the substrate and configured to control an antenna when the antenna is connected to the electronic circuit.

A reflector includes a substrate, a plurality of reflector structures arranged on or in the substrate and configured to reflect an incident electromagnetic wave. The reflector further includes an electronic circuit that is arranged at, on or in the substrate and configured to control an antenna when the antenna is connected to the electronic circuit.

A device includes a first antenna arranged on a substrate, with the first antenna comprising a first semiconductor layer having terahertz-wave gain and a first conductor layer, a second antenna arranged on the substrate, with the second antenna comprising a second semiconductor layer having terahertz-wave gain and a second conductor layer, and a third conductor layer arranged on the substrate and electrically connecting the first antenna and the second antenna. A shunt device is arranged on the substrate and electrically connected to the third conductor layer. In planar view, the shunt device does not overlap with at least the first conductor layer.

A device includes a first antenna arranged on a substrate, with the first antenna comprising a first semiconductor layer having terahertz-wave gain and a first conductor layer, a second antenna arranged on the substrate, with the second antenna comprising a second semiconductor layer having terahertz-wave gain and a second conductor layer, and a third conductor layer arranged on the substrate and electrically connecting the first antenna and the second antenna. A shunt device is arranged on the substrate and electrically connected to the third conductor layer. In planar view, the shunt device does not overlap with at least the first conductor layer.

Disclosed is a device including a first line, a second line including a first section disposed on a first side of the first line and a second section disposed on a second side of the first line, the second side being opposite to the first side and the second section being separate from the first section by a distance, and at least one bridge electrically connecting an end of the first section with an end of the second section and extending across the first line. The device may be a directional coupler that achieves significantly higher directivity than conventional directional coupler structures, and hence, improves power detection accuracy.

Disclosed is a device including a first line, a second line including a first section disposed on a first side of the first line and a second section disposed on a second side of the first line, the second side being opposite to the first side and the second section being separate from the first section by a distance, and at least one bridge electrically connecting an end of the first section with an end of the second section and extending across the first line. The device may be a directional coupler that achieves significantly higher directivity than conventional directional coupler structures, and hence, improves power detection accuracy.

A high-frequency circuit device includes: a chip which includes a high-frequency element, a high-frequency circuit, a signal conductor, and a chip ground; a package substrate on which the chip is disposed, a shunt path which is constituted by a package signal conductor which is disposed on an upper surface of the package substrate and is electrically connected to the signal conductor, a package first ground which is electrically connected to the chip ground, and a shunt element which is electrically connected to the package signal conductor and the package first ground; and a package second ground which is disposed at least inside the base of the package substrate or on a back surface of the package substrate, wherein a part of the base, a part of the shunt path, and the package second ground constitute a capacitive structure.

An oscillator includes a substrate, and a plurality of oscillation structures and a power feed structure. The power feed structure includes a power source and a bias supply unit, the oscillation structures each include one antenna and an N piece of a semiconductor element electrically connected to the antenna. The semiconductor elements exhibit negative resistance characteristics when driven by the power feed structure, and out of the N piece thereof, a P piece thereof are connected in parallel, and an S piece thereof are connected in series, an F piece thereof are supplied with bias in the forward direction, and an R piece thereof are supplied with bias in a reverse direction. The semiconductor element in one of the oscillation structures exhibits asymmetrical current-voltage properties between forward bias and reverse bias. At least one of the N, P, S, F, and R differs from another.

A Frequency Modulated Continuous Wave (FMCW) radar system is provided that includes a chirp profile storage component configured to store a chirp profile for each chirp of a frame of chirps and a timing engine coupled to the chirp profile storage component to receive each chirp profile in transmission order during transmission of the frame of chirps, in which the timing engine uses each chirp profile to configure a corresponding chirp.

A Frequency Modulated Continuous Wave (FMCW) radar system is provided that includes a chirp profile storage component configured to store a chirp profile for each chirp of a frame of chirps and a timing engine coupled to the chirp profile storage component to receive each chirp profile in transmission order during transmission of the frame of chirps, in which the timing engine uses each chirp profile to configure a corresponding chirp.