The present invention provides a Pulse Width Modulation (PWM) method for a Cascaded H-bridge (CHB) converter. Each phase of the converter is provided with n Cascaded H-bridge rectifier circuits, or may also be provided with n Cascaded H-bridge rectifier circuits+1 redundant H-bridge rectifier circuit. The method includes following steps of: S1, generating groups of sinusoidal signals as reference waveforms, and generating n carrier signals having sequentially decreasing levels and equal amplitudes to correspond to the H-bridge rectifier circuit at the first to the n.sup.th levels, where the levels of the n carrier signals are cascaded to fill the voltage amplitude of a unipolar half cycle of the reference waveform; and S2, determining PWM signals for controlling power transistors of the corresponding H-bridge rectifier circuits based on each reference waveform and each carrier signal. According to the present invention, the CHB converter allows the MV grid to be directly coupled with a LV side without a conventional transformer, which reduces the heat loss and balances the distribution of heat loss between the power transistors and between the H-bridges at all levels, thus prolonging the service life.

A converter apparatus includes a string of electrically interconnected modules that includes a first group of modules comprising a first module and a second group of modules comprising a second module. A first screen is connected to a first defined electric potential and is located adjacent the first group of modules and a second screen is connected to a second defined electric potential and is located adjacent the second group of modules. During operation of the converter apparatus a resonance loop is created from the first module via the first and second screens and the second module back to the first module. A damping unit is located in the resonance loop and is set to dampen electromagnetic noise.

A power converter arrangement with a modular multi-level converter which includes a series circuit of switch modules which each have a plurality of semiconductor switches and an energy source. Some of the switch modules are of a first type and others of the switch modules are of a second type. During operation, a positive switch module voltage, a negative voltage module voltage, or a null voltage is generated at connection terminals of the switch modules of the first type, and a positive switch module voltage or a null voltage can be generated at connection terminals of the switch modules of the second type. The power converter arrangement further contains a support structure having a number of levels, which each have receptacles in which the switch modules are arranged, with both switch modules of the first and second type being arranged in each level of the support structure.

The present invention relates to a power module and a method for manufacturing same, in which an insulating spacer is disposed between two upper and lower substrates to thus efficiently dissipate the heat generated from a semiconductor chip mounted between the substrates, and prevent bending deformation due to heat. In addition, since the spacer made of an insulating material is integrated with the substrates by brazing bonding, the bonding strength is improved, thereby maintaining strong bonding even against vibration, etc.

The power conversion apparatus includes a housing attached to a roof of a vehicle, a heat-receiving block, and one or more heat pipes. The housing has an opening on the top in the vertical direction, and accommodates electronic components. The electronic components are attached to a first main surface, which is one of the main surfaces of the heat-receiving block. The heat-receiving block is attached to the housing and closes the opening. The one or more heat pipes are attached to a second main surface, which is the other of the main surfaces of the heat-receiving block, extend in a direction away from the heat-receiving block, and accommodate refrigerant therein.

A noise filter includes a plurality of stages of LC filters composed of a plurality of inductors and a plurality of capacitors. Each inductor has a bus bar, and a core member made from a magnetic body and having a tubular shape surrounding the bus bar. A power conversion device includes a power conversion main circuit, and the noise filter. The plurality of inductors are composed of: a specific bus bar, which is a first bus bar having a plate shape on a positive side and connecting an external power supply and the power conversion main circuit, or a second bus bar having a plate shape on a negative side and connecting the external power supply and the power conversion main circuit; and a plurality of core members surrounding the specific bus bar. The plurality of capacitors are provided between the first bus bar and the second bus bar.

An inverter casing and a connection structure of an inverter and a junction box are provided. The inverter casing includes an upper casing with an inner side that is provided with a cavity for accommodating a circuit board, and an upper surface that is provided with a junction recess for accommodating a junction box that is fixedly installed in the junction recess. Moreover, a bottom part of the junction recess is provided with an elastic protrusion for connecting a high-voltage protection device, and two incoming terminals. The elastic protrusion cooperates with a knockout pin on the junction box for high-voltage power-off protection, and the two incoming terminals are connected with external cables via the junction box.

A magnetic device includes a magnetic core assembly, a first secondary winding, a second secondary winding and a primary winding. The magnetic core assembly includes a first magnetic leg, a second magnetic leg and a third magnetic leg. The first to third magnetic legs are arranged in sequence. The second magnetic leg is disposed between the first magnetic leg and the third magnetic leg. The first secondary winding is disposed between the first magnetic leg and the second magnetic leg, and the second secondary winding is disposed between the second magnetic leg and the third magnetic leg. A first terminal of the primary winding is disposed between the first magnetic leg and the second magnetic leg, and a second terminal of the primary winding is disposed between the second magnetic leg and the third magnetic leg.

A transistor package comprising: a substrate; a first transistor in thermal contact with the substrate, wherein the transistor comprises a gate; the substrate sintered to a heat sink through a sintered layer; an encapsulant that at least partially encapsulates the first transistor; and a Kelvin connection to the transistor gate.

An embodiment discloses an electronic component package comprising: a housing including a flow path arranged on one surface thereof; and an inlet and an outlet arranged on the housing, wherein the flow path includes a first area connected with the inlet and a second area connected with the outlet, the first area includes a guide, and the guide includes an area of which the width gradually widens from the inlet.