An integrated transformer and an electronic device are disclosed. The integrated transformer includes at least one first base plate and at least one second base plate. Each of the first and second base plate defines multiple annular accommodating grooves. The annular accommodating grooves divide each of the first and second base plate into multiple central parts and a peripheral part Each central part defines multiple inner via holes there through. The peripheral part defines multiple outer via holes there through. The integrated transformer further includes multiple magnetic cores disposed in the respective annular accommodating groove and transmission wires disposed on both sides of the first and second base plates. Transformers and the filters are arranged on two base plates respectively, and the thickness of the transmission wire layers of the filters is less than that of the transformers. Thus, the structure of the electromagnetic device may be more compact.

An electronic component includes a stack and first to third inductors. Area of a region obtained by perpendicularly projecting a first space including a first axis and surrounded by the first inductor onto an XZ plane is larger than area of a region obtained by perpendicularly projecting a second space including a second axis and surrounded by the second inductor onto a YZ plane. The third inductor is disposed such that a third axis does not intersect the first space but intersects the second space.

An electronic component includes a stack and first to third inductors. Area of a region obtained by perpendicularly projecting a first space including a first axis and surrounded by the first inductor onto an XZ plane is larger than area of a region obtained by perpendicularly projecting a second space including a second axis and surrounded by the second inductor onto a YZ plane. The third inductor is disposed such that a third axis does not intersect the first space but intersects the second space.

Disclosed herein is a common mode filter that includes: a winding core part including first and second winding areas and a third winding area positioned between the first and second winding areas; and first and second wires wound in a same direction around the winding core part. The first and second wires constitute a first winding block wound in the first winding area and a second winding block wound in the second winding area. The first and second wires cross each other in the third winding area. Each of the first and second winding blocks has first and second winding layers. The difference in a number of turns between the first winding layer and the second winding layer is larger in the first winding block than in the second winding block.

Disclosed herein is a common mode filter that includes: a winding core part including first and second winding areas and a third winding area positioned between the first and second winding areas; and first and second wires wound in a same direction around the winding core part. The first and second wires constitute a first winding block wound in the first winding area and a second winding block wound in the second winding area. The first and second wires cross each other in the third winding area. Each of the first and second winding blocks has first and second winding layers. The difference in a number of turns between the first winding layer and the second winding layer is larger in the first winding block than in the second winding block.

An apparatus and method for a shielding structure for surface-mount LTCC components and filters to increase the signal isolation from input signal port to output signal port. An LTCC filter device with an increased rejection of undesired frequencies in a stopband and minimal distortion or loss of desired signals in a passband.

An apparatus and method for a shielding structure for surface-mount LTCC components and filters to increase the signal isolation from input signal port to output signal port. An LTCC filter device with an increased rejection of undesired frequencies in a stopband and minimal distortion or loss of desired signals in a passband.

According to an aspect, a tank circuit in an integrated circuit comprising a plurality of metal strips forming a first part of a closed contour enclosing a first area, a set of split sections forming a second part and geometrically aligned with the closed contour, and a plurality of capacitors coupled between the split sections to form the tank circuit, wherein a first flux linkage due a current flowing in the set of split sections pass through the first area in the same direction as that of a second flux linkage due to the current flowing in the plurality of metal strips, and the set of split sections and the plurality of metal strips together forming an inductance coil.

An electronic component includes an element body and an external electrode disposed on the element body. The external electrode includes an underlying metal layer, a conductive resin layer, and a plating layer. The underlying metal layer is disposed on the element body. The conductive resin layer contains a plurality of conductive fillers and is disposed on the underlying metal layer. The plating layer is disposed on the conductive resin layer. A part of the plurality of conductive fillers is sintered with the underlying metal layer and is coupled to the underlying metal layer. Another part of the plurality of conductive fillers is exposed to a surface of the conductive resin layer and is in contact with the plating layer.

An electronic component includes an element body and an external electrode disposed on the element body. The external electrode includes an underlying metal layer, a conductive resin layer, and a plating layer. The underlying metal layer is disposed on the element body. The conductive resin layer contains a plurality of conductive fillers and is disposed on the underlying metal layer. The plating layer is disposed on the conductive resin layer. A part of the plurality of conductive fillers is sintered with the underlying metal layer and is coupled to the underlying metal layer. Another part of the plurality of conductive fillers is exposed to a surface of the conductive resin layer and is in contact with the plating layer.