Disclosed is a radio frequency integrated circuit (RFIC) chip that includes an integrated circuit (IC) area and a crackstop laterally surrounding the IC area. The crackstop includes a metallic barrier (or, alternatively, concentric metallic barriers) electrically isolated from the IC area. One or more noise suppressors and, particularly, one or more passive filters (e.g., low pass filter(s), high pass filter(s), band pass filter(s), and/or band stop filter(s)) are integrated into the structure of the metallic barrier(s) to inhibit propagation, through the crackstop, of noise signals within a specific RF range. The specific RF range can be a customer-specified operating parameter. By embedding customized noise suppressor(s) into the crackstop, local signal interference unique to the customer-specified operating parameters can be minimized while also avoiding or at least minimizing the risk of moisture ingress to the IC area. Also disclosed is a method of forming the chip.

A digital communication station includes a coupled inductor, driver circuitry, and a digital transceiver. The coupled inductor includes (1) a first winding connected between a first digital communication node and a first power node, (2) a second winding connected between a second digital communication node and a second power node, and (3) a third winding. The driver circuitry is configured to drive the third winding to increase respective inductance values of the first and second windings, and the digital transceiver is communicatively coupled to the first digital communication node and the second digital communication node.

The invention relates to an electrical filter element (1) for filtering alternating voltage interference. The electrical filter element (1) comprises two dielectric circuit board substrates (11, 12) having a magnetic core (13) arranged between the circuit board substrates. The magnetic core (13) has a material-free inner region (13a), in which electrical connection elements (21-24) are provided between the two dielectric circuit board substrates (11, 12). Furthermore, electrical connection elements (31, 32) can also be provided between the two dielectric circuit board substrates (11, 12) in an outer region of the magnetic core (13).

An implantable pulse generator including a header, a can, and a filtered feedthrough assembly. The header including lead connector blocks. The can coupled to the header and including a wall and an electronic substrate housed within the wall. The filtered feedthrough assembly including a flange mounted to the can and having a feedthrough port, a plurality of feedthrough wires extending through the feedthrough port, and an insulator brazed to the feedthrough port of the flange. The filtered feedthrough assembly further including a capacitor having the plurality of feedthrough wires extending there through, an insulating washer positioned between and abutting the insulator and the capacitor at least in the area of the braze joint such that the capacitor and the braze joint are non-conductive, and an electrically conductive material adhered to the capacitor and the flange for grounding of the capacitor.

An implantable pulse generator including a header, a can, and a filtered feedthrough assembly. The header including lead connector blocks. The can coupled to the header and including a wall and an electronic substrate housed within the wall. The filtered feedthrough assembly including a flange mounted to the can and having a feedthrough port, a plurality of feedthrough wires extending through the feedthrough port, and an insulator brazed to the feedthrough port of the flange. The filtered feedthrough assembly further including a capacitor having the plurality of feedthrough wires extending there through, an insulating washer positioned between and abutting the insulator and the capacitor at least in the area of the braze joint such that the capacitor and the braze joint are non-conductive, and an electrically conductive material adhered to the capacitor and the flange for grounding of the capacitor.

The present disclosure relates to devices and methods for programming one-time programmable fuses of microphone assemblies. One microphone assembly includes a housing, a transducer, a filter circuit, and an integrated circuit. The integrated circuit has a fuse block having a one-time programmable (OTP) fuse configurable in a programming mode of operation during which a voltage applied to the supply voltage contact is increased relative to a voltage applied to a supply voltage contact in a normal mode of operation. The microphone assembly further includes a protection circuit configured to regulate a voltage at the voltage input terminal of the integrated circuit during the programming mode of operation based on a comparison of a voltage at the voltage input terminal with a reference voltage. The voltage on the voltage input terminal of the integrated circuit tracks the reference voltage during the programming mode of operation.

The invention discloses a power noise suppression circuit applied to a power system. The power noise suppression circuit comprises at least one power noise to heat converter and at least one anti-power noise transmitted unit. When a power noise within a specific frequency band enters the power noise suppression circuit, the power noise to heat converter converts the power noise to a thermal energy, and the anti-power noise transmitted unit reflects the power noise within the specific frequency band to the power noise to heat converter. Accordingly, the power noise within the specific frequency band can be suppressed and absorbed in the power noise suppression circuit, so as to maintain the stability of the power system.

A device includes an EMC (electromagnetic compatibility) filter, a frequency converter coupled to the EMC filter, and a motor coupled to the frequency converter via a motor cable. A leakage current compensator includes a leakage current detector and a compensation current generator configured to generate a compensation current that is directed against the leakage current and is overlaid on the leakage current in such a way that the leakage current is reduced.

A multilayer filter may include a signal path having an input, an output, and a conductive layer overlying at least one of a plurality of dielectric layers. The conductive layer may be elongated in the first direction and may have a first edge aligned with the first direction and a second edge parallel with the first edge. The conductive layer may include a protrusion extending in the second direction and having an end edge that is parallel with the first edge and offset from the first edge in the second direction by a protrusion length that is greater than about 50 microns. The multilayer filter may include an inductor that is electrically connected at a first location with the signal path and electrically connected at a second location with at least one of the signal path or a ground.

A multilayer filter may include a signal path having an input, an output, and a conductive layer overlying at least one of a plurality of dielectric layers. The conductive layer may be elongated in the first direction and may have a first edge aligned with the first direction and a second edge parallel with the first edge. The conductive layer may include a protrusion extending in the second direction and having an end edge that is parallel with the first edge and offset from the first edge in the second direction by a protrusion length that is greater than about 50 microns. The multilayer filter may include an inductor that is electrically connected at a first location with the signal path and electrically connected at a second location with at least one of the signal path or a ground.