An imaging element includes a photoelectric conversion section and a wiring layer. The photoelectric conversion section is configured to photoelectrically convert light incident from a subject. The wiring layer is provided on an opposite side of the subject with respect to the photoelectric conversion section and includes a wire connected to an element that constitutes a pixel including the photoelectric conversion section. The wire includes a plurality of wires extending long in a predetermined direction. The plurality of wires are arranged in a direction almost perpendicular to the predetermined direction in the wiring layer. The wire is provided with a protrusion protruding in a direction different from the predetermined direction.

The present technology relates to a solid-state imaging device that can reduce the number of steps and enhance mechanical strength, a method of manufacturing the solid-state imaging device, and an electronic apparatus. The solid-state imaging device includes a laminate including a first semiconductor substrate having a pixel region and at least one second semiconductor substrate having a logic circuit, the at least one second semiconductor substrate being bonded to the first semiconductor substrate such that the first semiconductor substrate becomes an uppermost layer, and a penetration connecting portion that penetrates from the first semiconductor substrate into the second semiconductor substrate and connects a first wiring layer formed in the first semiconductor substrate to a second wiring layer formed in the second semiconductor substrate. The first wiring layer is formed with Al or Cu. The present technology is applicable, for example, to a back-surface irradiation type CMOS image sensor.

A shooting method includes: in a state in which a remote connection for sharing a shooting preview interface is established with the second terminal, receiving and displaying a first preview interface of the second terminal sent by the second terminal; receiving a first input performed by a user; and outputting first target shooting data in response to the first input, where the first target shooting data includes partial or all image information of the first preview interface, and the first target shooting data is a video or an image.

A shooting method includes: in a state in which a remote connection for sharing a shooting preview interface is established with the second terminal, receiving and displaying a first preview interface of the second terminal sent by the second terminal; receiving a first input performed by a user; and outputting first target shooting data in response to the first input, where the first target shooting data includes partial or all image information of the first preview interface, and the first target shooting data is a video or an image.

A method of controlling pixels (134) of at least one spatial light modulator (114) is disclosed. The spatial light modulator (114) has a matrix of pixels (132). Each pixel (134) is individually controllable. The method comprises the following steps: receiving at least one image (331), (342); defining at least one image segment (333) within the image (331),(344); assigning at least one gray scale value to each image segment (333),(348); assigning at least one pixel (134) of the matrix of pixels (132) to each image segment (333),(350); assigning a unique modulation frequency to each gray scale value assigned to the at least one image segment (333),(352); controlling the at least one pixel (134) of the matrix of pixels (132) assigned to the at least one image segment (333) with the unique modulation frequency assigned to the respective image segment (333),(354).

A solid-state imaging device includes a first chip including a plurality of pixels, each pixel including a light sensing unit generating a signal charge responsive to an amount of received light, and a plurality of MOS transistors reading the signal charge generated by the light sensing unit and outputting the read signal charge as a pixel signal, a second chip including a plurality of pixel drive circuits supplying desired drive pulses to pixels, the second chip being laminated beneath the first chip in a manner such that the pixel drive circuits are arranged beneath the pixels formed in the first chip to drive the pixels, and a connection unit for electrically connecting the pixels to the pixel drive circuits arranged beneath the pixels.

The present invention relates to an observation system (10) of an environment, the observation system (10) comprising: a sensor (12) forming a synchronous stream of framed data, a first processing chain (14) including: a first reception unit (30) receiving the formed synchronous stream, and a first processing unit (32) comprising a first conversion block (34) converting the synchronous stream into event data, and a first calculation block (36) calculating first data from the event data a second processing chain (16) including a second processing unit (46) receiving a synchronous stream of framed data from the array (18) and the first data and obtaining second data relating to the environment as a function of the synchronous stream and the first data.

An image acquiring device, according to one embodiment, comprises: an optical image stabilization unit which compensates for hand trembling; and optical unit which is controlled in accordance with the result value compensated in the optical image stabilization unit; an image sensor unit which converts optical information output from the optical unit into an electric signal; and image information processing unit which image processes the electric signal in accordance with the compensated result value; and an image information output unit which displays the image-processed result, wherein the image sensor unit comprises a plurality of phase difference detection pixels, and a plurality of image detection pixels disposed in a grid pattern along with the plurality of phase difference detection pixels, and the plurality of phase difference detection pixels comprise a first pixel group having a certain area shielded, the certain area being among an area separated by being partitioned in the vertical direction, and a second pixel group having a certain area shielded, the certain area being among an area separated by being partitioned in the horizontal direction, and thus the accuracy of focus may be increased by using a phase difference detection auto focus (AF) method even when an optical image stabilizer (OIS) is being driven.

An image pickup apparatus according to the present invention includes a plurality of pixels arranged in rows and columns, and each of the pixels includes a photoelectric conversion unit that accumulates signal charge generated by photoelectric conversion of irradiated light, a first holding unit and a second holding unit that hold the signal charge transferred from the photoelectric conversion unit, and an output unit that outputs, to a column signal line, a signal based on an amount of the signal charge held by the first holding unit or the second holding unit. The first holding unit and the second holding unit alternately hold the signal charge generated in the photoelectric conversion unit for each frame period, and in a period in which the signal charge is not transferred from the photoelectric conversion unit, the first holding unit and the second holding unit output the signal charge to the output unit.

An image sensor is provided. The image sensor may include an active pixel electrically connected to a column line and configured to provide an output voltage to a pixel node and a bias circuit electrically connected between the pixel node and an earth terminal, and in which a first current flows through a first line electrically connected to the pixel node, wherein the bias circuit includes a first variable capacitor electrically connected to a power supply voltage, and a second variable capacitor electrically connected to the earth terminal, and the magnitude of the first current may be configured to vary based on a ratio of a capacitance of the first variable capacitor to a capacitance of the second variable capacitor. The output voltage may be configured to be adjusted based on the magnitude of the first current.