The present disclosure provides an ultrasonic transducer unit and a manufacturing method thereof. The ultrasonic transducer unit includes a substrate, a first electrode arranged on the substrate, an insulating layer arranged on the first electrode, a vibrating film arranged on the insulating layer, a closed cavity being between the vibrating film and the insulating layer, and a second electrode arranged on the vibrating film. The vibrating film is made of a photoresist. The ultrasonic transducer unit disclosed by the present disclosure adopts the photoresist as a material of the insulating layer and/or the vibrating film, so that the ultrasonic transducer unit with better performance can be obtained.

In accordance with embodiments of the present disclosure, a method for processing audio information in an audio device may include reproducing audio information by generating an audio output signal for communication to at least one transducer of the audio device, receiving at least one input signal indicative of ambient sound external to the audio device, detecting from the at least one input signal a near-field sound in the ambient sound, and modifying a characteristic of the audio information reproduced to the at least one transducer in response to detection of the near-field sound.

A microelectromechanical systems (MEMS) diaphragm assembly comprises a first diaphragm and a second diaphragm. A plurality of pillars connects the first and second diaphragms, wherein the plurality of pillars has a higher distribution density at a geometric center of the MEMS diaphragm assembly than at an outer periphery thereof.

A liquid-resistant acoustic assembly for an electronic device includes an acoustic device positioned in a housing, a gasket compressed between the acoustic device and the housing, and a liquid-resistant membrane. The liquid-resistant membrane is disposed such that it is isolated from a non-uniform compressive distribution resulting from compression of the gasket. The liquid-resistant membrane may be uncompressed by compression of the gasket or compressed by a different compressive force than the gasket. For example, the liquid-resistant membrane may not be positioned between the gasket and the acoustic device, may be separated from the gasket, may be mounted to a shelf of the gasket or within a gap defined by the gasket, mounted to a stiffener positioned within the gasket, and mounted using other similar configurations.

A liquid-resistant acoustic assembly for an electronic device includes an acoustic device positioned in a housing, a gasket compressed between the acoustic device and the housing, and a liquid-resistant membrane. The liquid-resistant membrane is disposed such that it is isolated from a non-uniform compressive distribution resulting from compression of the gasket. The liquid-resistant membrane may be uncompressed by compression of the gasket or compressed by a different compressive force than the gasket. For example, the liquid-resistant membrane may not be positioned between the gasket and the acoustic device, may be separated from the gasket, may be mounted to a shelf of the gasket or within a gap defined by the gasket, mounted to a stiffener positioned within the gasket, and mounted using other similar configurations.

Apparatus, and an associated method, for a PoC (Push-to-Talk over Cellular)-capable communication system. A user equipment PoC box is provided, and a corresponding network PoC box is also provided. A transport mechanism is defined and provided by which to communicate a PoC media burst that is delivered to a PoC box and stored thereat. Control functionality is provided by which to control disposition of the media burst, such as to make notification of a delivered media burst or to dispose of the media burst when no longer needed, is further provided.

An ultrasonic audio transducer system includes an ultrasonic speaker. The ultrasonic speaker may be an electrostatic emitter, a piezoelectric emitter (single crystal or stack), a piezoelectric film emitter, or any other emitter capable of emitting ultrasound. The ultrasonic speaker is configured to be coupled (via a wired or wireless connection) to an audio modulated ultrasonic carrier signal from an amplifier, wherein upon application of the audio modulated ultrasonic carrier signal, the ultrasonic speaker is configured to launch a pressure-wave representation of the audio modulated ultrasonic carrier signal into the air. Additionally, the ultrasonic speaker may be implemented with an impedance matching element or optimized for matching the response within a user's ear canal, and the ultrasonic audio transducer system may include The ultrasonic audio headphone system can further include a frequency mismatched microphone to avoid feedback when the microphone and the ultrasonic speaker are, e.g., proximately located.

A structure of micro-electro-mechanical systems (MEMS) electroacoustic transducer is disclosed. The MEMS electroacoustic transducer includes a substrate having a MEMS device region, a diaphragm having openings and disposed in the MEMS device region, a silicon material layer disposed on the diaphragm and sealing the diaphragm, and a conductive pattern disposed beneath the diaphragm in the MEMS device region. Preferably, a first cavity is also formed between the diaphragm and the substrate.

A structure of micro-electro-mechanical systems (MEMS) electroacoustic transducer is disclosed. The MEMS electroacoustic transducer includes a substrate having a MEMS device region, a diaphragm having openings and disposed in the MEMS device region, a silicon material layer disposed on the diaphragm and sealing the diaphragm, and a conductive pattern disposed beneath the diaphragm in the MEMS device region. Preferably, a first cavity is also formed between the diaphragm and the substrate.

A micro-electro-mechanical system (MEMS) device is provided. The MEMS device includes a substrate, a backplate disposed on a side of the substrate, a diaphragm, and a dynamic valve layer. The substrate forms an opening. The diaphragm is disposed on the side of the substrate and extends across the opening of the substrate, wherein the diaphragm forms a vent hole. The dynamic valve layer is disposed on the side of the substrate and includes a flap portion, wherein the flap portion covers at least a part of the vent hole when viewed in a direction perpendicular to the diaphragm, and the flap portion deforms when air flows through the vent hole.