A radio-frequency module includes a first terminal, a second terminal, a first switch including a first switch terminal connected to the first terminal and a second switch terminal connectable to the first switch terminal, a second switch including a third switch terminal connectable to the second terminal, a first filter connected between the second switch terminal and the third switch terminal, and a substrate. The first switch and the second switch are included in a single semiconductor chip. The first filter and the semiconductor chip are on the substrate. In a plan view of the substrate, a first distance between the third switch terminal and the first switch terminal or a second distance between the third switch terminal and the second switch terminal is greater than a third distance between the first switch terminal and the second switch terminal.

A radio-frequency module includes a multilayer substrate, an input switch, an output switch, and filters. A switch IC is disposed on a main surface of the multilayer substrate. The input switch is disposed in the switch IC and includes a first input terminal and first output terminals. The output switch is disposed in the switch IC and includes second input terminals and a second output terminal. The filters are disposed outside the switch IC and are connected to the first output terminals and the second input terminals. In a plan view of the multilayer substrate, the first input terminal and the first output terminals are disposed close to a first side of an exterior of the switch IC, and the second input terminals and the second output terminal are disposed close to a second side different from the first side of the exterior of the switch IC.

A radio-frequency module includes a multilayer substrate, an input switch, an output switch, and filters. A switch IC is disposed on a main surface of the multilayer substrate. The input switch is disposed in the switch IC and includes a first input terminal and first output terminals. The output switch is disposed in the switch IC and includes second input terminals and a second output terminal. The filters are disposed outside the switch IC and are connected to the first output terminals and the second input terminals. In a plan view of the multilayer substrate, the first input terminal and the first output terminals are disposed close to a first side of an exterior of the switch IC, and the second input terminals and the second output terminal are disposed close to a second side different from the first side of the exterior of the switch IC.

Embodiments of resonator circuits and modulating resonators and are described generally herein. One or more acoustic wave resonators may be coupled in series or parallel to generate tunable filters. One or more acoustic wave resonances may be modulated by one or more capacitors or tunable capacitors. One or more acoustic wave modules may also be switchable in a filter. Other embodiments may be described and claimed.

a SAW filter includes a substrate including a piezoelectric substrate, a transmission filter, and an additional resonator. The transmission filter is a ladder-type filter filtering signals from a transmission terminal and outputting the result to an antenna terminal. Further, the transmission filter includes one or more serial resonators and one or more parallel resonators which are connected in a ladder configuration on the piezoelectric substrate. An initial stage resonator is the serial resonator. The additional resonator includes an IDT electrode on the piezoelectric substrate. The IDT electrode is connected to the transmission terminal at a stage before the transmission filter and is connected to any of the one or more GND terminals. In the additional resonator, a resonance frequency and an antiresonance frequency are located outside of a passband of the transmission filter.

An antenna terminal is connected to a first filter and second filter, which are branched from each other when viewed from the antenna terminal, and are different in passing bands from each other. An individual inductor is connected in series to a branch point from which the first filter is branched to be independent from other filters when viewed from the antenna terminal. And a common inductor is located between a position between the antenna terminal and the branch point and a reference potential and is commonly connected in parallel with respect to the filters. The first filter is higher in frequency of passing band compared with the other filters. A susceptance when viewing the second filter side from the antenna terminal is larger than a susceptance when viewing the first filter side from the antenna terminal at frequencies of passing bands of them.

A switch module includes a first terminal, first and second filters, and first and second switches. Impedance of the first filter for a signal in a stop band is capacitive. When the first switch is turned OFF, impedance of the first switch is capacitive, and impedance of the first filter seen from an end portion of the first switch connected to the first filter is not in a short state and impedance of the first filter seen from the first terminal is in an open state.

A switch module includes a first terminal, first and second filters, and first and second switches. Impedance of the first filter for a signal in a stop band is capacitive. When the first switch is turned OFF, impedance of the first switch is capacitive, and impedance of the first filter seen from an end portion of the first switch connected to the first filter is not in a short state and impedance of the first filter seen from the first terminal is in an open state.

A multiplexer includes a plurality of filters, in which one input/output terminal of each of the plurality of filters is connected to a common terminal, a first filter included in the plurality of filters is a ladder filter and includes at least one series arm resonator connected on a path connecting the common terminal and another input/output terminal of the first filter, at least one parallel arm resonator connected between a connection node provided on the path and a ground, and a switch which is connected in series to a parallel arm resonator connected most nearby to the common terminal among at least one parallel arm resonator and switches between conduction and non-conduction of a node to which the parallel arm resonator is connected and the ground.

An acoustic wave device includes a support substrate, a piezoelectric laminate, and first and second interdigital transducer electrodes. The piezoelectric laminate includes an intermediate layer provided directly or indirectly on the support substrate and a piezoelectric thin film provided on the intermediate layer. The first and second interdigital transducer electrodes are provided on the piezoelectric thin film of the piezoelectric laminate so as to be disposed in an identical or substantially identical plane. In the piezoelectric laminate, a thickness of a portion where the first interdigital transducer electrode is provided is different from a thickness of a portion where the second interdigital transducer electrode is provided.