Patent classifications
H03H7/00
INTEGRATION OF DIRECTIONAL COUPLERS WITH POWER COMBINERS
An example device includes a first primary coil, a second primary coil, a combined power output, a first directional coupler output, a second directional coupler output. The example device also includes a secondary coil coupled to the combined power output, configured to magnetically couple to the first primary coil, and configured to magnetically couple to the second primary coil. The example device further includes a tertiary coil configured to magnetically couple to the secondary coil and including a first end coupled to the first directional coupler output, and a second end coupled to the second directional coupler output.
INTEGRATION OF DIRECTIONAL COUPLERS WITH POWER COMBINERS
An example device includes a first primary coil, a second primary coil, a combined power output, a first directional coupler output, a second directional coupler output. The example device also includes a secondary coil coupled to the combined power output, configured to magnetically couple to the first primary coil, and configured to magnetically couple to the second primary coil. The example device further includes a tertiary coil configured to magnetically couple to the secondary coil and including a first end coupled to the first directional coupler output, and a second end coupled to the second directional coupler output.
Electronic component
To provide an electronic component capable of improving the adhesiveness of the shield conductor provided on the outer surface of the substrate body, to the substrate body, while suppressing a deterioration of the characteristics of an LC resonator provided in the substrate body. An electronic component comprises substrate body that includes substrates being insulating and laminated, and that has principal surfaces and side surface, LC resonator that includes inductor conductor disposed on substrates and capacitor conductor disposed on substrates and electrically connected to the inductor conductor, shield conductor that is disposed on principal surface and that is electrically connected to a ground, outer electrode that is disposed on principal surfaces and that is electrically connected to the LC resonator, and protective layer that covers shield conductor disposed on principal surface and principal surface, in a manner straddling interface between shield conductor disposed on principal surface and substrate body.
Electronic component
To provide an electronic component capable of improving the adhesiveness of the shield conductor provided on the outer surface of the substrate body, to the substrate body, while suppressing a deterioration of the characteristics of an LC resonator provided in the substrate body. An electronic component comprises substrate body that includes substrates being insulating and laminated, and that has principal surfaces and side surface, LC resonator that includes inductor conductor disposed on substrates and capacitor conductor disposed on substrates and electrically connected to the inductor conductor, shield conductor that is disposed on principal surface and that is electrically connected to a ground, outer electrode that is disposed on principal surfaces and that is electrically connected to the LC resonator, and protective layer that covers shield conductor disposed on principal surface and principal surface, in a manner straddling interface between shield conductor disposed on principal surface and substrate body.
Antenna impedance matching design circuit and near-field communication circuit system
An antenna impedance matching design circuit includes a load circuit, a filter circuit and a matching circuit which are connected to each other. The load circuit is connected to one end of the filter circuit for connecting a near field communication chip, and the matching circuit includes a plurality of capacitors.
Resistor-capacitor calibration method and resistor-capacitor calibration circuit
An RC calibration method and an RC calibration circuit are provided. The method includes: providing an RC calibration circuit; calculating a ratio of an input period of an input clock signal to an initial period, and configuring the processing circuit to perform a calibration process including: adjusting a first current source, a second current source, and/or an adjustment factor of the input period according to the ratio, so as to satisfy a specified RC product, or adjusting a resistance and/or a capacitance of the specified RC product; controlling the first current source to charge a to-be-calibrated capacitor; and determining whether a comparison signal indicates that first and second voltages meet a calibration completion condition, and if not, adjusting the to-be-calibrated resistor and/or the to-be-calibrated capacitor until the comparison signal indicates that the first and second voltages meet the calibration completion condition.
Phase noise reduction in a variable analogue RF resonator with switched capacitors
An active feedback RF resonator has a signal loop having a signal input and a signal output. The signal loop has a variable gain stage and at least one variable resonator, each variable resonator comprising an inductance element and a variable capacitance element comprising a number of switched fixed value capacitors and a variable capacitor. A phase noise of the active feedback RF signal has a maximum value for an operating frequency of the variable resonator that is based on an operating range of the variable capacitor.
Phase noise reduction in a variable analogue RF resonator with switched capacitors
An active feedback RF resonator has a signal loop having a signal input and a signal output. The signal loop has a variable gain stage and at least one variable resonator, each variable resonator comprising an inductance element and a variable capacitance element comprising a number of switched fixed value capacitors and a variable capacitor. A phase noise of the active feedback RF signal has a maximum value for an operating frequency of the variable resonator that is based on an operating range of the variable capacitor.
COUPLING RESONATORS WITH WIDELY SEPARATED OVERTONES
A coupling resonator circuit includes a capacitive portion that includes a capacitive plate having a geometrical shape; and an inductive portion that is coupled to the capacitive portion. The inductive portion includes a transmission line having a first end and a second end, and the transmission line tapers from the first end in the direction of the second end such that a width of the transmission line at the first end is greater than a width of the transmission line at the second end. The coupling resonator circuit is configured to resonate at a desired coupling frequency; and dimensions of the capacitive portion and the inductive portion determines a separation in frequency between the desired coupling frequency and one or more resonant frequencies that are nearest to the desired coupling frequency.
COUPLING RESONATORS WITH WIDELY SEPARATED OVERTONES
A coupling resonator circuit includes a capacitive portion that includes a capacitive plate having a geometrical shape; and an inductive portion that is coupled to the capacitive portion. The inductive portion includes a transmission line having a first end and a second end, and the transmission line tapers from the first end in the direction of the second end such that a width of the transmission line at the first end is greater than a width of the transmission line at the second end. The coupling resonator circuit is configured to resonate at a desired coupling frequency; and dimensions of the capacitive portion and the inductive portion determines a separation in frequency between the desired coupling frequency and one or more resonant frequencies that are nearest to the desired coupling frequency.