A semiconductor substrate includes a buried semiconductor layer and semiconductor wells. A device for detecting a possible thinning of the semiconductor substrate via the rear face thereof is formed on and in the semiconductor wells. The device is a non-inverting buffer including an input terminal and an output terminal, the device being powered between a supply terminal and a reference terminal where the buried semiconductor layer provides the supply terminal. A control circuit delivers an input signal in a first state to the input terminal and outputs a control signal indicating a detection of a thinning of the substrate if a signal generated at the output terminal in response to the input signal is in a second state different from the first state.

A level shifter may include: a discharge circuit configured to receive an input signal on the basis of a first power supply voltage, and discharge an internal node on the basis of the input signal; a charge supply circuit configured to supply charge to an output node from which an output signal is outputted, on the basis of a second power supply voltage; and a voltage adjustment circuit including a first MOS transistor coupled between the internal node and the output node, and configured to adjust the voltage of the output node on the basis of a bias voltage applied to the first MOS transistor, and stop the operation of adjusting the voltage of the output node on the basis of the bias voltage, when the levels of the first and second power supply voltages are equal to each other.

A semiconductor apparatus may include: a command generation circuit configured to generate a first internal command signal and a second internal command signal, which are sequentially activated on the basis of a data command signal for a data driving operation; an impedance setting circuit enabled on the basis of the first internal command signal, and configured to set impedance into which a reference resistance is reflected; and a data driving circuit enabled on the basis of the second internal command signal, and configured to perform the data driving operation on the basis of the set impedance.

A power converter circuit includes a switch including a field effect transistor, the field effect transistor being a wide bandgap field effect transistor and being configured to maintain an on operational state responsive to a maintenance signal received through a gate terminal, a current sensing circuit that is configured to estimate a drain terminal current of the field effect transistor responsive to a voltage between the gate terminal of the field effect transistor and a source terminal of the field effect transistor, and a gate driving circuit that is configured to generate the maintenance signal responsive to the estimate of the drain terminal current.

A memory device includes a terminal calibration circuit having at least one of a pull-down circuit or a pull-up circuit used in calibrating an impedance of a data bus termination. The memory device also includes a reference calibration circuit configured to generate a calibration current. The terminal calibration circuit can be configured to program an impedance of the least one of a pull-down circuit or a pull-up circuit based on the calibration current.

The embodiments herein describe technologies for back-gate biasing of clock trees using a reference generator. A circuit includes a set of clock buffers and a programmable voltage reference generator to apply a voltage to a back gate of a transistor of the set of clock buffers.

An impedance calibration circuit, an impedance calibration method, and a memory are provided. The impedance calibration circuit includes a parameter module, an initial value generation module, and a calibration module. The parameter module is configured to perform environment detection processing and output an environment parameter signal; the initial value generation module is configured to receive the environment parameter signal, and output an initial calibration value based on the environment parameter signal when the calibration instruction signal is received; and the calibration module is configured to receive the initial calibration value, and perform impedance calibration processing based on the initial calibration value when the calibration instruction signal is received.

A comparator circuit according to this embodiment includes: a comparator element configured to output a matching signal indicating whether or not a value of a first input signal matches a value of a second input signal; a flip-flop circuit configured to hold a data of a data input terminal based on a comparator clock signal and configured to output an enable signal for stopping an operation of the comparator element; and an internal signal generation circuit configured to output an internal signal to the data input terminal based on the matching signal and an output signal output from the flip-flop circuit.

A comparator circuit according to the present embodiment: including a comparator element configured to output a matching signal indicating whether or not a value of a first input signal matches a value of a second input signal; a flip-flop circuit including a data input terminal to which a constant potential is supplied and a clock input terminal and configured to hold a value of the data input terminal based on a self-clock signal input to the clock input terminal; and a clock generation circuit configured to generate the self-clock signal based on the matching signal.

An enable control circuit and a semiconductor memory are provided. The enable control circuit includes: a counting circuit, configured to: count past clock cycles, and determine a clock cycle count value; a selection circuit, configured to determine a target clock cycle count value according to a first config signal; and a control circuit, connected to the counting circuit and the selection circuit, and configured to: control an On Die Termination (ODT) path to be in an enabled state responsive to a level state of an ODT pin signal being inverted, and start the counting circuit; and control the ODT path to switch from the enabled state to a disabled state when the clock cycle count value reaches the target clock cycle count value.