This invention provides a method for mounting an electroacoustic component on a PCB and an electroacoustic component structure, so as to improve the problem that the traditional electroacoustic component affects the electrical characteristics due to the high temperature baking action in a reflow oven. The method comprises a step of separating and constructing a housing of the electroacoustic component. The housing comprises a shell seat and a base seat, the shell seat is provided with a plurality of sound producing components, and the base seat is provided with at least two conducting terminals for adhering the base seat to the PCB. The conducting terminals on the base seat and the at least two contacts on the PCB are adhered to each other and electrically connected in the reflow oven, and then the shell seat and the base seat are combined to make the shell seat and the base seat with the PCB combined outside the reflow oven into a single body to form an electroacoustic component that is mounted on the PCB.

A capacitive transducer or microphone includes a first substrate of one or more layers and which includes a first surface, a first cavity in the first surface, and a mesa diaphragm that spans the first cavity. The capacitive transducer or microphone includes a second substrate fixed to the first substrate. The second substrate has one or more layers which includes a second cavity having a nonplanar (e.g., contoured or structured or stepped) bottom surface that faces the mesa diaphragm. A shape or relief of the bottom surface of the cavity may advantageously be, to at least some degree, complementary to a deformed shape of the diaphragm. The second substrate may include one or more acoustic holes, non-uniformly distributed thereacross. One or more vents may vent the second cavity.

The present disclosure provides a display panel, a fabricating method and a control method thereof and a display device. Display panel includes a display assembly and sound generation assemblies. Display assembly includes a display assembly substrate and pixel components disposed on a side of display assembly substrate. Each sound generation assembly includes a vibrating membrane, an exciter, and a support structure. Support structure is disposed on a side of vibrating membrane and has a cavity. Exciter includes a motion part in contact with vibrating membrane and a drive part disposed in cavity. Drive part drives motion part to vibrate, and motion part vibrates to drive vibrating membrane to vibrate. Display assembly substrate and vibrating membrane are the same structure, and pixel components are disposed on a side of vibrating membrane facing away from support structure. Display device includes the display panel above.

A preparation method for a micro-electromechanical systems (MEMS) microphone includes the steps of: providing a silicon substrate having a silicon surface; forming an enclosed cavity in the silicon substrate; forming a plurality of spaced apart acoustic holes in the silicon substrate, each acoustic hole having two openings, one of which communicating with the cavity and the other one located on the silicon surface; forming a sacrificial layer on the silicon substrate, which includes a first filling portion, a second filling portion and a shielding portion; forming a polysilicon layer on the shielding portion; forming a recess in the silicon substrate on the side away from the silicon surface; and removing the first filling portion, the second filling portion and part of the shielding portion so that the recess is brought into communication with the cavity to form a back chamber, and that the polysilicon layer, the remainder of the shielding portion and the silicon substrate together delimit a hollow chamber, the hollow chamber communicating with the opening of the plurality of acoustic holes away from the cavity, completing the MEMS microphone.

A sound producing package structure includes a first sub-package structure and a second sub-package structure. The first sub-package structure includes a first substrate having a first opening and a first chip including a first membrane, wherein a first cavity is formed between the first membrane and the first substrate. The first sub-package structure and the second sub-package structure are stacked, and the second sub-package structure includes a second substrate and a second chip. The second substrate is connected to the first substrate and has a second opening. The second chip includes a second membrane, wherein a second cavity is formed between the second membrane and the second substrate. A gap, connected to the first opening and the second opening, is formed between the first substrate and the second substrate, such that an ambient of the sound producing package structure, the first cavity and the second cavity are connected.

A system and method for creating a sealed enclosure for a loudspeaker in a vehicle body portion of a vehicle are provided, the vehicle body portion including an inner body panel having a first internal surface and an outer body panel having a second internal surface, wherein the inner body panel and the outer body panel are spaced apart to define a cavity therebetween. The system includes at least one insert member arranged to be received within the cavity and coupled to the first internal surface and the second internal surface to partition the cavity and create the sealed enclosure for the loudspeaker.

A system and method for creating a sealed enclosure for a loudspeaker in a vehicle body portion of a vehicle are provided, the vehicle body portion including an inner body panel having a first internal surface and an outer body panel having a second internal surface, wherein the inner body panel and the outer body panel are spaced apart to define a cavity therebetween. The system includes at least one insert member arranged to be received within the cavity and coupled to the first internal surface and the second internal surface to partition the cavity and create the sealed enclosure for the loudspeaker.

An integrated structure of a MEMS microphone and an air pressure sensor, and a fabrication method for the integrated structure, the structure including a base substrate; a vibrating membrane, back electrode, upper electrode, and lower electrode formed on the base substrate, as well as a sacrificial layer formed between the vibrating membrane and the back electrode and between the upper electrode and the lower electrode; a first integrated circuit electrically connected to the vibrating membrane and the back electrode respectively; and a second integrated circuit electrically connected to the lower electrode and the upper electrode respectively, wherein a region of the base substrate corresponding to the vibrating membrane is provided with a back cavity; the sacrificial layer between the vibrating membrane and the back electrode is hollowed out to from a vibrating space that communicates with the exterior of the integrated structure, and the sacrificial layer between the upper electrode and the lower electrode is hollowed out to form a closed space; and the integrated circuits are formed on a chip, thereby reducing the interference of connection lines on the performance of a microphone, reducing the introduction of noise, reducing the size of a product and reducing power consumption.

An integrated structure of a MEMS microphone and an air pressure sensor, and a fabrication method for the integrated structure, the structure including a base substrate; a vibrating membrane, back electrode, upper electrode, and lower electrode formed on the base substrate, as well as a sacrificial layer formed between the vibrating membrane and the back electrode and between the upper electrode and the lower electrode; a first integrated circuit electrically connected to the vibrating membrane and the back electrode respectively; and a second integrated circuit electrically connected to the lower electrode and the upper electrode respectively, wherein a region of the base substrate corresponding to the vibrating membrane is provided with a back cavity; the sacrificial layer between the vibrating membrane and the back electrode is hollowed out to from a vibrating space that communicates with the exterior of the integrated structure, and the sacrificial layer between the upper electrode and the lower electrode is hollowed out to form a closed space; and the integrated circuits are formed on a chip, thereby reducing the interference of connection lines on the performance of a microphone, reducing the introduction of noise, reducing the size of a product and reducing power consumption.

Hearing aid devices, methods of manufacture, methods of use, and kits are provided. In certain aspects, the hearing aid devices comprise an apparatus having a transducer and a retention structure comprising a shape profile corresponding to a tissue of the user, and a layer of elastomer.