A package structure of a micro speaker is provided. The package structure includes a substrate, a diaphragm, a coil, an etch stop layer, a carrier board, a permanent magnetic element, and package lid. The substrate has a hollow chamber. The diaphragm is suspended over the hollow chamber. The coil is embedded in the diaphragm. The etch stop layer is positioned below the coil and overlaps the coil in the direction that is perpendicular to the top surface of the diaphragm. The etch stop layer is made of a metal material. The carrier board is disposed on the bottom surface of the substrate. The permanent magnetic element is disposed on the carrier board and in the hollow chamber. The package lid is wrapped around the substrate and the diaphragm, and has a lid opening that exposes a portion of the top surface of the diaphragm.

Disclosed are a MEMS microphone structure and a manufacturing method thereof. More particularly, a MEMS microphone structure and a manufacturing method thereof are disclosed, including a plurality of diaphragms and a plurality of back plates configured alternately in a vertical direction so that the areas of the diaphragms and the back plates are maximized within a limited area, thereby improving overall sensitivity.

Disclosed are a MEMS microphone structure and a manufacturing method thereof. More particularly, a MEMS microphone structure and a manufacturing method thereof are disclosed, including a plurality of diaphragms and a plurality of back plates configured alternately in a vertical direction so that the areas of the diaphragms and the back plates are maximized within a limited area, thereby improving overall sensitivity.

A method for manufacturing a microelectromechanical systems (MEMS) microphone comprises depositing a membrane on a first sacrificial layer, wherein the first sacrificial layer is deposited on a substrate, etching the substrate to define a cavity, releasing the membrane by removing at least the first sacrificial layer, and forming at least one anchor at the edge of the membrane.

A method for manufacturing a loudspeaker vibrating membrane with hard and elastic soft properties, comprising: (a) adhering a curable polymer to all areas on the outer surface of a base material; (b) drying the curable polymer to form a hard structure; (c) forming a loudspeaker vibrating membrane; and (d) separating the loudspeaker vibrating membrane from the base material. The method further comprises the following steps between steps (b) and (c) or steps (c) and (d), or after step (d): (e) adhering an elastic soft polymer to all or partial areas on the outer surface of the hard structure; and (f) drying the elastic soft polymer to form an elastic soft structure covering all or partial areas on the outer surface of the hard structure. In the present invention, the hardness and elastic coefficient of the loudspeaker vibrating membrane can be adjusted by the hard structure and the elastic soft structure.

Various embodiments of the present disclosure are directed towards a microelectromechanical systems (MEMS) device in which a slit at a movable mass of the MEMS device has a top notch slit profile. The MEMS device may, for example, be a speaker, an actuator, or the like. The slit extends through the movable mass, from top to bottom, and has a width that is uniform, or substantially uniform, from the bottom of the movable mass to proximate the top of movable mass. Further, in accordance with the top notch slit profile, top corner portions of the MEMS substrate in the slit are notched, such that a width of the slit bulges at the top of the movable mass. The top notch slit profile may, for example, increase the process window for removing an adhesive from the slit while forming the MEMS device.

Presented herein are contaminant-proof microphone assemblies for use with devices/apparatuses, such as auditory prostheses, that include one or more microphones disposed within a housing. A contaminant-proof microphone assembly in accordance with certain embodiments presented herein includes a microphone, a microphone plug, and a contaminant-proof membrane. The microphone plug has a first end coupled to the microphone and a second end that is configured to be positioned adjacent the contaminant-proof membrane. As such, the microphone plug is disposed between a sound inlet of the microphone and the contaminant-proof membrane. The microphone plug may be configured to mate with the housing or a gasket attached to the housing.

Presented herein are contaminant-proof microphone assemblies for use with devices/apparatuses, such as auditory prostheses, that include one or more microphones disposed within a housing. A contaminant-proof microphone assembly in accordance with certain embodiments presented herein includes a microphone, a microphone plug, and a contaminant-proof membrane. The microphone plug has a first end coupled to the microphone and a second end that is configured to be positioned adjacent the contaminant-proof membrane. As such, the microphone plug is disposed between a sound inlet of the microphone and the contaminant-proof membrane. The microphone plug may be configured to mate with the housing or a gasket attached to the housing.

A MEMS microphone includes a substrate, a diaphragm disposed over the substrate to cover the cavity, the diaphragm defining an air gap together with the back plate, and the diaphragm being spaced apart from the substrate, a back plate disposed over the diaphragm and in the vibration area, an upper insulation layer to cover the back plate, a plurality of chamber portions provided in the supporting area, a lower insulation layer provided under the upper insulation layer and on the substrate, and an intermediate insulation layer provided between the lower insulation layer and the upper insulation layer and disposed further from the vibration area than the chamber portions.

A MEMS microphone includes a substrate, a diaphragm disposed over the substrate to cover the cavity, the diaphragm defining an air gap together with the back plate, and the diaphragm being spaced apart from the substrate, a back plate disposed over the diaphragm and in the vibration area, an upper insulation layer to cover the back plate, a plurality of chamber portions provided in the supporting area, a lower insulation layer provided under the upper insulation layer and on the substrate, and an intermediate insulation layer provided between the lower insulation layer and the upper insulation layer and disposed further from the vibration area than the chamber portions.