A transducer in which electrical connections between electrode sheets and leading wires can be secured via an approach other than soldering or welding is provided. In a sheet body portion, a dielectric layer and a first electrode sheet are joined by a first main fusion layer formed of a fusion material. A first conductive portion of a first leading wire is fixed to the sheet body portion by a first clamp. The first clamp includes a plurality of first leg portions that penetrates the sheet body portion in a thickness direction, a first coupling portion that couples the proximal ends of the plurality of first leg portions and is disposed across the first conductive portion, and a plurality of first bent-back portions that is formed by bending the respective distal ends of the plurality of first leg portions and is locked with a second surface of the sheet body portion.

A transducer in which electrical connections between electrode sheets and leading wires can be secured via an approach other than soldering or welding is provided. In a sheet body portion, a dielectric layer and a first electrode sheet are joined by a first main fusion layer formed of a fusion material. A first conductive portion of a first leading wire is fixed to the sheet body portion by a first clamp. The first clamp includes a plurality of first leg portions that penetrates the sheet body portion in a thickness direction, a first coupling portion that couples the proximal ends of the plurality of first leg portions and is disposed across the first conductive portion, and a plurality of first bent-back portions that is formed by bending the respective distal ends of the plurality of first leg portions and is locked with a second surface of the sheet body portion.

A method of fabricating a micro-electrical-mechanical system (MEMS) transducer chip scale package. The method comprising: providing (101) a front side pre-fabricated semiconductor die wafer (1) comprising a plurality of individual die that each comprise at least a MEMS transducer. And back etching (104) the semiconductor die wafer (1) at the back side (4) of the semiconductor die wafer (1) by etching an acoustic die channel (5) through each respective die of the plurality of die and etching a die back volume (6) into each respective die of the plurality of die. The semiconductor die wafer (1) is capped with a cap wafer (16) such that a wafer level packaged MEMS transducer wafer is provided containing multiple MEMS transducer chip scale packages.

A MEMS transducer package (1) comprises a semiconductor die element (3) and a cap element (23). The semiconductor die element (3) and cap element (23) have mating surfaces (9, 21). The semiconductor die element (3) and cap element (23) are configured such that when the semiconductor die element (3) and cap element (4) are conjoined, a first volume (7, 27) is formed through the semiconductor die element (3) and into the semiconductor cap element (23), and an acoustic channel is formed to provide an opening between a non-mating surface (11) of the semiconductor die element (3) and either a side surface (10, 12) of the transducer package or a non-mating surface (29) of the cap element (23).

A MEMS transducer package (1) is provide having a semiconductor die portion (3) with a thickness bounded by a first surface (9) and an opposite second surface (11). The package further has a transducer element (13) incorporated in the second surface (11) and a die back volume (7) that extends through the thickness of the semiconductor die portion (3) between the first surface (9) and the transducer element (13). The package is completed by a cap portion (23) that abuts the semiconductor die portion (3) at the first surface (9).

A MEMS transducer package (1) comprises a semiconductor die element (3) and a cap element (23). The semiconductor die element (3) and cap element (23) have mating surfaces (9, 21). The semiconductor die element (3) and cap element (23) are configured such that when the semiconductor die element (3) and cap element (4) are conjoined, a first volume (7, 27) is formed through the semiconductor die element (3) and into the semiconductor cap element (23), and an acoustic channel is formed to provide an opening between a non-mating surface (11) of the semiconductor die element (3) and a side surface (10, 12) of the transducer package.

Acoustic emission (AE) microelectromechanical system (MEMS) transducers of the present disclosure utilize a spring-mass system and a capacitance-change transduction principle. The transducers include a dielectric layer between a fixed electrode and a moveable metal layer to reduce the stiction failure. The moveable metal layer may displace in a particular direction when interacting with elastic waves. Additionally, the moveable metal layer may be formed using an electroplating technique. In some embodiments, multiple spring-mass unit cells may be combined in parallel to increase the sensitivity of the transducer.

Acoustic emission (AE) microelectromechanical system (MEMS) transducers of the present disclosure utilize a spring-mass system and a capacitance-change transduction principle. The transducers include a dielectric layer between a fixed electrode and a moveable metal layer to reduce the stiction failure. The moveable metal layer may displace in a particular direction when interacting with elastic waves. Additionally, the moveable metal layer may be formed using an electroplating technique. In some embodiments, multiple spring-mass unit cells may be combined in parallel to increase the sensitivity of the transducer.

In one embodiment, acoustic devices are formed on a substrate which is then placed on a first HAF layer, a screen, and a second HAF layer. The layers of HAF each have apertures aligned with acoustic ports of the devices. The substrate is heated such that the first layer of HAF adheres to the substrate and the screen and the second layer of HAF adheres to the screen. The substrate is cut to separate the devices into modules. In other embodiments, a waterproof membrane covering the acoustic port of an acoustic module may be bonded to a screen to form a gap such that it moves under pressure until restrained by the screen. In still other embodiments, back volume covers for acoustic devices are formed by stacking and heating a first HAF layer, a glass-reinforced epoxy laminate layer, a second HAF layer, and a top layer on a substrate.

A MEMS microphone is provided, comprising a substrate having a back cavity, and a plate capacitor structure arranged on the substrate, the plate capacitor structure being formed by a vibration diaphragm, a backplate and a support portion; wherein a pressure relief device is provided in the vibration diaphragm, a pressure maintaining channel is formed between the vibration diaphragm and the backplate; and the pressure relief device in the vibration diaphragm constitutes an inlet of the pressure maintaining channel.