According to an aspect of the present disclosure, provided is a DC converter, including a main housing having an accommodation space formed therein; a cooling module which is coupled to the main housing to partition the accommodation space into a plurality of spaces and to discharge heat generated in the accommodation space to the outside; an inductor module which is accommodated in any one space of the spaces partitioned into a plurality and located adjacent to the cooling module; and a capacitor module which is accommodated in the other one space of the spaces partitioned into a plurality and located adjacent to the cooling module.

Provided is a power conversion device capable of reducing an influence of an electromagnetic wave on a circuit board. A power conversion device 1 includes a circuit board 2, a power conversion module 3 disposed to face the circuit board 2, a bus bar 4 connected to the power conversion module 3, and a shielding portion 5 that shields an electromagnetic wave. The bus bar 4 extends from one side S1 to an opposite side S2 of the circuit board 2 along a thickness direction Dt of the circuit board 2 through a side edge 21 of the circuit board 2. The shielding portion 5 is disposed between the bus bar 4 and the side edge 21 of the circuit board 2, extends from the one side S1 to the opposite side S2 of the circuit board 2 along the thickness direction Dt of the circuit board 2, and extends to both sides of the bus bar 4 along the side edge 21 of the circuit board 2.

Provided is a power conversion device, including: a casing that has a front surface with an opening; an insertion component including an insertion portion; and a gasket. The casing has an inner wall surface being in contact with the gasket and a casing-side guide surface. The insertion portion has an outer peripheral surface being in contact with the gasket and an insertion component-side guide surface. When a distance in the insertion direction between the front surface and an end of the casing-side guide surface, which is closer to the front surface in the insertion direction, is represented by L1 and a distance between an inner surface of the gasket in the insertion direction and a distal end of the insertion component-side guide surface in the insertion direction is represented by L2, the distance L2 is set larger than the distance L1.

A sub-module is disclosed. A sub-module according to an embodiment of the present invention comprises a short-circuiting control part. The short-circuiting control part comprises a movable member slidably coupled to a frame on which capacitor assemblies are seated. A variable connector is coupled to the movable member. Moreover, a plurality of short-circuiting blocks are arranged on the frame while being spaced away from each other. When the movable member has slid, the variable connector comes into contact with one or more short-circuiting blocks adjacent to each other to be electrically conductive. The short-circuiting blocks are connected to the capacitor assemblies, respectively, to be electrically conductive. Therefore, a plurality of capacitor elements can be short-circuited simultaneously only by moving the movable member.

Disclosed herein is a charger for charging electric vehicles. In one embodiment, the charger includes M AC/DC converters, a DC bus, N DC/DC converters, and D energy exchange ports. The M AC/DC converters are configured to be coupled to a power source at an input side of the M AC/DC converters. The DC bus is connected to an output side of each of the M AC/DC converters. The N DC/DC converters are coupled to the DC bus at an input side of the N DC/DC converters. The D energy exchange ports are coupled to an output side of one or more of the N DC/DC converters at an input side of the D energy exchange ports, and each of the D energy exchange ports is configured to be coupled to an electric vehicle, where N>M, and where an energy storage is coupled to the DC bus.

An integrated magnetic component is disclosed in this application, which includes an integrated magnetic core and a PCB winding, and there are even-number layers of PCB windings. The integrated magnetic core includes M magnetic pillars that are symmetrically distributed, and every two of the M magnetic pillars form one group. On each layer of PCB winding, a current path is divided into M paths around the M magnetic pillars; after every two of the M current paths are combined, a current obtained through combination flows around one magnetic pillar in each group of magnetic pillars by N turns, and flows around the other magnetic pillar in each group of magnetic pillars by N turns.

A power converter module includes power transistors and a substrate having a first surface and a second surface that opposes the first surface. A thermal pad is situated on the second surface of the substrate, and the thermal pad is configured to be thermally coupled to a heat sink. The power converter module also includes a control module mounted on a first surface of the substrate. The control module also includes control IC chips coupled to the power transistors. A first control IC chip controls a first switching level of the power converter module and a second control IC chip controls a second switching level of the power converter module. Shielding planes overlay the substrate. A first shielding plane is situated between the thermal pad and the first control IC chip and a second shielding plane is situated between the thermal pad and a second control IC chip.

A semiconductor device includes: a semiconductor substrate in which a cell region, an isolation region being a region which is located outward of the cell region, and a termination region including a guard ring region being located outward of the isolation region and an excess region being a region which is located outward of the guard ring region are defined; an insulating layer covering a top surface of the semiconductor substrate in the isolation region and the termination region; a surface electrode located on a portion of the top surface of the semiconductor substrate and a portion of a top surface of the insulating layer in the cell region and the isolation region; and a waterproof layer covering a portion of the insulating layer exposed from the surface electrode. The waterproof layer is spaced apart from the surface electrode.

Presented are metal-coated, polymer-encapsulated power semiconductor modules, methods for making/using such power modules, and vehicles with traction power inverters containing such power modules. A power electronics assembly includes one or more power semiconductor modules packaged inside an assembly housing. Each power module includes a substrate, a semiconductor device mounted on the substrate, a polymeric encapsulant encasing therein the substrate and semiconductor device, and an electrical lead connected to the semiconductor device and projecting from the polymeric encapsulant. A metallic or ceramic coating is applied to select sections of the polymeric encapsulant's exposed exterior surface. The metallic/ceramic coating may be a single metallic layer that covers substantially all of the exposed surface area of the polymeric encapsulant's exterior surface. An optional hydrophobic polymer layer, passivated layer, and/or oxidized layer may cover the exterior surface of this metallic layer. Alternatively, another metallic layer or intercalated lamellar microstructures may cover the metallic layer.

A display device includes: a transformer including a core including a first surface and a protrusion protruding from the first surface along a direction which the first surface faces, wherein a cross-section of a first portion of the protrusion perpendicular to the direction which the first surface faces has a first area and a cross-section of a second portion of the protrusion between the first portion and the first surface has a second area that is larger than the first area; a first inductor sub-assembly including a first bobbin having a first opening corresponding to the first area, to be in contact with an outer circumference of a first portion of the core, and an inductor wound around the first bobbin; and a second inductor sub-assembly including a second bobbin having a second opening corresponding to the second area, to be in contact with an outer circumference of a second portion of the core, and an inductor wound around in the second bobbin.