H02M7/00

Electromagnetic emission rejection filter in hybrid/electric vehicles

The disclosure describes techniques to filter unwanted noise from feedback signals of an electrical machine. An electrical machine may receive AC power from an inverter and circuitry in the inverter may cause noise on the AC power signals to the electrical machine. The noise may couple to sensors for the electrical machine and cause noise in the sensor output signals. The sensor output signals may provide feedback for a closed loop control system for the electrical machine and noise may impact the closed loop operation. Also, the noise in the feedback signals may cause electromagnetic compatibility (EMC) issues, either by direct radiated emissions or by coupling to other circuits in the vehicle wiring harness as the feedback signals travel from the electrical machine. The techniques of this disclosure may include filter circuitry located near or inside the electrical machine that filters out the unwanted noise in the feedback signals.

Converter arrangement

A converter apparatus includes a string of electrically interconnected modules that includes a first group of modules comprising a first module and a second group of modules comprising a second module. A first screen is connected to a first defined electric potential and is located adjacent the first group of modules and a second screen is connected to a second defined electric potential and is located adjacent the second group of modules. During operation of the converter apparatus a resonance loop is created from the first module via the first and second screens and the second module back to the first module. A damping unit is located in the resonance loop and is set to dampen electromagnetic noise.

Inverter device
11695346 · 2023-07-04 · ·

An inverter device intended to convert a DC voltage into three phases of a polyphase AC voltage with a predetermined frequency, the inverter device comprising three single-phase inverters, each of the three single-phase inverters being able to deliver one of the three phases.

Power conversion device
11696424 · 2023-07-04 · ·

The power conversion device includes: a housing; an electric wiring board stored in the housing; a first heat generating component provided on the one surface of the electric wiring board; a second heat generating component which has a lower heat generation density than the first heat generating component and of which a protruding height from the electric wiring board is equal to or smaller than a protruding height of the first heat generating component, the second heat generating component being provided on the one surface of the electric wiring board; and a third heat generating component which has a lower heat generation density than the first heat generating component and of which a protruding height from the electric wiring board is greater than the protruding height of the first heat generating component, the third heat generating component being provided on another surface of the electric wiring board.

Electric power converter
11695347 · 2023-07-04 · ·

Obtain an electric power converter by which a downsizing and a low cost can be realized in such a way that main components are standardized. A transformer and rectifier elements of a rectifier circuit are configured by using a single module, and a center tap is configured by laminating one pullout portion of a first secondary winding and one pullout portion of a second secondary winding, and a central connecting component is connected to a center tap and a terminal of a smoothing coil which composes a smoothing reactor.

High power multilayer module having low inductance and fast switching for paralleling power devices

A power module including at least one substrate, a housing arranged on the at least one power substrate, a first terminal electrically connected to the at least one power substrate, a second terminal including a contact surface, a third terminal electrically connected to the at least one power substrate, a plurality of power devices arranged on and connected to the at least one power substrate, and the third terminal being electrically connected to at least one of the plurality of power devices. The power module further including a base plate and a plurality of pin fins arranged on the base plate and the plurality of pin fins configured to provide direct cooling for the power module.

SEMICONDUCTOR DEVICE, SEMICONDUCTOR MODULE, AND POWER CONVERSION APPARATUS
20230006571 · 2023-01-05 · ·

An object is to provide a technique capable of improving the power efficiency of a semiconductor device. The semiconductor device includes first to sixth parallel connection bodies, each including a semiconductor switching element and a diode connected in antiparallel to the semiconductor switching element. At least one of the voltage drops of the second parallel connection body and the third parallel connection body is smaller than a voltage drop of at least one of the first parallel connection body, the fourth parallel connection body, the fifth parallel connection body, and the sixth parallel connection body.

SYSTEMS AND METHODS FOR POWER DISTRIBUTION FOR AMPLIFIER ARRAYS

Systems and apparatuses are disclosed that include a distributed power system configured to provide power to a number of loads. The system includes power converters configured to receive DC power from a common power source, each of the plurality of power converters configured to provide DC power to a corresponding load from. Each of the power converters is positioned proximal to the corresponding load that it powers.

ELECTRICAL CIRCUIT FOR REDUCING ELECTROMAGNETIC NOISE OR INTERFERENCE IN A POWER CONVERTER
20230006542 · 2023-01-05 ·

An electrical circuit for reducing electromagnetic noise or interference in a power converter. The circuit includes at least one shunt capacitor arranged to connect with a grounded component of the power converter, wherein the at least one shunt capacitor is further arranged to be driven by an active control signal so as to sink a noise current originating from a noise source to the grounded component of the power converter, wherein the noise source is connected to the grounded component via a capacitive path formed by at least one stray capacitors.

Semiconductor package having an additional material with a comparative tracking index (CTI) higher than that of encapsulant resin material formed between two terminals

A semiconductor device includes a first switching element; a second switching element; a first metal member; a second metal member; a first terminal that has a potential on a high potential side; a second terminal that has a potential on a low potential side; a third terminal that has a midpoint potential; and a resin part. A first potential part has potential equal to potential of the first terminal. A second potential part has potential equal to potential of the second terminal. A third potential part has potential equal to potential of the third terminal. A first creepage distance between the first potential part and the second potential part is longer than a minimum value of a second creepage distance between the first potential part and the third potential part and a third creepage distance between the second potential part and the third potential part.