Patent classifications
H03K19/00
DATA INPUT BUFFER AND SEMICONDUCTOR APPARATUS INCLUDING THE SAME
A data input buffer includes a plurality of buffer units configured to receive a first impedance calibration code and a second impedance calibration code, wherein each of the plurality of buffer units outputs an offset detected with a first input terminal and a second input terminal thereof short-circuited, as write data, and wherein a buffer unit corresponding to a current value of the first impedance calibration code among the plurality of buffer units is configured to correct the offset according to the second impedance calibration code.
INTEGRATED CIRCUIT INCLUDING POWER GATING CIRCUIT
An integrated circuit includes a logic circuit comprising a plurality of logic transistors, the logic circuit comprising a plurality of logic gate lines extending in a first direction; and a power gating circuit comprising a plurality of power gating transistors, the power gating circuit comprising a first power gate line extending in a second direction that is perpendicular to the first direction, and the power gating circuit being connected to the logic circuit, wherein a plurality of source regions respectively included in the plurality of power gating transistors are connected to each other, or a plurality of drain regions respectively included in the plurality of power gating transistors are connected to each other.
LOW FREQUENCY POWER SUPPLY SPUR REDUCTION IN CLOCK SIGNALS
Techniques and apparatus for reducing low frequency power supply spurs in clock signals in a clock distribution network. One example circuit for clock distribution generally includes a plurality of logic inverters coupled in series and configured to drive a clock signal and a current-starved inverter coupled in parallel (or in series) with a logic inverter in the plurality of logic inverters.
Adaptive multibit bus for energy optimization
Methods and apparatus relating to an adaptive multibit bus for energy optimization are described. In an embodiment, a 1-bit interconnect of a processor is caused to select between a plurality of operational modes. The plurality of operational modes comprises a first mode and a second mode. The first mode causes transmission of a single bit over the 1-bit interconnect at a first frequency and the second mode causes transmission of a plurality of bits over the 1-bit interconnect at a second frequency based at least in part on a determination that an operating voltage of the 1-bit interconnect is at a high voltage level and that the second frequency is lower than the first frequency. Other embodiments are also disclosed and claimed.
Synapse circuit and arithmetic device
According to an embodiment, a synapse circuit includes: a buffer that changes an output signal to a second logical value at a timing when an input signal exceeds a first threshold level, in a case where the output signal has a first logical value in a first mode, and changes the output signal to the second logical value at a timing when the input signal exceeds a reference level lower than the first threshold level, in a case where the output signal has the first logical value in a second mode; an adjusting unit that adjusts the first threshold level depending on a stored coefficient; and a mode switching unit that operates the buffer in the first mode during a period in which an acquired spike is not generated, and operates the buffer in the second mode during a period in which the spike is generated.
Synapse circuit and arithmetic device
According to an embodiment, a synapse circuit includes: a buffer that changes an output signal to a second logical value at a timing when an input signal exceeds a first threshold level, in a case where the output signal has a first logical value in a first mode, and changes the output signal to the second logical value at a timing when the input signal exceeds a reference level lower than the first threshold level, in a case where the output signal has the first logical value in a second mode; an adjusting unit that adjusts the first threshold level depending on a stored coefficient; and a mode switching unit that operates the buffer in the first mode during a period in which an acquired spike is not generated, and operates the buffer in the second mode during a period in which the spike is generated.
High/low speed mode selection for output driver circuits of a memory interface
A method of operating an input/output interface includes selecting one of a plurality of output driver circuits according to a mode selection signal, and outputting a data signal using the selected one of the plurality of output driver circuits. Another method of operating an includes generating a mode selection signal based on a received command signal, and controlling an on-die termination (ODT) circuit included in the input/output interface according to the mode selection signal. Another method of operating an includes generating a mode selection signal based on a received command signal, and controlling an ODT circuit included in the input/output interface according to the mode selection signal.
METHOD OF DETECTING A POSSIBLE THINNING OF A SUBSTRATE OF AN INTEGRATED CIRCUIT VIA THE REAR FACE THEREOF, AND ASSOCIATED DEVICE
A semiconductor substrate includes a buried semiconductor layer and semiconductor wells. A device for detecting a possible thinning of the semiconductor substrate via the rear face thereof is formed on and in the semiconductor wells. The device is a non-inverting buffer including an input terminal and an output terminal, the device being powered between a supply terminal and a reference terminal where the buried semiconductor layer provides the supply terminal. A control circuit delivers an input signal in a first state to the input terminal and outputs a control signal indicating a detection of a thinning of the substrate if a signal generated at the output terminal in response to the input signal is in a second state different from the first state.
METHOD OF DETECTING A POSSIBLE THINNING OF A SUBSTRATE OF AN INTEGRATED CIRCUIT VIA THE REAR FACE THEREOF, AND ASSOCIATED DEVICE
A semiconductor substrate includes a buried semiconductor layer and semiconductor wells. A device for detecting a possible thinning of the semiconductor substrate via the rear face thereof is formed on and in the semiconductor wells. The device is a non-inverting buffer including an input terminal and an output terminal, the device being powered between a supply terminal and a reference terminal where the buried semiconductor layer provides the supply terminal. A control circuit delivers an input signal in a first state to the input terminal and outputs a control signal indicating a detection of a thinning of the substrate if a signal generated at the output terminal in response to the input signal is in a second state different from the first state.
TRUE COMPLEMENT DYNAMIC CIRCUIT AND METHOD FOR COMBINING BINARY DATA
A true complement dynamic circuit for combining, in particular comparing, binary data on dynamic first and second input signals to third and fourth input signals, comprising at least a 1-bit compare circuit, wherein the dynamic first and second input signals are complementary signals during an evaluation phase, wherein a logical behavior is determined by the third and fourth input signals. A method for operating a true complement dynamic circuit for combining, in particular comparing, binary data on dynamic first and second input signals to third and fourth input signals, comprising operating at least a 1-bit compare circuit, wherein the dynamic first and second input signals are complementary signals during an evaluation phase, determining a logical behavior by the third and fourth input signals.