A device for generating IQ signals. An input port receives a differential input signal via a first and a second terminal of the input port. A first output port outputs a differential I output signal. A first terminal is electrically connected to the first terminal of the first output port via a first connecting line and a second terminal is electrically connected to the second terminal of the first output port via a second connecting line. A second output port outputs a differential Q output signal via a first and a second terminal of the second output port. The first terminal of the second output port is electrically connected to a first terminal of an isolated port via a third connecting line, and the second terminal of the second output port is electrically connected to a second terminal of the isolated port via a fourth connecting line.

A device for generating IQ signals. An input port receives a differential input signal via a first and a second terminal of the input port. A first output port outputs a differential I output signal. A first terminal is electrically connected to the first terminal of the first output port via a first connecting line and a second terminal is electrically connected to the second terminal of the first output port via a second connecting line. A second output port outputs a differential Q output signal via a first and a second terminal of the second output port. The first terminal of the second output port is electrically connected to a first terminal of an isolated port via a third connecting line, and the second terminal of the second output port is electrically connected to a second terminal of the isolated port via a fourth connecting line.

To provide an electronic component capable of improving the adhesiveness of the shield conductor provided on the outer surface of the substrate body, to the substrate body, while suppressing a deterioration of the characteristics of an LC resonator provided in the substrate body. An electronic component comprises substrate body that includes substrates being insulating and laminated, and that has principal surfaces and side surface, LC resonator that includes inductor conductor disposed on substrates and capacitor conductor disposed on substrates and electrically connected to the inductor conductor, shield conductor that is disposed on principal surface and that is electrically connected to a ground, outer electrode that is disposed on principal surfaces and that is electrically connected to the LC resonator, and protective layer that covers shield conductor disposed on principal surface and principal surface, in a manner straddling interface between shield conductor disposed on principal surface and substrate body.

To provide an electronic component capable of improving the adhesiveness of the shield conductor provided on the outer surface of the substrate body, to the substrate body, while suppressing a deterioration of the characteristics of an LC resonator provided in the substrate body. An electronic component comprises substrate body that includes substrates being insulating and laminated, and that has principal surfaces and side surface, LC resonator that includes inductor conductor disposed on substrates and capacitor conductor disposed on substrates and electrically connected to the inductor conductor, shield conductor that is disposed on principal surface and that is electrically connected to a ground, outer electrode that is disposed on principal surfaces and that is electrically connected to the LC resonator, and protective layer that covers shield conductor disposed on principal surface and principal surface, in a manner straddling interface between shield conductor disposed on principal surface and substrate body.

Reflectionless transmission line filters, as well as a method for designing such filters is disclosed. These filters preferably function by absorbing the stop-band portion of the spectrum rather than reflecting it back to the source, which has significant advantages in many different applications. The insertion of additional transmission line sections that change the phase response of the circuit without altering the amplitude response preferably allows follow-up transmission line identities to be applied in order to arrive at a more easily manufacturable filter topology. This facilitates their application over a higher frequency range the solely lumped-element circuits.

Reflectionless transmission line filters, as well as a method for designing such filters is disclosed. These filters preferably function by absorbing the stop-band portion of the spectrum rather than reflecting it back to the source, which has significant advantages in many different applications. The insertion of additional transmission line sections that change the phase response of the circuit without altering the amplitude response preferably allows follow-up transmission line identities to be applied in order to arrive at a more easily manufacturable filter topology. This facilitates their application over a higher frequency range the solely lumped-element circuits.

A receiving coupler for large diameter capacitive data links comprises at least two layers of isolating material, having different lengths and being attached to each other. The shorter layer comprises on its outer surface a first pair of conductors, whereas the longer layer comprises a second pair and a third pair of conductors. The conductors are connected to each other by vias. The stack of layers of different lengths can be adapted to various curve radii of transmitting components of a capacitive rotary joint.

An equipment box assembly includes a housing including a back wall, a bottom wall, a top wall, and first and second sidewalls defining a cavity. At least one mounting feature is on each of the first and second sidewalls. The housing is sized to fit between first and second adjacent studs with the first sidewall mounted to the first stud using the at least one mounting feature on the first sidewall and with the second sidewall mounted to the second stud using the at least one mounting feature on the second sidewall.

An equipment box assembly includes a housing including a back wall, a bottom wall, a top wall, and first and second sidewalls defining a cavity. At least one mounting feature is on each of the first and second sidewalls. The housing is sized to fit between first and second adjacent studs with the first sidewall mounted to the first stud using the at least one mounting feature on the first sidewall and with the second sidewall mounted to the second stud using the at least one mounting feature on the second sidewall.

The present disclosure may include, for example, a tunable capacitor having a decoder for generating a plurality of control signals, and an array of tunable switched capacitors comprising a plurality of fixed capacitors coupled to a plurality of switches. The plurality of switches can be controlled by the plurality of control signals to manage a tunable range of reactance of the array of tunable switched capacitors. Additionally, the array of tunable switched capacitors is adapted to have non-uniform quality (Q) factors. Additional embodiments are disclosed.