A high frequency circuit includes a transistor having an input electrode that inputs a high frequency signal and an output electrode that outputs the high frequency signal, a transmission line that is connected to any one of the input electrode and the output electrode, and transmits the high frequency signal, a coupling line electrically separated from the transmission line to an extent that an electromagnetic field coupling is enabled with the transmission line, and a resonance circuit that is connected between a first end of the coupling line and a reference potential, and minimizes an impedance between the first end and the reference potential at a resonance frequency.

A wide band radio frequency (RF) circulator is provided. The circulator includes a first stage having four ports; and a second stage having four ports, wherein the first stage and the second stage are connected via a pair of reciprocal delay lines, and wherein each of the first stage and the second stage includes a pair of couplers.

In accordance with some embodiments, non-reciprocal circulators are provided, the circulators comprising: a 3X/4-long ring section having a first end and a second end, wherein is an operating wavelength of the non-reciprocal circulator; and a N-path filter having a first port, a second port, and N-paths, each of the N-paths being connected to the first port and the second port. In some of these embodiments, the 3/4-long ring section includes a transmit port, an antenna port, and a receive port. In some of these embodiments, the transmit port is /4 away from the antenna port. In some of these embodiments, the antenna port is /4 away from the receive port. In some of these embodiments, the receive port is at the first port of the N-path filter.

Systems and devices for providing differential input/output communication with a superconducting device are described. Each differential I/O communication is electrically filtered using a respective tubular filter structure incorporating superconducting lumped element devices and high frequency dissipation by metal powder epoxy. A plurality of such tubular filter structures is arranged in a cryogenic, multi-tiered assembly further including structural/thermalization supports and a device sample holder assembly for securing a device sample, for example a superconducting quantum processor. The interface between the cryogenic tubular filter assembly and room temperature electronics is achieved using hermetically sealed vacuum feed-through structures designed to receive flexible printed circuit board cable.

A data processing system is proposed which comprises two electronic devices, each of them having an electro-magnetic coupler embedded on the exterior casing, at least one of the electronic device having one or more sliding surfaces for directing relative movement between the two devices, such that they automatically come into correct alignment during the sliding.

A data processing system is proposed which comprises two electronic devices, each of them having an electro-magnetic coupler embedded on the exterior casing, at least one of the electronic device having one or more sliding surfaces for directing relative movement between the two devices, such that they automatically come into correct alignment during the sliding.

According to one embodiment, there is provided a magnetic coupling device including a first coil, a second coil, a third coil, a fourth coil, a first constant-potential node and a second constant-potential node. The second coil is electrically connected with one end of the first coil and wound in a direction opposite to a direction in which the first coil is wound. The third coil faces the first coil. The fourth coil faces the second coil. The first constant-potential node is electrically connected with one end of the third coil. The second constant-potential node is electrically connected with one end of the fourth coil.

According to one embodiment, there is provided a magnetic coupling device including a first coil, a second coil, a third coil, a fourth coil, a first constant-potential node and a second constant-potential node. The second coil is electrically connected with one end of the first coil and wound in a direction opposite to a direction in which the first coil is wound. The third coil faces the first coil. The fourth coil faces the second coil. The first constant-potential node is electrically connected with one end of the third coil. The second constant-potential node is electrically connected with one end of the fourth coil.

A radio frequency, RF, auto-transformer circuit (300, 700, 901) and method (1000) of constructing a RF auto-transformer are described. The RF, auto-transformer circuit (300, 700, 901) includes: an inner coil formed (1102) with a first metal layer (MT1) to create a first shunt inductor (302), wherein at least a portion of the inner coil is overlayed (1106) with a second metal layer (MT2) that creates a first series inductor (303) that exhibits inductive coupling to the first shunt inductor (302). An outer coil is formed (1104) with the first metal layer (MT1) that creates a second series inductor (304), where the outer coil is located adjacent the inner coil and provides inductive coupling between the second series inductor (304) and each of the first shunt inductor (302) and first series inductor (303). At least a portion of the outer coil is overlayed (1008) with the second metal layer (MT2) that creates a second shunt inductor (301) that exhibits inductive coupling between the second shunt inductor (301) and each of the first shunt inductor (302) and first series inductor (303) and second series inductor (304). The outer coil is connected (1112) to the inner coil using vias and the respective first metal layer (MT1) is connected to the second layer (MT2) using vias.

A radio frequency, RF, auto-transformer circuit (300, 700, 901) and method (1000) of constructing a RF auto-transformer are described. The RF, auto-transformer circuit (300, 700, 901) includes: an inner coil formed (1102) with a first metal layer (MT1) to create a first shunt inductor (302), wherein at least a portion of the inner coil is overlayed (1106) with a second metal layer (MT2) that creates a first series inductor (303) that exhibits inductive coupling to the first shunt inductor (302). An outer coil is formed (1104) with the first metal layer (MT1) that creates a second series inductor (304), where the outer coil is located adjacent the inner coil and provides inductive coupling between the second series inductor (304) and each of the first shunt inductor (302) and first series inductor (303). At least a portion of the outer coil is overlayed (1008) with the second metal layer (MT2) that creates a second shunt inductor (301) that exhibits inductive coupling between the second shunt inductor (301) and each of the first shunt inductor (302) and first series inductor (303) and second series inductor (304). The outer coil is connected (1112) to the inner coil using vias and the respective first metal layer (MT1) is connected to the second layer (MT2) using vias.