According to an aspect of the present disclosure, provided is a DC converter, including a main housing having an accommodation space formed therein; a cooling module which is coupled to the main housing to partition the accommodation space into a plurality of spaces and to discharge heat generated in the accommodation space to the outside; an inductor module which is accommodated in any one space of the spaces partitioned into a plurality and located adjacent to the cooling module; and a capacitor module which is accommodated in the other one space of the spaces partitioned into a plurality and located adjacent to the cooling module.

Three-phase interleaved resonant converters with integrated magnetics are described. In various examples, transformers are integrated into a transformer core of a converter. A primary side circuit includes a set of circuit segments corresponding to phases of the three-phase interleaved converter. Each of the circuit segments include an integrated winding component that provides a transformer primary winding and a resonant inductor connected in series.

A power converter module includes power transistors and a substrate having a first surface and a second surface that opposes the first surface. A thermal pad is situated on the second surface of the substrate, and the thermal pad is configured to be thermally coupled to a heat sink. The power converter module also includes a control module mounted on a first surface of the substrate. The control module also includes control IC chips coupled to the power transistors. A first control IC chip controls a first switching level of the power converter module and a second control IC chip controls a second switching level of the power converter module. Shielding planes overlay the substrate. A first shielding plane is situated between the thermal pad and the first control IC chip and a second shielding plane is situated between the thermal pad and a second control IC chip.

A semiconductor device includes: a semiconductor substrate in which a cell region, an isolation region being a region which is located outward of the cell region, and a termination region including a guard ring region being located outward of the isolation region and an excess region being a region which is located outward of the guard ring region are defined; an insulating layer covering a top surface of the semiconductor substrate in the isolation region and the termination region; a surface electrode located on a portion of the top surface of the semiconductor substrate and a portion of a top surface of the insulating layer in the cell region and the isolation region; and a waterproof layer covering a portion of the insulating layer exposed from the surface electrode. The waterproof layer is spaced apart from the surface electrode.

The invention provides a conversion circuit for converting input voltage into output voltage, including: a full-wave rectifier circuit including first and second branches connected in parallel, and each including a secondary winding and a rectifier switch; a first switch branch connected to midpoint of the first branch, and including first to fourth switches connected in series; a first resonant unit connected between connection node of the first and second switches and midpoint of the second branch; a second resonant unit connected between connection node of the third and fourth switches and midpoint of the second branch; a first primary winding connected in series to the first resonant unit; and a capacitor connected between connection node of the second and third switches and midpoint of the second branch. The conversion circuit of the invention improves conversion efficiency while maintaining smaller voltage stress on switches.

A power system includes a power conversion stage that receives power from an input source and delivers power to a load via a power distribution bus. The power distribution bus may include a DC transformer such as a fixed ratio bus converter or VTM having an equivalent series resistance. A control system samples the voltage delivered by the power conversion stage at a location close to the output of the power conversion stage, and the load voltage at a location close to the load. The samples may be synchronized by means of a data bus that provides communication between a control device and an output monitor. Synchronization may be accomplished within a sampling period that is short relative to changes in the voltages and currents. Each set of samples may be used to determine a value of the bus resistance. Multiple samples may be averaged to improve accuracy in the determination. The determined bus resistance, including the equivalent series resistance of any bus converter, may be used to introduce a negative resistance characteristic in the power conversion stage as a way of compensating for the actual bus resistance without resorting to full bandwidth feedback from the load.

A power system includes a power conversion stage that receives power from an input source and delivers power to a load via a power distribution bus. The power distribution bus may include a DC transformer such as a fixed ratio bus converter or VTM having an equivalent series resistance. A control system samples the voltage delivered by the power conversion stage at a location close to the output of the power conversion stage, and the load voltage at a location close to the load. The samples may be synchronized by means of a data bus that provides communication between a control device and an output monitor. Synchronization may be accomplished within a sampling period that is short relative to changes in the voltages and currents. Each set of samples may be used to determine a value of the bus resistance. Multiple samples may be averaged to improve accuracy in the determination. The determined bus resistance, including the equivalent series resistance of any bus converter, may be used to introduce a negative resistance characteristic in the power conversion stage as a way of compensating for the actual bus resistance without resorting to full bandwidth feedback from the load.

An interleaved LLC converter arrangement includes two or more LLC converters for transferring power from an input side to an output side, wherein the two or more LLC converters include a first LLC converter and a second LLC converter connected in parallel on the input side and on the output side and wherein each LLC converter includes a bridge inverter at the input side. For balancing the power transfer among the LLC converters if for example the second LLC converter transfers more power from the input side to the output side than the first LLC converter, each leg of the bridge of the bridge inverter of the first LLC converter is operated with a duty cycle of 0.5 and at least one leg of the bridge of the bridge inverter of the second LLC converter is operated with a duty cycle different from 0.5.

A power converter includes a transformer, a switching bridge circuit, a resonant tank circuit, an output rectifier, and a controller. The switching bridge circuit includes a plurality of switches, each switch controllable into a conduction mode and into a non-conduction mode. The controller is configured to control the plurality of switches based on a series of phase shift modulation switching cycles, each cycle comprising a control period and a delay period. During the control period, the controller causes the conduction mode of each switch of the plurality of switches to overlap a portion of each conduction mode of two other switches. During the delay period, the controller controls all of the switches into non-conduction modes overlapping in time.

A power conversion device includes an electronic component, a first printed circuit board, a first cooling body, a second printed circuit board, a second cooling body, and a first wiring member. The power conversion device further includes a first insulating member. On a first main surface of the first printed circuit board, a first joint portion to which the first wiring member is joined is provided. Between a second main surface of the first printed circuit board and the first cooling body, the first insulating member is arranged on a rear surface of at least the first joint portion.