A semiconductor circuit includes a first circuit, a second circuit, a third circuit, and a fourth circuit. The first circuit determines a value of a first node based on a voltage level of a clock signal, and a voltage level of an enable signal or a voltage level of a scan enable signal. The second circuit determines a value of a second node based on the voltage levels of the first node and the clock signal. The third circuit determines a value of a third node based on a voltage level of the second node. The fourth circuit determines a value of a fourth node based on the voltage levels of the second node and the clock signal. The third circuit includes a first transistor and a second transistor connected in series with each other and gated to the voltage level of the second node to determine the value of the third node. The fourth circuit includes a third transistor that is gated to the voltage level of the clock signal to electrically connect the third node and the fourth node.

Output signal generation circuitry 100 may be used for converting an input signal 110 from a source voltage domain to an output signal for a destination voltage domain, the destination voltage domain operating from a supply voltage that exceeds a stressing threshold of components within the output signal generation circuitry. The output signal generation circuitry may comprise level shifting circuitry 160 operating from the supply voltage, which is configured to generate at an output node 130 the output signal for the destination voltage domain in dependence on the input signal. The output signal generation circuitry may also comprise tracking circuitry 280A, 280B, 280C, 280D associated with at least one component of the level shifting circuitry to ensure that a voltage drop across the at least one component does not exceed the stressing threshold, wherein the tracking circuitry additionally introduces a delay in a change in the output signal in response to a change in the input signal. Timing compensation circuitry 180A, 180B may also be provided, to control the voltage on the output node in a manner to compensate for the delay introduced by the tracking circuitry.

In a testing device, a method for implementing automatic RF port testing. The method includes attaching a device under test having a plurality of RF pins to a load board, dynamically tuning a plurality of RF ports of the load board to the plurality of RF pins, and automatically matching the plurality of RF ports to the plurality of RF pins with respect to impedance. The method further includes implementing an RF port testing process on the device under test.

An apparatus is described. The apparatus includes a physically unclonable (PUF) circuit having a programmable input. The programmable input is to receive a value that caused the PUF circuit to strengthen its stability or strengthen its instability.

An electronic device includes a termination control circuit and a data input/output (I/O) circuit. The termination control circuit is configured to generate a termination enablement signal which is activated during a termination operation period for activating a termination resistor while a write operation is performed. In addition, the termination control circuit is configured to adjust a period that the termination enablement signal is activated according to whether a write command is inputted to the termination control circuit during a set detection period of the write operation. The data I/O circuit is configured to receive data by activating the termination resistor during a period that the termination enablement signal is activated when the write operation is performed.

A semiconductor storage device including an output pad, a first circuit connected to the output pad, a second circuit connected to the first circuit, a third circuit configured to output a first setting signal for controlling the first circuit accordance with a characteristic variation of the first circuit, and a fourth circuit configured to generate a second setting signal for controlling the second circuit in accordance with the first setting signal received from the third circuit and output the second setting signal to the second circuit.

A clock gating cell is provided. The clock gating cell includes an input stage and an output stage. The input stage receives a first clock signal and at least one input enable signal and generates a first enable signal corresponding to one of the least one input enable signal according to the first clock signal. The output stage is coupled to the input stage. The output stage receives the first enable signal and the first clock signal and generates a clock gating signal according to the first enable signal and the first clock signal. The input stage operates based on a first voltage threshold, and the output stage operates based on a second voltage threshold. The first voltage threshold is different from the second voltage threshold.

An asymmetrical I/O structure is provided. In one embodiment, the asymmetrical I/O structure comprises a first power supply node connected to a first voltage, a second power supply node connected to a second voltage, a pull-up unit and a pull-down unit which are connected between the first power supply node and the second power supply node. The first voltage is higher than the second voltage. A node between the pull-up unit and the pull-down unit is connected to an I/O node. The pull-up unit comprises one or more pull-up transistors, and the pull-down unit comprises one or more pull-down transistors. The number of the pull-up transistors is different from the number of the pull-down transistors.

A semiconductor integrated circuit includes: a main-interconnect to which supply voltage or reference voltage is applied; a plurality of sub-interconnects; a plurality of circuit cells configured to be connected to the plurality of sub-interconnects; a power supply switch cell configured to control, in accordance with an input control signal, connection and disconnection between the main-interconnect and the sub-interconnect to which a predetermined one of the circuit cells is connected, of the plurality of sub-interconnects; and an auxiliary interconnect configured to connect the plurality of sub-interconnects to each other.

Provided is a semiconductor device in which leakage current due to miniaturization of a semiconductor element is reduced and delay at a time of context switch of a multi-context PLD is reduced. A first transistor and a second transistor included in a charge retention circuit functioning as a configuration memory each include an oxide semiconductor in a semiconductor layer serving as a channel formation region. One of a source and a drain of the first transistor is electrically connected to a gate of the second transistor. One of a source and a drain of the second transistor is connected to a switch for context switch. In the switch used for context switch, electrostatic capacitance on an input side to which the one of the source and the drain of the second transistor is connected is larger than electrostatic capacitance on an output side.