An adaptive wearable article can include an electroadhesive clutch secured to a textile and extending around at least a portion of an opening. The clutch can include a first conductive member and a first polymeric substrate applied to the first conductive member and having a stiffness greater than a stiffness of the first conductive member, and the clutch can include a second electrode assembly comprising a second conductive member configured to partially overlay the first conductive member. The second electrode assembly can include a second conductive member and a second polymeric substrate applied to the second conductive member, the second polymeric substrate having a stiffness greater than a stiffness of the second conductive member, wherein the first and second conductive members are proximate each other with the first and second polymeric substrates distal with respect to each other.

A support garment can include a textile layer forming a supportive region and configured to adjustably permit or inhibit displacement of a body part of the wearer that is positioned adjacent or proximate the supportive region. The garment can include an electroadhesive clutch device to help control displacement. In an example, the garment includes an underwear garment or a portion thereof.

A support garment can include a textile layer forming a supportive region and configured to adjustably permit or inhibit displacement of a body part of the wearer that is positioned adjacent or proximate the supportive region. The garment can include an electroadhesive clutch device to help control displacement. In an example, the garment includes an underwear garment or a portion thereof.

An adaptive article of apparel can include a textile with an opening that is configured to admit a body part of a wearer, and an electroadhesive clutch secured to the textile and extending around at least a portion of the opening. The electroadhesive clutch can be configured to permit or inhibit changing a size of the opening.

An electrostatic chuck includes a base body having a placement surface on which a suction target object is placed, and an electrode embedded in the base body. The base body is provided with a groove that opens to the placement surface-side and does not reach the electrode. Aloes-resistance region made of ceramics and a high-resistance region made of ceramics having a volume resistivity higher than the low-resistance region are sequentially arranged from a side close to the groove between a bottom surface of the groove and the electrode, in a thickness direction of the base body.

An electrostatic chuck includes a base body having a placement surface on which a suction target object is placed, and an electrode embedded in the base body. The base body is provided with a groove that opens to the placement surface-side and does not reach the electrode. Aloes-resistance region made of ceramics and a high-resistance region made of ceramics having a volume resistivity higher than the low-resistance region are sequentially arranged from a side close to the groove between a bottom surface of the groove and the electrode, in a thickness direction of the base body.

One embodiment of the present invention discloses an electrostatic chuck made of an aluminum nitride sintered body, wherein the aluminum nitride sintered body comprises aluminum nitride and a composite oxide formed along the grain boundaries of the aluminum nitride, wherein the composite oxide comprises at least two kinds of rare earth metals which have a solid-solution relationship with each other, and wherein the composite oxide comprises a collection area having a higher oxygen content than a surrounding area.

There is provided an electrostatic attraction device having an electrostatic chuck in which an electrode and a heater are embedded in a dielectric. The device comprises: a DC power source unit having a DC power source configured to supply a DC power to the electrode; a first neutralizing circuit connected to a power supply path between the DC power source and the electrode; and a second neutralizing circuit connected to a power supply path between the first neutralizing circuit and the electrode. The first neutralizing circuit has a first ground relay that connects and disconnects the electrode and the ground via a voltage-drop resistance member, and the second neutralizing circuit has an isolation relay that connects and disconnects the first neutralizing circuit and the second neutralizing circuit, and a second ground relay that is connected to a power supply path between the isolation relay and the electrode and connects and disconnects the electrode and the ground side without going through a resistance member.

An apparatus and a method for monitoring the relative relationship between the wafer and the chuck is provided, especially for monitoring whether the wafer is sticky on the chuck when the wafer is de-chucked. The lift pins may be extended outside the chuck to separate the wafer and the chuck when the wafer is de-chucked. By detecting the capacitance between the de-chucked wafer and the chuck, especially by comparing the detected capacitance with the capacitance that the wafer is held by the chuck, one may determine whether the wafer is sticky on the chuck, or even whether the wafer is properly supported by the lift pins. Accordingly, an early alarm may be issued if the wafer is sticky or improperly removed. Besides, by controlling a switch electrically connected to a lift pin that contacted the wafer, the charges at the wafer may be eliminated.

An apparatus and a method for monitoring the relative relationship between the wafer and the chuck is provided, especially for monitoring whether the wafer is sticky on the chuck when the wafer is de-chucked. The lift pins may be extended outside the chuck to separate the wafer and the chuck when the wafer is de-chucked. By detecting the capacitance between the de-chucked wafer and the chuck, especially by comparing the detected capacitance with the capacitance that the wafer is held by the chuck, one may determine whether the wafer is sticky on the chuck, or even whether the wafer is properly supported by the lift pins. Accordingly, an early alarm may be issued if the wafer is sticky or improperly removed. Besides, by controlling a switch electrically connected to a lift pin that contacted the wafer, the charges at the wafer may be eliminated.