A semiconductor device includes a first chip having a first via and a second via through the first chip; and a second chip provided on the first chip and having a third via and a fourth via through the second chip. The first chip includes: a first logical operation circuit configured to perform a first logical operation (NOT) on a first address input signal to output a first address output signal to the second chip through the first via; a second logical operation circuit connected to the first logical operation circuit, the second logical operation circuit being configured to perform a second logical operation (XOR) on a second address input signal and the first address output signal to output a second address output signal to the second chip through the second via; and a first activation circuit connected to the second logical operation circuit, the first activation circuit being configured to activate the first chip based on at least the second address output signal.

A circuit configuration for a data processing system for predicting a coordinate for at least one operation to be carried out is provided, the prediction being connected to at least one input signal and being a function of a predefined first time value and at least one predefined first value which represents another physical variable. Upon each change of the at least one input signal, a second time value is calculated in each case from the first value, and to subtract the first time value from the second time value to form a third time value, and/or to calculate a second value from the first time value, and to subtract the first value from the second value to form a third value, in order to determine from the third time value and/or the third value a state in which the at least one operation is to be carried out.

A circuit configuration for a data processing system for predicting a coordinate for at least one operation to be carried out is provided, the prediction being connected to at least one input signal and being a function of a predefined first time value and at least one predefined first value which represents another physical variable. Upon each change of the at least one input signal, a second time value is calculated in each case from the first value, and to subtract the first time value from the second time value to form a third time value, and/or to calculate a second value from the first time value, and to subtract the first value from the second value to form a third value, in order to determine from the third time value and/or the third value a state in which the at least one operation is to be carried out.

A semiconductor device includes first, second and third stacked chips with a first, second and third substrate, respectively, at least three first, second and third logical circuits, respectively, and at least two first, second and third vias, respectively, and a fourth chip stacked on the third chip having a fourth substrate, and at least three fourth logical circuits. First and second ones of the first to third logical circuits of the first to fourth chips are each configured to perform a first and second logical operation, respectively, on a first and second address input signal, respectively, received at the respective chip to thereby output a first and second address output signal, respectively. Third ones are each configured to activate the respective chip based on at least the second address output signal transmitted within the respective chip.

A semiconductor device includes first, second and third stacked chips with a first, second and third substrate, respectively, at least three first, second and third logical circuits, respectively, and at least two first, second and third vias, respectively, and a fourth chip stacked on the third chip having a fourth substrate, and at least three fourth logical circuits. First and second ones of the first to third logical circuits of the first to fourth chips are each configured to perform a first and second logical operation, respectively, on a first and second address input signal, respectively, received at the respective chip to thereby output a first and second address output signal, respectively. Third ones are each configured to activate the respective chip based on at least the second address output signal transmitted within the respective chip.

A semiconductor device includes first, second and third stacked chips with a first, second and third substrate, respectively, at least three first, second and third logical circuits, respectively, and at least two first, second and third vias, respectively, and a fourth chip stacked on the third chip having a fourth substrate, and at least three fourth logical circuits. First and second ones of the first to third logical circuits of the first to fourth chips are each configured to perform a first and second logical operation, respectively, on a first and second address input signal, respectively, received at the respective chip to thereby output a first and second address output signal, respectively. Third ones are each configured to activate the respective chip based on at least the second address output signal transmitted within the respective chip.

A semiconductor device includes first, second and third stacked chips with a first, second and third substrate, respectively, at least three first, second and third logical circuits, respectively, and at least two first, second and third vias, respectively, and a fourth chip stacked on the third chip having a fourth substrate, and at least three fourth logical circuits. First and second ones of the first to third logical circuits of the first to fourth chips are each configured to perform a first and second logical operation, respectively, on a first and second address input signal, respectively, received at the respective chip to thereby output a first and second address output signal, respectively. Third ones are each configured to activate the respective chip based on at least the second address output signal transmitted within the respective chip.