A multilayer filter may include a dielectric layer having a top surface, a bottom surface, and a thickness in a Z-direction between the top surface and the bottom surface. The multilayer filter may include a conductive layer formed on the top surface of the dielectric layer. The multilayer filter may include a via assembly formed in the dielectric layer and connected to the conductive layer on the top surface of the dielectric layer. The via assembly may extend to the bottom surface of the dielectric layer. The via assembly may have a length in the Z-direction and a total cross-sectional area in an X-Y plane that is perpendicular to the Z-direction. The via assembly may have an area-to-squared-length ratio that is greater than about 3.25.

A multilayer filter may include a dielectric layer having a top surface, a bottom surface, and a thickness in a Z-direction between the top surface and the bottom surface. The multilayer filter may include a conductive layer formed on the top surface of the dielectric layer. The multilayer filter may include a via assembly formed in the dielectric layer and connected to the conductive layer on the top surface of the dielectric layer. The via assembly may extend to the bottom surface of the dielectric layer. The via assembly may have a length in the Z-direction and a total cross-sectional area in an X-Y plane that is perpendicular to the Z-direction. The via assembly may have an area-to-squared-length ratio that is greater than about 3.25.

Apparatus and method for trapping RF on shields of a multiply shielded RF cable. In some embodiments, the RF trap shorts an outer conductor shield to an inner shield conductor of the cable successively at selected locations along an end length of the shield conductors. Some embodiments provide an RF-trap apparatus for blocking stray signals on a shielded RF cable that has two or more concentric peripheral shield conductors separated from one another by one or more electrically insulating layers, and at least one inner conductor for carrying RF signals. The RF trap apparatus includes: a first housing; and a plurality of projections configured be coupled to the first housing and to move to selectively electrically connect an outer shield conductor to an inner shield conductor by a pierce operation on the shielded RF cable.

Apparatus and method for trapping RF on shields of a multiply shielded RF cable. In some embodiments, the RF trap shorts an outer conductor shield to an inner shield conductor of the cable successively at selected locations along an end length of the shield conductors. Some embodiments provide an RF-trap apparatus for blocking stray signals on a shielded RF cable that has two or more concentric peripheral shield conductors separated from one another by one or more electrically insulating layers, and at least one inner conductor for carrying RF signals. The RF trap apparatus includes: a first housing; and a plurality of projections configured be coupled to the first housing and to move to selectively electrically connect an outer shield conductor to an inner shield conductor by a pierce operation on the shielded RF cable.

A filter module for reducing differential and common mode electrical noise may include at least a first electrically conductive busbar and a second electrically conductive busbar spaced apart from the first busbar, an at least partially electrically conductive housing at least partially enclosing the first busbar and the second busbar, at least a first common mode choke and a second common mode choke arranged in the housing and spaced apart from each other, at least a first bypass capacitor electrically connected to the first busbar and the second bus bar, at least a second bypass capacitor electrically connected to the first busbar and a midpoint, and at least a third bypass capacitor electrically connected to the second busbar and the midpoint.

A filter module for reducing differential and common mode electrical noise may include at least a first electrically conductive busbar and a second electrically conductive busbar spaced apart from the first busbar, an at least partially electrically conductive housing at least partially enclosing the first busbar and the second busbar, at least a first common mode choke and a second common mode choke arranged in the housing and spaced apart from each other, at least a first bypass capacitor electrically connected to the first busbar and the second bus bar, at least a second bypass capacitor electrically connected to the first busbar and a midpoint, and at least a third bypass capacitor electrically connected to the second busbar and the midpoint.

Provided is a laminated electronic component in which defective formation is unlikely to cause in a shield conductor layer on a side surface of a laminate. The laminated electronic component includes a laminate 1, in which substrate layers 1a to 1i are laminated, having an outer surface including a first main surface 1B, a second main surface 1T, and a side surface 1S, internal electrodes (a ground electrode 2, coil electrodes 3, capacitor electrodes 4, and wiring electrodes 5), an external electrode 7, and a first plating layer 9 formed on a surface of the external electrode 7.

Provided is a laminated electronic component in which defective formation is unlikely to cause in a shield conductor layer on a side surface of a laminate. The laminated electronic component includes a laminate 1, in which substrate layers 1a to 1i are laminated, having an outer surface including a first main surface 1B, a second main surface 1T, and a side surface 1S, internal electrodes (a ground electrode 2, coil electrodes 3, capacitor electrodes 4, and wiring electrodes 5), an external electrode 7, and a first plating layer 9 formed on a surface of the external electrode 7.

A circuit board has a glass core in which a through hole is formed, and a conductor pattern is formed on an inner peripheral wall of the through hole and a surface of the glass core to form a circuit element including a solenoid coil element and a capacitor element. Accordingly, a low-cost and compact circuit board capable of supporting high-capacity communication for thin mobile communication devices such as smartphones can be provided. Since the circuit board can be electrically connected to at least one of the electronic components such as a switch, an amplifier, and a filter via one terminal, and can be electrically connected to a mother board via another terminal, it has integrated functions, and can be suitably used for thin mobile communication devices such as smartphones.

A laminated electronic component includes a multilayer body including multiple insulator layers that are laminated and including a bottom surface, a top surface, and multiple side surfaces. The laminated electronic component includes a shield film provided on at least one side surface of the multilayer body. In the laminated electronic component, at least one step difference is provided along a ridge at which the bottom surface and a corresponding one of the side surfaces of the multilayer body are connected to each other, and the shield film includes an edge portion disposed within the at least one step difference.