The power converter A1 includes a semiconductor device B1, and a substrate H on which the semiconductor device B1 is mounted, where the semiconductor device B1 includes a control chip constituting a primary control circuit, a semiconductor chip constituting a secondary power circuit, and a transmission circuit for electrically insulating the primary control circuit and the secondary power circuit and for signal transmission between the primary control circuit and the secondary power circuit. The substrate H has a conductive portion K. The power converter A1 includes a connecting terminal T1 disposed on the substrate H and electrically connected to the conductive portion K. The power converter A1 includes a conductive path D1 that is at least partially formed by the conductive portion K of the substrate H, and that electrically connects the primary control circuit and the connecting terminal T1. Such a configuration contributes to downsizing the power converter A1.

The disclosure herein relates to an electric power converter in which a power module accommodating a switching element for electric power conversion is in contact with a cooler, and provides a structure capable of effectively cooling the power module. An electric power converter includes coolers in contact with a power module. A stacked body of the power module and the coolers is accommodated in a case. The surface of the first cooler opposite to the power module is in contact with the case, and an output bus bar is connected to a midpoint terminal and is in contact with the case. The first cooler directly cools the power module by one surface, and absorbs heat from the power module transferred via the midpoint terminal and the output bus bar by another surface.

A packaged power semiconductor device includes a power semiconductor wafer, a heat conduction layer, and a heat sink that are sequentially stacked, and a sealing part configured to wrap and seal the power semiconductor wafer and at least part of the heat conduction layer. The packaged power semiconductor device further includes a pin, where the pin includes a connection segment wrapped inside the sealing part, and an extension segment located outside the sealing part. The connection segment is electrically connected to the power semiconductor wafer, and a shortest distance between the extension segment and a first outer surface is greater than a creepage distance corresponding to a highest working voltage of the power semiconductor wafer. This can avoid a creepage phenomenon of the pin by limiting a distance between the first outer surface and the extension segment that is of the pin and that is exposed outside the sealing part.

A capacitor module includes a smoothing capacitor, a P-side Y capacitor and a N-side Y capacitor as noise absorbing capacitors, a capacitor case, a P-side bus bar, a N-side bus bar, and a ground bus bar. A virtual plane along a P-side electrode surface, which is an electrode surface on a high potential side of the smoothing capacitor, is referred to as a P-side virtual plane. A virtual plane along a N-side electrode surface, which is an electrode surface on a low potential side of the smoothing capacitor, is referred to as a N-side virtual plane. A region between the P-side virtual plane and the N-side virtual plane is defined as a PN region. The entire noise absorbing capacitor and the entire ground bus bar are arranged in the PN region.

A liquid immersion cooling system includes a tank defining a tank interior configured to receive electronic components (e.g., servers) and a thermally conductive dielectric liquid to cool the electronic components. The liquid immersion cooling system also includes a power shelf external to the tank interior, where the power shelf includes a converter configured to receive an alternating current (AC) power supply and convert the AC power supply to a direct current (DC) power supply. The liquid immersion cooling system also includes a DC bus configured to route the DC power supply from the power shelf, into the tank interior, and to the electronic components.

An electrical device with buoyancy-enhanced cooling is provided. The electrical device includes a housing having a first portion including a heat sink and a second portion coupled to the first portion. The heat sink includes a plurality of hollow fins. A cover plate is positioned within the housing and is coupled to the first portion of the housing. The cover plate defines openings between an interior of the housing and the plurality of hollow fins and the openings are located at each end of each hollow fin. Further, an electrical component is positioned within the interior of the housing. Air heated by the electrical component is permitted to circulate within the housing and is directed through the hollow fins based on buoyancy forces (e.g., such that the air is permitted to cool within the hollow fins based on conduction, convection, and/or radiation).

An inverter includes a case, and the case includes an upper case and a lower case attached to a bottom surface side of the upper case. The upper case includes a flange portion constituting an attachment portion of the lower case, and a connector connecting portion to which a connector is connected. The connector connecting portion includes an outer wall portion that forms an outer wall of the connector connecting portion. At least a part of the flange portion and at least a part of the outer wall portion are disposed so as to overlap each other in a direction in which the connector connecting portion and the structure face each other.

An inverter includes a DC input, a link capacitor including a plurality of input contacts fitted to a capacitor housing, a plurality of half-bridges, each including semiconductor switching elements for converting the DC current into an AC current having a plurality of phase currents, wherein the half-bridges are arranged in a row along a transverse direction to the inverter, a positive DC conductor rail and a negative DC conductor rail for the infeed of DC current to the half-bridges, wherein the positive and/or negative DC conductor rail extends in a transverse direction to the inverter over the row of half-bridges, such that the width of the positive and/or negative DC conductor rail extends to the width of the row of half-bridges, an AC conductor rail assembly for the output of AC current to the electric drive, and a cooler for cooling the half-bridges.

A transistor package comprising: a substrate; a first transistor in thermal contact with the substrate, wherein the transistor comprises a gate; the substrate sintered to a heat sink through a sintered layer; an encapsulant that at least partially encapsulates the first transistor; and a Kelvin connection to the transistor gate.

A power module including at least one substrate, a housing arranged on the at least one power substrate, a first terminal electrically connected to the at least one power substrate, a second terminal including a contact surface, a third terminal electrically connected to the at least one power substrate, a plurality of power devices arranged on and connected to the at least one power substrate, and the third terminal being electrically connected to at least one of the plurality of power devices. The power module further including a base plate and a plurality of pin fins arranged on the base plate and the plurality of pin fins configured to provide direct cooling for the power module.