The invention discloses a piezoelectric speaker, including a substrate with a cavity therethrough a supporting structure covering the cavity a first drive structure stacked on the supporting structure, including alternately stacked first electrode layers and first piezoelectric layers a transmission structure stacked on the first drive structure, and a separation slot penetrating the supporting structure and the first drive structure to separate the first drive structure into a first piezoelectric driving part and a second piezoelectric driving part. A rigidity of the transmission structure is less than or equal to a rigidity of the first drive structure, and the rigidity of the first drive structure is less than or equal to a rigidity of the supporting structure. Compared with the prior art, the sound pressure level generated at the same moment is higher.

Various embodiments of the present disclosure are directed towards a microelectromechanical systems (MEMS) device in which a slit at a movable mass of the MEMS device has a top notch slit profile. The MEMS device may, for example, be a speaker, an actuator, or the like. The slit extends through the movable mass, from top to bottom, and has a width that is uniform, or substantially uniform, from the bottom of the movable mass to proximate the top of movable mass. Further, in accordance with the top notch slit profile, top corner portions of the MEMS substrate in the slit are notched, such that a width of the slit bulges at the top of the movable mass. The top notch slit profile may, for example, increase the process window for removing an adhesive from the slit while forming the MEMS device.

Various embodiments of the present disclosure are directed towards a microelectromechanical systems (MEMS) device in which a slit at a movable mass of the MEMS device has a top notch slit profile. The MEMS device may, for example, be a speaker, an actuator, or the like. The slit extends through the movable mass, from top to bottom, and has a width that is uniform, or substantially uniform, from the bottom of the movable mass to proximate the top of movable mass. Further, in accordance with the top notch slit profile, top corner portions of the MEMS substrate in the slit are notched, such that a width of the slit bulges at the top of the movable mass. The top notch slit profile may, for example, increase the process window for removing an adhesive from the slit while forming the MEMS device.

A vibration device includes: a piezoelectric unit including a piezoelectric element; a housing that holds the piezoelectric unit; a wiring member electrically connected to the piezoelectric unit; and a joining member that joins the housing to an external device. The housing includes a bottom surface portion to which the piezoelectric unit is fixed, and a side surface portion standing at an edge portion of the bottom surface portion. The side surface portion has a first surface formed on a top portion of the side surface portion, and a second surface that is one step lowered from the first surface by a cutout portion formed in the top portion. The joining member extends along the first surface to bridge over the cutout portion. The wiring member is joined to the joining member at a position of the first surface, and passes through the cutout portion in a state where the wiring member is not joined to the second surface.

A vibration device includes: a piezoelectric unit including a piezoelectric element; a housing that holds the piezoelectric unit; a wiring member electrically connected to the piezoelectric unit; and a joining member that joins the housing to an external device. The housing includes a bottom surface portion to which the piezoelectric unit is fixed, and a side surface portion standing at an edge portion of the bottom surface portion. The side surface portion has a first surface formed on a top portion of the side surface portion, and a second surface that is one step lowered from the first surface by a cutout portion formed in the top portion. The joining member extends along the first surface to bridge over the cutout portion. The wiring member is joined to the joining member at a position of the first surface, and passes through the cutout portion in a state where the wiring member is not joined to the second surface.

A vibration device includes: a piezoelectric unit including a piezoelectric element; and a housing made of metal that holds the piezoelectric unit. The housing includes a bottom surface portion to which the piezoelectric unit is fixed, and side surface portions that stand at an edge portion of the bottom surface portion to surround the piezoelectric unit. The side surface portions are continuous with the bottom surface portion, and are inclined to open outward from the edge portion with respect to the bottom surface portion.

A vibration device includes: a piezoelectric unit including a piezoelectric element; and a housing made of metal that holds the piezoelectric unit. The housing includes a bottom surface portion to which the piezoelectric unit is fixed, and side surface portions that stand at an edge portion of the bottom surface portion to surround the piezoelectric unit. The side surface portions are continuous with the bottom surface portion, and are inclined to open outward from the edge portion with respect to the bottom surface portion.

The disclosure provides an electronic device including a substrate, a first vibrating unit, and a supporting unit. The substrate has a first surface. The first vibrating unit is disposed on the first surface and has a second surface. The second surface faces the first surface. The supporting unit is disposed between the substrate and the first vibrating unit. The first surface and the second surface are separated by a distance through the supporting unit. This distance ranges from equal to or greater than 0.06 mm to equal to or less than 65.4 mm.

The disclosure provides an electronic device including a substrate, a first vibrating unit, and a supporting unit. The substrate has a first surface. The first vibrating unit is disposed on the first surface and has a second surface. The second surface faces the first surface. The supporting unit is disposed between the substrate and the first vibrating unit. The first surface and the second surface are separated by a distance through the supporting unit. This distance ranges from equal to or greater than 0.06 mm to equal to or less than 65.4 mm.

A bone conduction speaker includes a housing, a vibration board and a transducer. The transducer is located in the housing, and the vibration board is configured to contact with skin and pass vibration. At least one sound guiding hole is set on at least one portion of the housing to guide sound wave inside the housing to the outside of the housing. The guided sound wave interfaces with the leaked sound wave, and the interfacing reduces a sound pressure level of at least a portion of the leaked sound wave. A frequency of the at least a portion of the leaked sound wave is lower than 4000 Hz.