Patent classifications
H01R9/00
PLUGGABLE MM-WAVE MODULE FOR RACK SCALE ARCHITECTURE (RSA) SERVERS AND HIGH PERFORMANCE COMPUTERS (HPCS)
Embodiments of the invention include an active mm-wave interconnect. In an embodiment, the active mm-wave inter-connect includes a dielectric waveguide that is coupled to a first connector and a second connector. According to an embodiment, each of the first and second connectors may include a mm-wave engine. In an embodiment, the mm-wave engines may include a power management die, a modulator die, a demodulator die, a mm-wave transmitter die, and a mm-wave receiver die. Additional embodiments may include connectors that interface with predefined interfaces, such as small form-factor pluggables (SFP), quad small form-factor pluggables (QSFP), or octal small form-factor pluggables (OSFP). Accordingly, embodiments of the invention allow for plug and play functionality with existing servers and other high performance computing systems.
Method of manufacturing coil component
A metal terminal where a connecting portion has a receiving portion which receives a wire and a contact segment which extends from the receiving portion by way of a bending scheduled portion is prepared. By applying heat and pressure in a state where the wire is placed on the receiving portion for temporarily fixing the wire, the wire is adhered to the receiving portion using a molten or softened insulating resin coating as an adhesive agent. Next, the connecting portion is bent by way of the bending scheduled portion such that the contact segment faces the receiving portion by way of the wire and the contact segment is brought into contact with the wire. Next, by irradiating a laser beam to a portion of the metal terminal, the wire and the metal terminal are welded to each other.
Package substrate
A package substrate includes a dielectric layer, a first circuit layer, a second circuit layer and at least one electrically conductive pole. The dielectric layer includes a first side and a second side opposite to the first side. The first circuit layer is located at the first side of the dielectric layer, and includes a plurality of spaced first circuit patterns embedded into the dielectric layer. The second circuit layer is located at the second side of the dielectric layer, and includes a plurality of spaced second circuit patterns located on the second side the dielectric layer. The electrically conductive pole electrically couples the first circuit layer to the second circuit layer. Each of the first circuit patterns has an extension direction from the first side toward the second side, and has widths gradually decreasing along the extension direction.
Terminal block of rotating electric machine
A terminal block of a rotating electric machine includes a terminal block main body, a high-current electrical wire connecting section to which a high-current electrical wire of the rotating electric machine is connected, multiple neutral wire connecting sections to which neutral wires of the rotating electric machine are connected, and a bus bar that connects the neutral wire connecting sections to each other.
Terminal block of rotating electric machine
A terminal block of a rotating electric machine includes a terminal block main body, a high-current electrical wire connecting section to which a high-current electrical wire of the rotating electric machine is connected, multiple neutral wire connecting sections to which neutral wires of the rotating electric machine are connected, and a bus bar that connects the neutral wire connecting sections to each other.
INSULATING COVER AND TERMINAL BLOCK WITH INSULATING COVER
An insulating cover that is attached to a terminal block having at least two bus bars and a terminal block-side insulating wall that is provided between the two bus bars. The insulating cover includes a cover-side insulating wall in which a first wall surface faces a first wall surface of the terminal block-side insulating wall; and a connecting wall that strikes the terminal block-side insulating wall and restricts attachment when attempting to attach the insulating cover such that a second wall surface of the cover-side insulating wall faces a second wall surface of the terminal block-side insulating wall.
Antenna assembly
An antenna assembly includes an antenna body formed of a sheet metal, an electric cable, and a conductive film. The antenna body includes at least one crimp portion. The conductive film has a main portion and at least one connected portion extending from the main portion. The electric cable has a conductor portion 46. The at least one crimp portion is crimped to the conductor portion in a state that at least one connected portion lies between the conductor portion and the at least one crimp portion.
Busbar
The present invention refers to a busbar for electrically connecting a plurality of cells of a battery module. In order to electrically disconnect the battery cells from each other upon thermal runaway of at least one of the cells or short circuit, the busbar includes a core and a shell at least partially made of a first material, said first material being an electrically conducting material, wherein the core is at least partially made of a second material having a coefficient of thermal expansion which is significantly higher than the coefficient of thermal expansion of the first material.
Busbar
The present invention refers to a busbar for electrically connecting a plurality of cells of a battery module. In order to electrically disconnect the battery cells from each other upon thermal runaway of at least one of the cells or short circuit, the busbar includes a core and a shell at least partially made of a first material, said first material being an electrically conducting material, wherein the core is at least partially made of a second material having a coefficient of thermal expansion which is significantly higher than the coefficient of thermal expansion of the first material.
Case having terminal insertion portion for an external connection terminal
A semiconductor device includes: a base plate; an insulating substrate provided on an upper surface of the base plate; a conductive pattern provided on an upper surface of the insulating substrate; a semiconductor chip mounted on an upper surface of the conductive pattern; a case surrounding the base plate, the insulating substrate, the conductive pattern, and the semiconductor chip; a sealing resin sealing an interior of the case; and an external connection terminal provided to the case. One end portion of the external connection terminal is connected to the conductive pattern, the case has a terminal insertion portion enabling insertion of the other end portion of the external connection terminal in a peripheral wall portion thereof, and a portion of the external connection terminal other than the other end portion is sealed by the sealing resin with the other end portion being inserted in the terminal insertion portion.