An electronic device includes first to third terminals and a clip. The clip includes first to third joint portions and a connection portion. The first to third joint portions correspond to and are bonded to the first to third terminals, respectively. The connection portion connects the first to third joint portions. One terminal in the first to third terminals has a depressed portion depressed to one side in a predetermined direction to store a conductive bonding material. A variation in positions of the first to third terminals in the predetermined direction is absorbed by deformation of the conductive bonding material when one joint portion in the first to third joint portions corresponding to the one terminal is bonded to the one terminal through the conductive bonding material.

An electronic control device includes a wiring unit made from a resin material and an integrated circuit placed on the wiring unit. The wiring unit has a conductive member partially buried therein and including a bus bar terminal and a wiring part extending along a basal plane. The bus bar terminal is bent to extend in a first direction intersecting the basal plane. The integrated circuit includes a lead directed away from the basal plane and connected to the bus bar terminal.

An exemplary bridging inter-connector establishes electrical connections between conductors on a PCB and aligned conductors on a first board mounted to the PCB. A flexible non-conductive sheet covers at least a portion of these conductors. Separated conductive strips on the sheet that are dimensioned to align with and engage at least a portion of both the aligned conductors. A thin film of a bonding agent is disposed on the separated conductive strips and located to engage at least a portion of both aligned conductors to form a conductive connection.

Provided are approaches for modularized power distribution. In one approach, an apparatus may include a module extending into an interior cavity of a housing assembly through an opening formed in a base section of the housing assembly. The module may include a component grid at one end for receiving one or more components (e.g., fuses, relays, circuit breakers, diodes, etc.), and a wiring alignment cover at an opposite end operable with a terminal. The apparatus may further include a mechanical sealing element disposed along one or more surfaces of the module to provide a seal between the module and the base section defining the opening. In another approach, a plurality of modules may be disposed within a plurality of openings formed in the base section. In another approach, the apparatus may include a bracket configured to releasably connect the base section and the cover.

A relay terminal block fixed to a fixing part by a screw includes a main body having a first surface facing the fixing part, and a second surface on a rear surface side of the first surface. The main body is formed with a recessed portion depressed from the second surface toward the first surface, a through-hole formed from a bottom surface of the recessed portion through to the first surface, and a protrusion that is provided at an edge of the recessed portion to protrude in a direction away from the second surface. The through-hole is formed to have an inner diameter larger than an outer diameter of a shaft of the screw and smaller than an outer diameter of a head of the screw, and the recessed portion is formed to have an inner diameter larger than the outer diameter of the head of the screw.

A cold shrinkable termination has an electric power cable, an insulation body, and a stress control tube. The electric power cable has a conductor core, an insulation layer covering the conductor core, and a conductive shielding layer covering the insulation layer. The insulation body has a first end portion and an opposite second end portion. The stress control tube is disposed in the insulation body adjacent to the second end portion of the insulation body. The stress control tube has a first tube portion directly overlapped on the insulation layer of the electric power cable, and a second tube portion directly overlapped on the conductive shielding layer of the electric power cable and extending a predetermined length thereon when the cold shrinkable termination is mounted on the electric power cable.

A coaxial radio frequency (RF) isolator is disclosed. The isolator can include an input connector, an output connector, and a conductive body. The isolator can also include an outer shield surrounding a portion of the body. The isolator can further include a coupler within the outer shield and forming a cavity between an inner surface of the body and the coupling member. The coupler can be configured to electrically couple with the outer shield. Additionally, the isolator can include a coaxial circuit surrounding a portion of the coupler within the cavity. Further, the isolator can include a toroid surrounding a portion of the coupler and positioned within the cavity. Moreover, the isolator can include a signal conditioning circuit electrically configured to condition signals communicated between the input connector and the output connector.

A printed circuit board (PCB) assembly includes a PCB and a high current interconnect mounted on the PCB. The high current interconnect is configured to electrically couple a first high current bladed component, a second high current bladed component, and a trace disposed on the PCB. The high current interconnect includes feet made of a conductive material that are coupled to the PCB. The trace is coupled to the feet via a weld.

An electronic device comprising a package comprising an encapsulated electronic chip, at least one at least partially exposed electrically conductive carrier lead for mounting the package on and electrically connecting the electronic chip to a carrier, and at least one at least partially exposed electrically conductive connection lead, and an electronic member stacked with the package so as to be mounted on and electrically connected to the package by the at least one connection lead.

Various pattern transfer and etching steps can be used to create features. Conventional photolithography steps can be used in combination with pitch-reduction techniques to form superimposed, pitch-reduced patterns of crossing elongate features that can be consolidated into a single layer. Planarizing techniques using a filler layer and a protective layer are disclosed. Portions of an integrated circuit having different heights can be etched to a common plane.