H03F19/00

Domain-distributed cryogenic signaling amplifier

A signal amplifier is distributed between first and second IC devices and includes a low-power input stage disposed within the first IC device, a bias-current source disposed within the second IC device and an output stage disposed within the second IC device. The output stage includes a resistance disposed within the second IC device and having a first terminal coupled to a drain terminal of a transistor within the input stage via a first signaling line that extends between the first and second IC devices.

COMPOUND SUPERCONDUCTING QUANTUM INTERFERENCE DEVICE OUTPUT AMPLIFIER AND METHODS
20190363688 · 2019-11-28 ·

Output amplifier comprising a stack of compound superconducting quantum interference device (SQUID) output amplifier stages and related methods are provided. A method includes receiving a first pulse train comprising a first plurality of single flux quantum (SFQ) pulses. The method may further include receiving a second pulse train comprising a second plurality of SFQ pulses, where the second pulse train is delayed by a predetermined fraction of a clock cycle relative to the first pulse train. The method may further include using the stack of the plurality of compound SQUID output amplifier stages converting the first plurality of SFQ pulses and the second plurality of SFQ pulses into a voltage waveform, where each of the plurality of compound SQUID output amplifier stages comprises a pair of superconducting quantum interference devices (SQUIDs).

COMPOUND SUPERCONDUCTING QUANTUM INTERFERENCE DEVICE OUTPUT AMPLIFIER AND METHODS
20190363688 · 2019-11-28 ·

Output amplifier comprising a stack of compound superconducting quantum interference device (SQUID) output amplifier stages and related methods are provided. A method includes receiving a first pulse train comprising a first plurality of single flux quantum (SFQ) pulses. The method may further include receiving a second pulse train comprising a second plurality of SFQ pulses, where the second pulse train is delayed by a predetermined fraction of a clock cycle relative to the first pulse train. The method may further include using the stack of the plurality of compound SQUID output amplifier stages converting the first plurality of SFQ pulses and the second plurality of SFQ pulses into a voltage waveform, where each of the plurality of compound SQUID output amplifier stages comprises a pair of superconducting quantum interference devices (SQUIDs).

Parametric amplifier system

One example includes a parametric amplifier system. The system includes an input/output (I/O) transmission line to propagate a signal tone. The system also includes a non-linearity circuit comprising at least one Josephson junction to provide at least one inductive path of the signal tone in parallel with the at least one Josephson junction. The system further includes an impedance matching network coupled to the I/O transmission line to provide impedance matching of the tone signal between the I/O transmission line and the non-linearity element.

Parametric amplifier system

One example includes a parametric amplifier system. The system includes an input/output (I/O) transmission line to propagate a signal tone. The system also includes a non-linearity circuit comprising at least one Josephson junction to provide at least one inductive path of the signal tone in parallel with the at least one Josephson junction. The system further includes an impedance matching network coupled to the I/O transmission line to provide impedance matching of the tone signal between the I/O transmission line and the non-linearity element.

INTEGRATING JOSEPHSON AMPLIFIERS OR JOSEPHSON MIXERS INTO PRINTED CIRCUIT BOARDS

An aspect includes one or more board layers. A first chip cavity is formed within the one or more board layers, wherein a first Josephson amplifier or Josephson mixer is disposed within the first chip cavity. The first Josephson amplifier or Josephson mixer comprises at least one port, each port connected to at least one connector disposed on at least one of the one or more board layers, wherein at least one of the one or more board layers comprises a circuit trace formed on the at least one of the one or more board layers.

INTEGRATING JOSEPHSON AMPLIFIERS OR JOSEPHSON MIXERS INTO PRINTED CIRCUIT BOARDS

An aspect includes one or more board layers. A first chip cavity is formed within the one or more board layers, wherein a first Josephson amplifier or Josephson mixer is disposed within the first chip cavity. The first Josephson amplifier or Josephson mixer comprises at least one port, each port connected to at least one connector disposed on at least one of the one or more board layers, wherein at least one of the one or more board layers comprises a circuit trace formed on the at least one of the one or more board layers.

INTEGRATING JOSEPHSON AMPLIFIERS OR JOSEPHSON MIXERS INTO PRINTED CIRCUIT BOARDS

An aspect includes one or more board layers. A first chip cavity is formed within the one or more board layers, wherein a first Josephson amplifier or Josephson mixer is disposed within the first chip cavity. The first Josephson amplifier or Josephson mixer comprises at least one port, each port connected to at least one connector disposed on at least one of the one or more board layers, wherein at least one of the one or more board layers comprises a circuit trace formed on the at least one of the one or more board layers.

INTEGRATING JOSEPHSON AMPLIFIERS OR JOSEPHSON MIXERS INTO PRINTED CIRCUIT BOARDS

An aspect includes one or more board layers. A first chip cavity is formed within the one or more board layers, wherein a first Josephson amplifier or Josephson mixer is disposed within the first chip cavity. The first Josephson amplifier or Josephson mixer comprises at least one port, each port connected to at least one connector disposed on at least one of the one or more board layers, wherein at least one of the one or more board layers comprises a circuit trace formed on the at least one of the one or more board layers.

Superconducting traveling-wave parametric amplifier
11955934 · 2024-04-09 · ·

A system and method are disclosed for a superconducting traveling-wave parametric amplifier (TWPA) with improved control and performance. In a preferred embodiment, the amplifier comprises an integrated array of symmetric rf-SQUIDs in a transmission line structure. A device was fabricated using niobium superconducting integrated circuits, and confirmed predicted performance, with a maximum gain up to 17 dB and a bandwidth of 4 GHz. A similar device can be applied as a low-noise, low-dissipation microwave amplifier for output from a superconducting quantum computer, or as a preamplifier, switch, or frequency converter for a sensitive microwave receiver, or as an output amplifier for a frequency-multiplexed superconducting detector array.