Provided is an electronic device comprising an antenna for 5G communication according to the present invention. The electronic device comprises an array antenna which is implemented as a multi-layer substrate inside the electronic device and includes multiple antenna elements. Each of the multiple antenna elements of the array antenna may comprise: a patch antenna disposed on a specific layer of the multi-layer substrate and including a first patch and a second patch which are spaced a predetermined distance apart from each other; and a ground layer disposed under the patch antenna and having a slot. Meanwhile, the first patch and the second patch may be connected to the ground layer through multiple vias, and the multiple vias may be arranged in the longitudinal direction of the slot while being adjacent to the slot.

Provided is an electronic device comprising an antenna for 5G communication according to the present invention. The electronic device comprises an array antenna which is implemented as a multi-layer substrate inside the electronic device and includes multiple antenna elements. Each of the multiple antenna elements of the array antenna may comprise: a patch antenna disposed on a specific layer of the multi-layer substrate and including a first patch and a second patch which are spaced a predetermined distance apart from each other; and a ground layer disposed under the patch antenna and having a slot. Meanwhile, the first patch and the second patch may be connected to the ground layer through multiple vias, and the multiple vias may be arranged in the longitudinal direction of the slot while being adjacent to the slot.

A radio frequency module includes a first substrate having a first principal surface and a second principal surface on the opposite side to the first principal surface; a signal terminal which is provided on the first principal surface and through which a signal is transmitted to and received from an external circuit; a power supply terminal that is provided on the second principal surface and is supplied with a power supply signal; an antenna; and a radio frequency electronic component that is electrically connected to the signal terminal, the power supply terminal and the antenna, and controls transmission and reception of the antenna based on the signal and the power supply signal.

A radio frequency module includes a first substrate having a first principal surface and a second principal surface on the opposite side to the first principal surface; a signal terminal which is provided on the first principal surface and through which a signal is transmitted to and received from an external circuit; a power supply terminal that is provided on the second principal surface and is supplied with a power supply signal; an antenna; and a radio frequency electronic component that is electrically connected to the signal terminal, the power supply terminal and the antenna, and controls transmission and reception of the antenna based on the signal and the power supply signal.

An antenna module comprises: a circuit board, having a three-dimensional keep-out area; an antenna, disposed on the circuit board and located in the keep-out area; and a metal piece, disposed on the circuit board and located in the keep-out area, wherein the metal piece is electrically insulated from the antenna.

A radio frequency identification (RFID) tag. In one embodiment, an RFID tag includes an integrated circuit die. The integrated circuit die includes circuitry configured to store information and transmit the stored information responsive to reception of a radio frequency (RF) signal. The integrated circuit die also includes an antenna coupled to the circuitry. The antenna is formed as a loop antenna array configured to transmit and receive RFID signals. Further, the RFID tag includes a first test pad and second test pad formed on the integrated circuit die with the first test pad coupled to a first end of the antenna by a first interconnect and a second test pad coupled to the second end of the antenna by a second interconnect.

A radio frequency identification (RFID) tag. In one embodiment, an RFID tag includes an integrated circuit die. The integrated circuit die includes circuitry configured to store information and transmit the stored information responsive to reception of a radio frequency (RF) signal. The integrated circuit die also includes an antenna coupled to the circuitry. The antenna is formed as a loop antenna array configured to transmit and receive RFID signals. Further, the RFID tag includes a first test pad and second test pad formed on the integrated circuit die with the first test pad coupled to a first end of the antenna by a first interconnect and a second test pad coupled to the second end of the antenna by a second interconnect.

An antenna element includes a dielectric substrate, a radiation electrode, a first ground electrode, a second ground electrode, and a via conductor that connects the first ground electrode and the second ground electrode to each other. The dielectric substrate includes a flat-plate-shaped first part and a second part that is thinner than the first part. The radiation electrode and the first ground electrode are arranged on or in the first part so as to face each other in the thickness direction of the first part. The second ground electrode is spaced apart from the radiation electrode. The second ground electrode is arranged on or in the second part so as to not face the radiation electrode in the thickness direction of the second part. The radiation electrode is capacitively coupled to the second ground electrode and the via conductor.

An antenna element includes a dielectric substrate, a radiation electrode, a first ground electrode, a second ground electrode, and a via conductor that connects the first ground electrode and the second ground electrode to each other. The dielectric substrate includes a flat-plate-shaped first part and a second part that is thinner than the first part. The radiation electrode and the first ground electrode are arranged on or in the first part so as to face each other in the thickness direction of the first part. The second ground electrode is spaced apart from the radiation electrode. The second ground electrode is arranged on or in the second part so as to not face the radiation electrode in the thickness direction of the second part. The radiation electrode is capacitively coupled to the second ground electrode and the via conductor.

A structure includes: a base that includes a first surface and a second surface parallel to a first plane, a third surface and a fourth surface parallel to a second plane orthogonal to the first plane, and a fifth surface and a sixth surface parallel to a third plane orthogonal to the first plane and the second plane; a first conductor that expands along the third plane and that extends along a second direction; a second conductor that expands along the fourth plane and that extends along the second direction; a third conductor that expands along the first plane and that is configured to capacitively connect the first conductor and the second conductor; and a fourth conductor that is configured to be electrically connected to the first conductor and the second conductor. The first conductor, the second conductor, and the third conductor are at least partially exposed to exterior space.