The embodiments of the present invention provide a shielded connector having improved shielding effectiveness to reduce electromagnetic interference (EMI). Some of the various embodiments provide high-speed electrical connectors capable of carrying gigabyte data rate signals. The shielding may employ, among other things, one or more shielding structures to reduce the EMI associated with these and other signals. The shielding structures may be oriented to reduce or limit the apertures within the connector through which EMI can penetrate. For example, some embodiments for a universal serial bus (USB) connector may support both a USB 3.0 and USB 2.0. For these embodiments, a grounding tab or peg may be placed in the rear of the connector between the USB 3.0 and the USB 2.0 connections to divide the aperture for the port into a plurality of sections. The grounding tab or peg may also serve as a structural support for the connector.

A method and apparatus for board-to-board circuit connection. In one example, a connector system includes a printed circuit board having a first set of electrical pads and at least one electrical component positioned between the first set of electrical pads and an adapter frame. The adapter frame includes a second set of electrical pads on a bottom surface and connected to the first set of electrical pads of the printed circuit board and a third set of electrical pads on a top surface and electrically connected to the second set of electrical pads. The adapter frame further includes a chamber configured to house the at least one electrical component and having electrical shielding that forms at least a partial Faraday cage around the at least one electrical component. A connector receptacle having a set of pins is connected to the third set of electrical pads.

Provided is a multilayer wiring substrate capable of achieving excellent conduction reliability. The multilayer wiring substrate is formed by laminating an anisotropic conductive member including an insulating base which is made of an inorganic material, a plurality of conductive paths which are made of a conductive member, penetrate the insulating base in a thickness direction thereof and are provided in a mutually insulated state, and a pressure sensitive adhesive layer which is provided on a surface of the insulating base, in which each conductive path has a protrusion protruding from the surface of the insulating base, and a wiring substrate having a substrate and one or more electrodes to be formed on the substrate, and conductive paths which come into contact with the electrode among the plurality of conductive paths are deformed so that adjacent conductive paths come into contact with each other.

Embodiments of the invention include LED lighting systems and methods. For example, in some embodiments, an LED lighting system is included. The LED lighting system can include a flexible layered circuit structure that can include a top thermally conductive layer, a middle electrically insulating layer, a bottom thermally conductive layer, and a plurality of light emitting diodes mounted on the top layer. The LED lighting system can further include a housing substrate and a mounting structure. The mounting structure can be configured to suspend the layered circuit structure above the housing substrate with an air gap disposed in between the bottom thermally conductive layer of the flexible layered circuit structure and the housing substrate. The distance between the layered circuit structure and the support layer can be at least about 0.5 mm. Other embodiments are also included herein.

Embodiments of the invention include LED lighting systems and methods. For example, in some embodiments, an LED lighting system is included. The LED lighting system can include a flexible layered circuit structure that can include a top thermally conductive layer, a middle electrically insulating layer, a bottom thermally conductive layer, and a plurality of light emitting diodes mounted on the top layer. The LED lighting system can further include a housing substrate and a mounting structure. The mounting structure can be configured to suspend the layered circuit structure above the housing substrate with an air gap disposed in between the bottom thermally conductive layer of the flexible layered circuit structure and the housing substrate. The distance between the layered circuit structure and the support layer can be at least about 0.5 mm. Other embodiments are also included herein.

A connector including a shield case including a first shell and a second shell, a body housed in the shield case, and a terminal held by the body. The first shell includes a connecting portion of tuboid shape extending in a first direction, and a cover extending in the first direction contiguously from the connecting portion. The second shell is a separate member from the first shell and attached to the cover. The second shell and the cover constitute a composite tube extending in a second direction, which is orthogonal to the first direction, or in an oblique direction, which includes components of the first and second directions. The terminal includes a first portion, which extends in the first direction and is disposed inside the connecting portion, and a second portion, which extends in the second direction or the oblique direction and is disposed inside the composite tube.

A terminal row for a terminal device, which can be attached to an electronics housing in an insertion direction and which can be connected to an electronic component that is to be accommodated in the electronics housing, has a predetermined number of single electrical conductors or connectors connected thereto to produce a connection between the single electrical conductors or connectors and the electronic component. The terminal row includes a plurality of main housings, at least two of the plurality of main housings being different, wherein the main housings are separate from one another in a pre-assembly state and configured to be attached to one another in a row direction to form the terminal row.

An electrical connector assembly includes an insulating body provided with an accommodating cavity, a metal member retained to the outside of the insulating body, and a first connector disposed in the accommodating cavity. The accommodating cavity has two opposite side walls. The metal member has two side plates and two urging portions respectively connected to the two side plates. The urging portions are disposed in the accommodating cavity. Each of the side walls is disposed between the corresponding urging portion and the corresponding side plate. The first connector has a first metal casing. Each of the urging portions urges the first metal casing, and each of the urging portions is located between the first metal casing and the corresponding side wall.

Connecting structures to mechanically connect to a connector receptacle tongue and a printed circuit board and to electrically connect contacts on the connector receptacle tongue to traces on the printed circuit board. One example may provide an interposer having a housing and a plurality of contacts to connect a vertical tongue to a horizontal printed circuit board. The contacts may have a side or tongue connecting portion extending beyond a side of the housing and a bottom or board contacting portion extending beyond a bottom of the housing. The contacts may form a ninety-degree bend. A shield may at least substantially surround a vertical side of the housing.

Connecting structures to mechanically connect to a connector receptacle tongue and a printed circuit board and to electrically connect contacts on the connector receptacle tongue to traces on the printed circuit board. One example may provide an interposer having a housing and a plurality of contacts to connect a vertical tongue to a horizontal printed circuit board. The contacts may have a side or tongue connecting portion extending beyond a side of the housing and a bottom or board contacting portion extending beyond a bottom of the housing. The contacts may form a ninety-degree bend. A shield may at least substantially surround a vertical side of the housing.