This disclosure provides systems, methods, and apparatus related to acoustic transducers.

This disclosure provides systems, methods, and apparatus related to an ultrasonic microphone and an ultrasonic acoustic radio. In one aspect a system includes a transmitter and a receiver. The receiver comprises a membrane. The membrane comprises a single layer or multiple layers of a two-dimensional material. The receiver is operable to receive sound waves in a frequency range, with the frequency range being the ultrasonic frequency range.

A MEMS sensor includes a sensor package and a membrane arranged in the sensor package, wherein a first partial volume of the sensor package adjoins a first main side of the membrane and a second partial volume of the sensor package adjoins a second main side of the membrane, wherein the second main side is arranged opposite the first main side. The MEMS sensor includes a first opening in the sensor package, said first opening connecting the first partial volume to an external environment of the sensor package in an acoustically transparent fashion. The MEMS sensor includes a second opening in the sensor package, said second opening connecting the second partial volume to the external environment of the sensor package in an acoustically transparent fashion.

A diaphragm for use in a transducer, the diaphragm including a flexible layer configured to deflect in response to changes in a differential pressure. The flexible layer includes a lattice grid. The lattice grid includes a first plurality of substantially elongate openings oriented along an axis and a second plurality of substantially elongate openings extending generally parallel to the axis. The second plurality of openings is substantially offset from the first plurality of openings in a direction substantially parallel to the axis. The first plurality of openings and the second plurality of openings define a first plurality of spaced apart grid beams extending between and substantially parallel to the axis and a second plurality of spaced apart grid beams extending substantially perpendicular to the axis. The second plurality of grid beams is configured to connect adjacent ones of the first plurality of grid beams.

A semiconductor package device and a method of manufacturing a semiconductor package device are provided. The semiconductor package device includes a substrate, a first electronic component, and an encapsulation layer. The substrate has a first surface, a second surface opposite to the first surface, and a first opening extending from the first surface to the second surface. The first electronic component is disposed on the first surface of the substrate. The encapsulation layer is formed on the second surface of the substrate. The encapsulation layer includes a chamber connected to the first opening, and a width of the first opening is smaller than a width of the chamber.

The present invention provides a general MEMS device having a pair of quadrilateral insert and trench. An air channel/space includes a first internal wall and a second internal wall for air to flow between. A quadrilateral trench is recessed from the first internal wall, and a quadrilateral insert is extended from the second internal wall and inserted into the trench. In capacitive MEMS microphone, the spatial relationship between the insert and the trench can vary or oscillate. The quadrilateral insert & trench serve as an air flow restrictor or a leakage prevention structure which keeps the sound frequency response plot of the microphone flatter in the range of 20 Hz to 1000 Hz. The level of the air resistance may be controlled e.g. by the depth of quadrilateral trench/slot etched on the substrate.

Electroacoustic devices with a capacitive element and methods for fabricating such electroacoustic devices. An example method includes forming an acoustic device above a first region of a substrate, and forming a capacitive element above a second region of the substrate and adjacent to the acoustic device. The forming of the capacitive element may include forming a protective layer above the substrate where a first portion of the protective layer is above the second region of the substrate and a second portion of the protective layer is above the first region of the substrate, forming a dielectric region above the protective layer, and forming an electrode above the dielectric region. The dielectric region may include a different material than the protective layer.

An acoustic transducer comprises a transducer substrate, and an aperture having a non-circular perimetral shape defined through the transducer substrate. A diaphragm is disposed on the transducer substrate and coupled to a surface of the transducer substrate via at least one diaphragm anchor such that a gap is defined between the diaphragm and the transducer substrate, and an outer periphery of the diaphragm extends radially outwards of a rim of the aperture such that a portion of the diaphragm overhangs the aperture.

An internal failure detection method of an external failure detection system for industrial equipment, the external failure detection system including an array of transducers, the method including: (a) receiving a plurality of signals, each signal being measured by a corresponding transducer of the transducers array; (b) for each pair of transducers among a number of pairs of transducers, calculating at least one value of a correlation parameter between the pair of signals received at step (a) at the pair of transducers, by correlating at least part of the signals or of invertible transforms thereof; (c) for at least one transducer among the number of pairs of transducers, estimating from the values of the correlation parameters calculated at step (b) if the transducer is working properly.

The present invention provides a capacitive microphone including a MEMS microphone. In the microphone, a movable or deflectable membrane/diaphragm moves in a lateral manner relative to a fixed backplate, instead of moving toward/from the fixed backplate. The fixed backplate includes an electrical insulator sandwiched between two sub-conductors to cancel systematic/background noise. The squeeze film damping is substantially avoided, and the performance, such as signal to noise ratio, of the microphone is significantly improved.