A method includes calculating power consumption of a DC-DC converter, controlling the DC-DC converter so that an output direct current voltage output from the DC-DC converter becomes higher than a target voltage preset in the DC-DC converter when a power consumption is less than first power, and controlling the DC-DC converter so that the output direct current voltage output from the DC-DC converter becomes lower than the target voltage when the power consumption exceeds second power greater than the first power.

An inline DC feeder DC/DC voltage step-up harness for photovoltaic solar facilities includes a housing, a plurality of PV input connectors, an at least one PV output connector. The housing incorporates a DC/DC converter, and has an input and an output. The plurality of PV input connectors are operatively connected to the housing at the input. The PV output connector is operatively connected to the housing at the output.

The disclosure provides a full-bridge resonant converter, including a full-bridge switching circuit, a transformer, a resonance tank, a secondary side circuit, and a damping circuit. The secondary side circuit includes a first output diode and a second output diode. When the current value of a current flowing through the first output diode and the second output diode is resonated to zero amperes, and a resonant current flowing through the resonance tank does not flow through a primary side winding of the transformer at all, the transformer and the secondary side circuit jointly provide an equivalent capacitance, and the damping circuit and the equivalent capacitance jointly perform a damping operation on the resonant current.

A system is disclosed. The system includes a substrate, and a first chip on the substrate, where a load circuit is integrated on the first chip. The system also includes a second chip on the substrate, where a power delivery circuit is configured to deliver current to the load circuit according to a regulated voltage at a node. The power delivery circuit includes a first circuit configured to generate an error signal based at least in part on the regulated voltage, and a voltage generator including power switches configured to modify the regulated voltage according to the error signal, where the first circuit of the power delivery circuit is integrated on the first chip, and where at least a portion of the power switches of the power delivery circuit are integrated on the second chip.

A DC/DC power converter converts voltage at an input of the DC/DC power converter to a voltage at an output of the DC/DC power converter, where the output voltage is a multiple of the input voltage. The DC/DC power converter comprises two switching circuits electrically connected in series, two capacitors electrically connected in series, and a resonant circuit comprising a resonant capacitor and a resonant inductor. The series connection of the two capacitors is electrically connected in parallel to the series connection of the two switching circuits. The resonant circuit is electrically connected to the two switching circuits. A first capacitor of the two capacitors is electrically connected in parallel to the input. Each switching circuit comprises two switching units electrically connected in series, wherein each switching unit comprises two or more switches electrically connected in series.

The original Abstract is canceled in favor of the new Abstract presented on the following page.

A power system, related to the field of electronic power. The power system includes a centralized controller and three power modules. Each phase of an alternating current power supply is connected to one power module, and an input end of each power module is connected to one phase of the alternating current power supply. Each power module includes a low voltage controller and at least two power units. Each power unit includes a unit controller. The centralized controller is connected to each low voltage controller by using a bus. The centralized controller sends a control signal to each unit controller by using each low voltage controller, to control the unit controller and/or a power conversion circuit. The power system can implement hot swap of the power module and improve on-site operation reliability.

A hydrogen production power supply system is provided by the present disclosure, wherein two stage conversion modules are arranged between the power supplies, and each output end of the second stage conversion module is connected to a power supply end of each hydrogen production device, respectively, so that independent power supply is provided for each hydrogen production device, which eliminates the loss of gas production caused by the non-uniform load among the hydrogen production devices. In addition, being different from the conventional technology, it is unnecessary for the hydrogen production power supply system to adapt the voltage by using a customized power frequency converter in the present disclosure. Therefore, the path loss issue can be avoided.

A semiconductor composite device is provided that includes a voltage regulator, a package board, and a load, and converts an input DC voltage into a different DC voltage to supply the converted DC voltage to the load. The VR includes a semiconductor active element. The package board includes a C layer in which a capacitor is formed, and an L layer in which an inductor is formed. A plurality of through holes penetrate the C layer and the L layer in a direction perpendicular to the mounting face in the package board. The capacitor is connected to the load through the through hole. The inductor is connected to the load through the through hole and to the VR through the through hole.

A processor substrate includes: an electrically insulating material having a first main side and a second main side opposite the first main side; a plurality of electrically conductive structures embedded in the electrically insulating material and configured to provide an electrical interface at the first main side of the electrically insulating material and to provide electrical connections from the electrical interface to the second main side of the electrically insulating material; and a power device module embedded in the electrically insulating material and configured to convert a voltage provided at the second main side of the electrically insulating material and which exceeds a voltage limit of the processor substrate to a voltage that is below the voltage limit of the processor substrate. An electronic system that includes the processor substrate is also described.

An electronics assembly includes a plurality of planar conductive metal sheets including a first conductive metal sheet, a second conductive metal sheet attached and electrically coupled to the first metal sheet, and a third conductive metal sheet attached and electrically coupled to the second metal sheet. The second metal sheet is located between the first and third conductive metal sheets. Air gaps are defined in the plurality of planar conductive metal sheets to form metal traces that define electrically isolated conductive paths from an outer surface of the first conductive metal sheet to an outer surface of the third conductive metal sheet in a multilevel conductive wiring network. The multilevel conductive wiring network can be attached and electrically coupled to a microchip and to one or more capacitors to form a power converter.