A substrate processing apparatus including an electrostatic chuck on which a substrate is mountable; a ring surrounding the electrostatic chuck, the ring including a first coupling groove; and a first floating electrode in the first coupling groove of the ring, the first floating electrode having a ring shape, wherein a top surface of the first floating electrode is exposed at the ring, and the first floating electrode has a tapered shape including an inclined surface that is inclined in a downward direction toward the electrostatic chuck.

A substrate processing apparatus including an electrostatic chuck on which a substrate is mountable; a ring surrounding the electrostatic chuck, the ring including a first coupling groove; and a first floating electrode in the first coupling groove of the ring, the first floating electrode having a ring shape, wherein a top surface of the first floating electrode is exposed at the ring, and the first floating electrode has a tapered shape including an inclined surface that is inclined in a downward direction toward the electrostatic chuck.

Disclosed embodiments include electroadhesion devices for securing smartphones and other consumer devices to target surfaces. In various embodiments, the electroadhesion device may include a digital switch for adjusting the output voltage generated by a voltage converter. The digital switch may enable safe operation of the electroadhesion device by ensuring the output voltage generated by the voltage converter is compatible with the target surface. To determine a compatible output voltage, the electroadhesion device may include one or more sensors that may measure one or more characteristics of the target surface including conductivity, porosity, hardness, smoothness, and the like.

Disclosed embodiments include electroadhesion devices for securing smartphones and other consumer devices to target surfaces. In various embodiments, the electroadhesion device may include a digital switch for adjusting the output voltage generated by a voltage converter. The digital switch may enable safe operation of the electroadhesion device by ensuring the output voltage generated by the voltage converter is compatible with the target surface. To determine a compatible output voltage, the electroadhesion device may include one or more sensors that may measure one or more characteristics of the target surface including conductivity, porosity, hardness, smoothness, and the like.

A substrate processing apparatus includes a stage on which a substrate is placed, wherein the stage includes a first plate, a first temperature adjustment mechanism configured to control a temperature of the first plate, a second plate provided below the first plate, a second temperature adjustment mechanism configured to control a temperature of the second plate, and a fastening member configured to fasten the first plate and the second plate.

A substrate processing apparatus includes a stage on which a substrate is placed, wherein the stage includes a first plate, a first temperature adjustment mechanism configured to control a temperature of the first plate, a second plate provided below the first plate, a second temperature adjustment mechanism configured to control a temperature of the second plate, and a fastening member configured to fasten the first plate and the second plate.

An insulating system to reduce or eliminate the possibility of arcing while the pressure within a chamber is being varied is disclosed. The system is operable at cryogenic temperatures, such that the insulating system is able to accommodate dimensional changes due to thermal contraction. The insulating system, which includes a housing having one or more bores, is disposed between the two components which are to be electrically connected. An electrical contact, which may be spring loaded, passes through the bore and is used to electrically connect the two components. The ends of the electrical contact are surrounded by an insulating extender which extends from the housing. In one embodiment, a spring-loaded piston is used as the insulating extender. This insulating extender compensates for changes in dimension due to thermal contraction and covers the portion of the electrical contact that extends beyond the outer surface of the housing.

Semiconductor processing systems and method are described that may include flowing deposition precursors into a substrate processing region of a semiconductor processing chamber, where the substrate processing region includes an electrostatic chuck. The methods may further include depositing a seasoning layer on the electrostatic chuck from the deposition precursors to form a seasoned electrostatic chuck. The seasoning layer may be characterized by a dielectric constant greater than or about 3.5. The methods may still further include applying a voltage to the seasoned electrostatic chuck of greater than or about 500 V. The seasoned electrostatic chuck may be characterized by a leakage current of less than or about 25 mA when the voltage is applied.

Semiconductor processing systems and method are described that may include flowing deposition precursors into a substrate processing region of a semiconductor processing chamber, where the substrate processing region includes an electrostatic chuck. The methods may further include depositing a seasoning layer on the electrostatic chuck from the deposition precursors to form a seasoned electrostatic chuck. The seasoning layer may be characterized by a dielectric constant greater than or about 3.5. The methods may still further include applying a voltage to the seasoned electrostatic chuck of greater than or about 500 V. The seasoned electrostatic chuck may be characterized by a leakage current of less than or about 25 mA when the voltage is applied.

Provided is an electrostatic chuck device including: a voltage application unit configured to apply a dechuck voltage that is used when dechucking an object to a first electrode and a second electrode, the dechuck voltage being constituted by a first AC voltage applied to the first electrode in a first waveform, and a second AC voltage applied to the second electrode in a second waveform having a phase difference from the first waveform; and an information output unit configured to output information on timing at which the first waveform and the second waveform intersect each other. The voltage application unit stops application of the dechuck voltage to the first electrode and the second electrode on the basis of the information.